Abstract:
A plasma generation apparatus is provided to improve uniformity of a surface processing of an object by ejecting plasma into an ejection hole which is arranged uniformly. A plasma generation apparatus includes a power terminal(20), a first ground terminal(30), a first dielectric body(50), a second ground terminal(40), and an ejection hole(70). A high frequency voltage is applied to the power terminal. The first ground terminal is arranged to be opposite to the power terminal, and is grounded. The first dielectric body is located between the power terminal and the first ground terminal, and electrically insulates the power terminal from the first ground terminal. The second ground terminal is arranged to be apart from a lower part of the first ground terminal and the power terminal. The second ground terminal is grounded. The ejection hole is formed to be penetrated by the second ground terminal.
Abstract:
A method for fabricating a TFT substrate is provided to avoid a skew phenomenon of a source/drain electrode by forming the source/drain electrode by a dry etch process. A gate interconnection, a gate insulation layer, an active layer, a conductive layer for a data interconnection, and a photoresist pattern composed of first and second regions are sequentially formed on an insulation substrate(10). By using the photoresist pattern as an etch mask, the conductive layer for the data interconnection is etched to form a conductive pattern for a source/drain electrode(65,66) and a data line(62). By using the photoresist pattern as an etch mask, the active layer is etched to form an active layer pattern. The second region of the photoresist pattern is removed. By employing etch gas and using the photoresist pattern as an etch mask, the conductive layer pattern for the source/drain electrode under the second region is dry-etched. A part of the active layer pattern is etched by using the photoresist pattern as an etch mask. Reaction byproducts of the conductive layer pattern for the source/drain electrode are physically removed by a reaction byproducts removing agent so that external force is applied to the etch gas and the reaction byproducts. The photoresist pattern is stripped, and a passivation layer(70) and a pixel electrode are formed.
Abstract:
A display panel, a display device and a manufacturing method thereof are provided to use an electrode of the display device as a polarizing panel, thereby removing the polarizing panel arranged at the rear of the display panel and simplifying the processes. A gate line is formed on a substrate. A gate insulating layer is formed on the substrate to cover the gate line. A data line is crossed with the gate line and includes a source electrode. A drain electrode(175) is located oppositely to the source electrode. Plural line patterns(193) are electrically connected with the drain electrode and polarizes the incidence light beam. The distance of line patterns is below 200 nanometer. The width of the line pattern is below 100 nanometer. An alignment layer is formed on the electrode. The electrode includes at least one among Al, Ag, Cu, Mo, Cr, Ta, Ti or alloy thereof. The gate insulating layer includes an opened pixel area.
Abstract:
표시 화면의 잔상을 개선하기 위한 표시 기판이 개시된다. 표시 기판은 제1 금속패턴으로 형성된 게이트 배선으로부터 연장된 게이트 전극과, 제2 금속패턴으로 형성된 소스 배선으로부터 연장된 소스 전극과, 제2 금속패턴으로 형성되고 소스 전극과 일정한 이격 거리를 갖는 드레인 전극과, 드레인 전극과 연결되어 드레인 전극과 화소 전극을 전기적으로 연결시키는 연결 패턴 및 연결 패턴의 하부에 형성되어 상기 연결 패턴을 커버하는 실딩 패턴을 포함한다. 실딩 패턴이 연결 패턴으로 조사되는 배면광을 차단시키므로 누설광 및 광 누설 전류의 발생이 감소된다. 이에 따라, 광 누설 전류로 인한 표시 화면의 잔상 발생을 개선할 수 있다. 광 누설 전류, 실딩 패턴, 4매 공정, 알루미늄 배선
Abstract:
A flexible display panel according to an embodiment of the present invention includes a flexible substrate, a gate line formed on the substrate and including a gate electrode, a gate insulating layer formed on the substrate, a semiconductor layer formed on the gate insulating layer and disposed substantially on the entire gate electrode, a source electrode and a drain electrode formed on the semiconductor layer, and a pixel electrode connected to the drain electrode. The patterning of the semiconductor layer to form a second semiconductor member may include coating a photoresist film on a first semiconductor member, exposing the photoresist film to light from a back of the substrate, wherein the gate electrode is used as a light blocking mask, developing the exposed photoresist film to form a photoresist pattern having the same planar size as the gate electrode, and etching the semiconductor layer using the photoresist pattern as an etching mask.
Abstract:
PURPOSE: A thin film transistor substrate is provided to prevent the film characteristics of insulation and protection films from being lowered by adding a hydrogen gas to a deposition process. CONSTITUTION: A gate line is formed on an insulating substrate(10), and a gate insulating layer(30) is formed on the gate line. A data line is formed on the gate insulation film, and a protection film(60) is formed on the data line. A contact hole(65) is formed by etching at least one of the gate insulation film and the protection film.
Abstract:
A method for manufacturing a TFT(Thin Film Transistor) substrate is provided to pattern a data metal film through a wet etching process and a dry etching process. A gate insulating film and an active layer(140) are successively formed on a substrate(110) in which a gate wire is formed. A data metal film(150) in which the first to the third metal layers(151~153) are continuously laminated is formed on the active layer. The first photoresist pattern(160) in which a channel forming region has a thickness which is relatively thinner than other regions is formed on the data metal layer. The data metal layer and the active layer are etched by using the first photoresist pattern. The first photoresist pattern is etched, and the second photoresist pattern in which the channel forming region is opened is formed. A primary dry etching of the third metal layer of the channel forming region is performed by using the second photoresist pattern. Secondary dry etching of the second metal layer is performed, and tertiary dry etching of the first metal layer is performed by using the second photoresist pattern.
Abstract:
A method for manufacturing a thin film transistor display panel and a manufacturing system using the same are provided to reduce the error rate of a liquid crystal display device by preventing generation of corrosive foreign materials in a manufacturing process. A deposition process is performed to deposit a metallic thin film on a display panel(S111). An insulating substrate deposited with a metallic thin film is provided into an etch unit to perform a dry-etch process for forming a predetermined circuit pattern(S112). The insulating substrate is provided into a standby unit to perform a cleaning and standby process(S113). A preliminary cleaning process is performed(S114). A determination process is performed to determine the state of a cleaning operation(S115). A main cleaning process is performed(S116).
Abstract:
A thin film transistor display panel and its fabrication method are provided to obtain low resistance of wirings and the reliability. A gate line(121) is formed on an insulation substrate. A gate insulating layer is formed on the gate line. A semiconductor(151) is formed on the gate insulating layer. Ohmic contacts are formed on the semiconductor. A data line(171) is formed on the ohmic contacts and includes a source electrode(173). A drain electrode faces the source electrode. A pixel electrode is connected with the drain electrode. At least one of the data line and the drain electrode includes the first contact layer, the second contact layer including a conductive oxide, and a conductive layer containing silver or a silver alloy.
Abstract:
PURPOSE: A contactless plasma monitoring apparatus, a plasma processing apparatus and a contactless plasma monitoring method are provided to maintain a plasma state in a processing chamber with proper condition to a plasma process by controlling a voltage provided to the processing chamber in a real time. CONSTITUTION: A processing chamber(100) supplies a reaction space(150) in which the process is implemented using a plasma(140). The processing chamber includes an upper electrode(110) and a lower electrode(120). A power supply unit(300) supplies the power supply to the processing chamber. The power supply unit includes a power generating unit(320) with generating the power supply to the processing chamber and a matching box(310). The matching box controls the intensity of the generated power source and supplies to the processing chamber. A power supply wiring(200) connects the processing chamber with the power supply unit.