公开(公告)号：KR1020080065455A

公开(公告)日：2008-07-14

申请号：KR1020070002604

申请日：2007-01-09

Applicant: 삼성전자주식회사

Inventor： 구태형 ,  조규철 ,  김희성 ,  최수열 ,  한신혁 ,  박숙현 ,  차혜진 ,  주현희

IPC: H01L21/304

Abstract: An apparatus for polishing a substrate is provided to reduce the quantity of used slurry by adjusting the flow of slurry. A substrate maintaining hole for receiving a substrate is formed in a substrate carrier(10). A first platen is disposed to confront one surface of the substrate carrier. A first polishing pad is attached to one surface of the first platen confronting one surface of the substrate carrier. A slurry supply apparatus supplies slurry to one surface of the substrate. A first flow path through which the slurry flows is formed in one surface of the substrate carrier confronting the first platen. The first flow path can be of a radial shape extended from the center of the substrate carrier to the edge of the substrate carrier.

Abstract translation: 提供一种用于抛光基底的装置，通过调节浆料的流动来减少使用的浆料的量。 在衬底载体（10）中形成用于接收衬底的衬底维持孔。 第一压板被设置成面对衬底载体的一个表面。 第一抛光垫附接到面对基板载体的一个表面的第一压板的一个表面。 浆料供给装置将浆料供给到基板的一个表面。 浆料流过的第一流动路径形成在与第一压板相对的基板载体的一个表面中。 第一流路可以是从基板载体的中心延伸到基板载体的边缘的径向形状。

公开(公告)号：KR1020080072989A

公开(公告)日：2008-08-08

申请号：KR1020070011385

申请日：2007-02-05

Applicant: 삼성전자주식회사

Inventor： 한신혁 ,  구태형 ,  김희성 ,  주현희 ,  차혜진 ,  최수열

IPC: H01L21/304

Abstract: A wafer grinding apparatus and a wafer grinding wheel are provided to improve a flatness of a wafer by arranging plural wheel blades, which are ring shape, on the grinding wheel. When a wafer is loaded, a chuck table(10) sucks the wafer(12) and rotates the wafer at a constant speed. A spindle assembly(20) is separated from the chuck table in an upward direction and selectively rotated or lowered, such that the wafer is ground. The spindle assembly includes a driving unit(22) and a grinding wheel(24). The driving unit lowers the spindle assembly, such that the spindle assembly is contacted with the wafer. The grinding wheel grinds the wafer to a predetermined thickness. The grinding wheel includes a wheel body, a first wheel blade, and a second wheel blade. The first wheel blade is arranged along an edge portion of the wheel body in a circular shape. The second wheel blade is arranged to be apart from the first wheel blade in an inward direction.

Abstract translation: 提供晶片研磨装置和晶片磨轮，通过在砂轮上布置环状的多个叶片来提高晶片的平坦度。 当加载晶片时，卡盘台（10）吸取晶片（12）并以恒定的速度旋转晶片。 主轴组件（20）在向上方向上与卡盘台分离并选择性地旋转或降低，使得晶片被研磨。 主轴组件包括驱动单元（22）和砂轮（24）。 驱动单元降低主轴组件，使得主轴组件与晶片接触。 研磨轮将晶片研磨成预定厚度。 砂轮包括轮体，第一轮叶片和第二轮叶片。 第一轮叶片沿轮体的边缘部分呈圆形排列。 第二轮叶片被布置成在向内的方向上与第一轮叶片分开。

公开(公告)号：KR1020070059259A

公开(公告)日：2007-06-12

申请号：KR1020050117908

申请日：2005-12-06

Applicant: 삼성전자주식회사

Inventor： 구태형 ,  조규철 ,  김희성 ,  한신혁 ,  주현희 ,  김연숙

IPC: H01L21/68

CPC classification number: H01L21/67742 ,  H01L21/67242 ,  H01L21/68707

Abstract: A semiconductor substrate transferring apparatus is provided to safely transfer the semiconductor substrate along a set path and accurately guide the substrate on a set portion of substrate processing equipment. A blade(130) extends from a transfer arm(120) for transferring a semiconductor substrate, and supports the semiconductor substrate in a horizontal direction. A light emitting part(140) is disposed on one side of the blade to illuminate light in a horizontal direction crossing a transfer path of the semiconductor substrate. A light receiving part(150) is disposed opposite to the light emitting part to generate an electric signal according to the light interfered or illuminated by passage of the semiconductor substrate. A drive part(110) adjusts an angle of the blade.

Abstract translation: 半导体衬底传送装置被设置为沿着设定路径安全地传送半导体衬底，并且将衬底精确地引导到衬底处理设备的设置部分上。 刀片（130）从用于传送半导体衬底的传送臂（120）延伸，并且在水平方向上支撑半导体衬底。 发光部分（140）设置在叶片的一侧上以照射与半导体衬底的传送路径交叉的水平方向的光。 光接收部分（150）与发光部分相对设置，以根据半导体衬底通过的干扰或照亮的光产生电信号。 驱动部分（110）调节叶片的角度。

公开(公告)号：KR1020170083384A

公开(公告)日：2017-07-18

申请号：KR1020160002779

申请日：2016-01-08

Applicant: 삼성전자주식회사

Inventor： 김종수 ,  최삼종 ,  구태형 ,  김수련 ,  김청준 ,  유지원 ,  주현희

IPC: H01L23/544 ,  H01L21/68 ,  H01L21/324 ,  H01L21/66

CPC classification number: H01L23/562 ,  H01L21/02013 ,  H01L21/02021 ,  H01L21/02035 ,  H01L21/0262 ,  H01L21/324 ,  H01L22/12 ,  H01L23/544 ,  H01L2223/54426 ,  H01L2223/54493

Abstract: 본발명의기술적사상의일 실시예에의한반도체웨이퍼는서로반대되는제1 면과제2 면을가지는웨이퍼몸체, 상기웨이퍼몸체의외주로부터상기웨이퍼몸체의중심부를향하여형성된개구를구비한노치부, 상기웨이퍼몸체의외주를따라형성되며, 상기제1 면과제2 면을연결하는제1 경사면을포함하고, 상기제1 면과상기제1 경사면이만나는제1 지점으로부터상기제2 면과상기제1 경사면이만나는제2 지점까지연장된직선에대하여제1 높이를가지는제1 베벨부, 및상기개구와접하도록배치되고, 상기제1 면과제2 면을연결하는제2 경사면을포함하고, 상기제1 면과상기제2 경사면이만나는제3 지점으로부터상기제2 면과상기제2 경사면이만나는제4 지점까지연장된직선에대하여상기제1 높이와상이한제2 높이를가지는제2 베벨부를포함한다.

Abstract translation: 根据本发明实施例的半导体晶片包括具有两个相对的第一表面任务的晶片本体，具有从晶片本体的外周朝向晶片本体的中心形成的开口的切口部分， 其中，所述第一斜面沿所述晶圆本体的外围形成并包括将所述第一表面的两个表面连接至所述第一斜面的第一倾斜表面， 第一倾斜部分具有相对于延伸至第二点的直线的第一高度和与所述开口接触布置且连接所述第一表面任务的两个表面的第二倾斜部分， 并且具有相对于从第二倾斜表面与第二表面相交的第三点延伸到第四倾斜表面的直线具有与第一高度不同的第二高度的第二斜面部分。