Abstract:
본 발명에 따른 Ⅲ족 질화물 결정체의 제조 방법은 반응실(110) 내에 HCl 가스(1)를 도입하여 반응실(110) 내를 세정하는 공정과, 세정된 반응실(110) 내에서 Ⅲ족 질화물 결정체(11)를 기상 성장시키는 공정을 포함한다. 또한, Ⅲ족 질화물 결정체의 제조 장치(100)는 반응실(110) 내에 HCl 가스(1)를 도입하는 구조와 HVPE법에 의해 Ⅲ족 질화물 결정체(11)를 성장시키는 구조를 구비한다. 이에 따라, 결정 성장시에 반응실 내에 부착된 퇴적물을 효과적으로 세정하는 방법을 포함하는 Ⅲ족 질화물 결정체의 제조 방법 및 그 제조 방법에서 이용되는 제조 장치가 제공된다.
Abstract:
A method of growing a gallium nitride crystal is provided to reduce a density of dislocations effectively by forming a stable grain boundary at an interface of two different crystal regions, in an epitaxial growth method. A mask(M) inhibiting epitaxial growth of a gallium nitride crystal is formed partially on a ground substrate(U). The gallium nitride crystal is grown epitaxially on the ground substrate in which the mask is formed, while doping carbon. A first crystal region is grown from a periphery region of the mask toward inside, and an c-axis direction is reversed in the first crystal region relative to a second crystal region grown on a region where the mask is not formed in the ground substrate.
Abstract:
A gallium nitride crystal growth method, gallium nitride crystal substrate, epi-wafer manufacturing method, and epi-wafer are provided to prevent the crack generated when forming the thin film and to grow thick gallium nitride crystal. The gallium nitride crystal is grown by hydride vapor phase epitaxy growth method, using the carrier gas, the GaN raw material, and the silicon dopant gas. The dew point of the carrier gas is less than -60°C(S2). The partial pressure of the carrier gas is 0.56atm over or 0.92 atm less.
Abstract:
A method and apparatus for preparing a group III nitride crystal substance is provided to effectively clean deposits adhered on a reaction chamber during growth of the group III nitride crystal substance. An interior of a reaction chamber is cleaned by introducing HCl gas into the reaction chamber, and a group III nitride crystal substance is vapor-deposited in the cleaned reaction chamber. The step of cleaning the interior of the reaction chamber is carried out under conditions of at least 1.013 hPa and not more than 1013 hPa for HCl gas partial pressure and at least 650 deg.C to 1200 deg.C for temperature in the reaction chamber.