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公开(公告)号：KR100797976B1
公开(公告)日：2008-01-24
申请号：KR1020060139237
申请日：2006-12-31
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for packaging a semiconductor device is provided to reduce the problem of adhesion generated between an epoxy packaging material and a wafer chip, thereby improving reliance. An epoxy resin composition comprises 1-6 wt% of a diglycidyl ether bisphenol modified epoxy resin represented by the formula 1; 2-8 wt% of a polyaromatic epoxy resin represented by the formula 3; 1-5 wt% of a polyaromatic curing agent represented by the formula 4; 0.1-1.5 wt% of a triazine-based resin represented by the formula 6; 0.11-2.1 wt% of a coupling agent represented by X3-Si-CH2-CH2-CH2-O-CH2-R (wherein R is a cyclo epoxy group, an amino group, a methacryl group, or a vinyl group; and X are independently a methoxy group or an ethoxy group); 0.05-1 wt% of a curing accelerator; and 80-90 wt% of an inorganic filler. In the formula 1, R is a hydroxyl group or a methyl group; G is a glycidyl group; and n is an integer of 1-3. In the formulae 3 and 4, R1 and R2 are independently a C1-C4 alkyl group; a is an integer of 0-4; and n is an integer of 1-7.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物，用于减少在环氧树脂封装材料和晶片芯片之间产生的粘附问题，从而提高依赖性。 环氧树脂组合物包含1-6重量％的由式1表示的二缩水甘油醚双酚改性环氧树脂; 2-8重量％由式3表示的多芳族环氧树脂; 1-5重量％由式4表示的多芳族固化剂; 0.1-1.5重量％的由式6表示的三嗪基树脂; 由X3-Si-CH2-CH2-CH2-O-CH2-R（其中R是环氧基，氨基，甲基丙烯酰基或乙烯基）表示的偶联剂的0.11-2.1重量％ 独立地是甲氧基或乙氧基）; 0.05-1重量％的固化促进剂; 和80-90重量％的无机填料。 在式1中，R是羟基或甲基; G是缩水甘油基; n为1-3的整数。 在式3和4中，R 1和R 2独立地为C 1 -C 4烷基; a是0-4的整数; n为1-7的整数。
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公开(公告)号：KR1020070066075A
公开(公告)日：2007-06-27
申请号：KR1020050126823
申请日：2005-12-21
Applicant: 제일모직주식회사
Abstract: Provided is an epoxy resin composition for the package of a semiconductor device which does not generate harmful compounds in case of incineration, does not corrode a semiconductor chip or a lead frame, and shows excellent flame retardancy and molding property. The epoxy resin composition comprises a melamine modified derivative represented by the chemical formula 1 and zinc borate represented by 2ZnO.3B2O3.3.5H2O as a flame retardant in an amount of 0.5-8 wt%, wherein R1 to R3 are identical to or different from one another and are a C1-C10 alkyl group or a primary amine group. Preferably, the epoxy resin composition comprises a polyaromatic epoxy resin represented by the chemical formula 3; and a polyaromatic phenol resin curing agent represented by the chemical formula 4, wherein the average of n is 1-7.
Abstract translation: 本发明提供一种用于半导体器件封装的环氧树脂组合物，其在焚烧的情况下不产生有害化合物，不会腐蚀半导体芯片或引线框架，并且显示出优异的阻燃性和成型性。 环氧树脂组合物包含由化学式1表示的三聚氰胺改性衍生物和由2ZnO.3B2O3.3.5H2O表示的硼酸锌，为0.5-8重量％的阻燃剂，其中R1至R3与...相同或不同 是C1-C10烷基或伯胺基。 优选地，环氧树脂组合物包含由化学式3表示的多芳族环氧树脂; 和由化学式4表示的多芳族酚醛树脂固化剂，其中n的平均值为1-7。
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公开(公告)号：KR100652830B1
公开(公告)日：2006-12-01
申请号：KR1020050133632
申请日：2005-12-29
Applicant: 제일모직주식회사
IPC: C08L63/00
Abstract: Provided is an epoxy resin composition for packaging a semiconductor device which is improved in heat impact resistance, crack resistance and adhesion even without using a halogen-based flame retardant and an antimony trioxide-based flame retardant. The epoxy resin composition comprises 0.1-5 wt% of an isocyanate terminated polyurethane prepolymer represented by the formula 1; a polyaromatic epoxy resin represented by the formula 2; and a polyaromatic curing agent represented by the formula 3. In the formula 1, R is H or a methyl group, and n is an integer of 1-10; in the formula 2, R1 and R2 are identical or different each other and are a C1-C4 alkyl group, a is an integer of 1-4, and n has an average number of 1-7; and in the formula 3, R1 and R2 are identical or different each other and are a C1-C4 alkyl group, a is an integer of 1-4, and n has an average number of 1-7.
Abstract translation: 本发明提供即使不使用卤系阻燃剂和三氧化锑系阻燃剂，也能提高耐热冲击性，耐裂纹性和密合性的半导体装置封装用环氧树脂组合物。 该环氧树脂组合物包含0.1-5重量％的由式1表示的异氰酸酯封端的聚氨酯预聚物; 由式2表示的聚芳族环氧树脂; 和由式3表示的聚芳族固化剂。在式1中，R是H或甲基，并且n是1-10的整数; 在式2中，R1和R2彼此相同或不同，并且是C1-C4烷基，a是1-4的整数，并且n具有1-7的平均数; 并且在式3中，R1和R2彼此相同或不同，并且是C1-C4烷基，a是1-4的整数，并且n具有1-7的平均数。
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公开(公告)号：KR1020070069386A
公开(公告)日：2007-07-03
申请号：KR1020050131438
申请日：2005-12-28
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for sealing a semiconductor device is provided to achieve excellent flame retardance, moldability and reliability without using any halogen flame retardant which generates by-products harmful on human and environment upon combustion. The epoxy resin composition for sealing a semiconductor device comprises a Polytetrafluoroethylene(PTFE)-based organic filler and as a non-halogen flame retardant, magnesium zinc hydroxide which is represented by a formula 1: Mg1-xZnx(OH)2, wherein an average value of X is greater than 0 and not more than 1. In the epoxy resin composition, a total content of the PTFE-based organicfiller and the magnesium zinc hydroxide is 0.5-5 wt% with regard to the entire resin composition. The epoxy resin composition further comprises a polyaromatic epoxy resin represented by a formula 2 and a polyaromatic phenol resin represented by a formula 3, wherein an average value of n is 1-7.
Abstract translation: 提供用于密封半导体器件的环氧树脂组合物，以实现优异的阻燃性，成型性和可靠性，而不使用任何卤素阻燃剂，其在燃烧时产生对人体和环境有害的副产物。 用于密封半导体器件的环氧树脂组合物包括基于聚四氟乙烯（PTFE）的有机填料和作为非卤素阻燃剂，由式1表示的氢氧化镁锌：Mg1-xZnx（OH）2，其中平均 X的值大于0且不大于1.在环氧树脂组合物中，关于整个树脂组合物，PTFE基有机填料和氢氧化镁锌的总含量为0.5-5重量％。 环氧树脂组合物还包含由式2表示的多芳族环氧树脂和由式3表示的多芳族酚醛树脂，其中n的平均值为1-7。
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公开(公告)号：KR100611442B1
公开(公告)日：2006-08-09
申请号：KR1020050067656
申请日：2005-07-26
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로, 보다 상세하게는 에폭시 수지, 경화제, 비할로겐계 난연제, 경화촉진제 및 무기충전제를 포함하는 에폭시 수지 조성물에 관한 것이다. 본 발명의 에폭시 수지 조성물은 연소 시 인체 및 환경에 유해한 부산물을 발생시키는 할로겐계 난연제를 사용하지 않고서도 우수한 난연성을 달성할 수 있으며 성형성 및 신뢰성도 충분히 달성되는 이점을 갖는다.
비할로겐계 난연제, 난연성, 성형성, 신뢰성Abstract translation: 更具体地说，本发明涉及包含环氧树脂，固化剂，无卤阻燃剂，固化促进剂和无机填料的环氧树脂组合物。 本发明的环氧树脂组合物可以在不使用产生对人体有害的副产物和燃烧过程中的环境的卤素系阻燃剂的情况下实现优异的阻燃性，并且具有充分实现成型性和可靠性的优点。
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Patent Agency Ranking
公开(公告)号：KR100790800B1
公开(公告)日：2008-01-02
申请号：KR1020060078999
申请日：2006-08-21
Applicant: 제일모직주식회사
CPC classification number: C08L63/00 , C08J3/124 , C08J2363/00
Abstract: A method for preventing the blocking and degradation of flow property of epoxy molding compound powder is provided to remove latent heat essentially contained in epoxy molding compound powder in a cost-efficient and safe manner. A for preventing blocking and degradation of flow property of epoxy molding compound powder comprises a step of introducing dry ice directly into any one process for preparing an epoxy molding compound for encapsulating a semiconductor device. Particularly, dry ice and epoxy molding compound chips are supplied to a crusher to be crushed together, and the dry ice is removed through sublimation.
Abstract translation: 提供防止环氧成型复合粉末的流动性阻塞和降解的方法，以低成本且安全的方式除去基本上包含在环氧模塑料粉末中的潜热。 用于防止环氧模塑料粉末的流动性阻塞和降解的A包括将干冰直接引入用于制备用于封装半导体器件的环氧模塑料的任何一种方法中的步骤。 特别地，将干冰和环氧树脂成型复合片供给到破碎机中以一起粉碎，并通过升华除去干冰。
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公开(公告)号：KR100696878B1
公开(公告)日：2007-03-20
申请号：KR1020050136073
申请日：2005-12-30
Applicant: 제일모직주식회사
Abstract: Provided is an epoxy resin composition for packaging a semiconductor device which is reduced in generation of crack on a pad and a chip in case of the soldering at a high temperature and is decreased in the adhesion between an epoxy encapsulating agent and a wafer chip. The epoxy resin composition comprises a diglycidyl ether bisphenol modified epoxy resin represented by the formula 1; a polyaromatic epoxy resin represented by the formula 3; a polyaromatic curing agent represented by the formula 4; a coupling agent represented by Si(X3)-(CH2)3-O-CH2-R which is pretreated with a glycol or distilled water; a curing accelerator; and an inorganic filler, wherein R is H or a methyl group; G is a glycidyl group; n is an integer of 1-3 in the formula 1; R1 and R2 are identical or different from each other and are a C1-C4 alkyl group; a is an integer of 1-4; and n is an integer of 1-7 in the formula 3 or 4.
Abstract translation: 提供了一种用于封装半导体器件的环氧树脂组合物，其在高温下的焊接的情况下减少了焊盘和芯片上的裂纹的产生，并且环氧树脂封装剂和晶片芯片之间的粘附性降低。 环氧树脂组合物包含由式1表示的二缩水甘油醚双酚改性环氧树脂; 由式3表示的多芳族环氧树脂; 由式4表示的多芳族固化剂; 由用二醇或蒸馏水预处理的Si（X3） - （CH2）3-O-CH2-R代表的偶联剂; 固化促进剂; 和无机填料，其中R是H或甲基; G是缩水甘油基; n是式1中1-3的整数; R1和R2相同或不同，为C1-C4烷基; a是1-4的整数; 式3或4中n为1-7的整数。
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公开(公告)号：KR100861324B1
公开(公告)日：2008-10-01
申请号：KR1020050133608
申请日：2005-12-29
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로, 보다 상세하게는 1) 에폭시 수지, 2) 경화제, 3) 난연제, 4) 무기 충전제를 포함하는 에폭시 수지 조성물에 있어서, 상기 에폭시 수지로 다관능성 에폭시 수지를 사용하고, 상기 경화제로 다방향족 경화제를 사용하며, 상기 난연제로 비할로겐계 난연제인 징크보레이트 또는 하이드로탈사이트(hydrotalcite)를 사용하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 소자 밀봉용 에폭시 수지 조성물에 관한 것으로 본 발명의 에폭시 수지 조성물은 연소 시 인체 및 환경에 유해한 부산물을 발생시키는 할로겐족 난연제를 사용하지 않고서도 우수한 난연성을 달성할 수 있으며 성형성 및 신뢰성도 우수한 에폭시 수지 조성물을 제공할 수 있다.
다관능성 에폭시 수지, 다방향족 경화제, 비할로겐계 난연제, 징크보레이트. 하이드로탈사이트-
公开(公告)号：KR100798677B1
公开(公告)日：2008-01-28
申请号：KR1020060139254
申请日：2006-12-31
Applicant: 제일모직주식회사
IPC: C08L63/00 , C08L75/04 , C08K5/3492 , H01L23/29
Abstract: An epoxy resin composition for packaging a semiconductor device is provided to reduce the problem of separation between the surface of a wafer chip and an epoxy packaging material and to reduce cracking of a pad surface and a chip. An epoxy resin composition comprises 0.1-5 wt% of an isocyanate terminated polyurethane prepolymer represented by the formula 1; 0.1-10.7 wt% of a polyaromatic epoxy resin represented by the formula 2; 0.1-7.3 wt% of a polyaromatic curing agent represented by the formula 4; 0.1-1.5 wt% of a triazine-based resin represented by the formula 6; 0.05-0.5 wt% of a curing accelerator; and 75-95 wt% of an inorganic filler. In the formula 1, R is a hydroxyl group or a methyl group; and n is an integer of 1-10. In the formulae 2 and 4, R1 and R2 are identical or different each other and are a C1-C4 alkyl group; a is an integer of 0-4; and n is an integer of 1-7.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物，以减少晶片芯片表面和环氧树脂封装材料之间的分离问题，并减少焊盘表面和芯片的破裂。 环氧树脂组合物包含0.1-5wt％由式1表示的异氰酸酯封端的聚氨酯预聚物; 0.1-10.7重量％的由式2表示的多芳族环氧树脂; 0.1-7.3重量％的由式4表示的多芳族固化剂; 0.1-1.5重量％的由式6表示的三嗪基树脂; 0.05〜0.5重量％的固化促进剂; 和75-95重量％的无机填料。 在式1中，R是羟基或甲基; n为1-10的整数。 在式2和4中，R 1和R 2相同或不同，并且是C 1 -C 4烷基; a是0-4的整数; n为1-7的整数。
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公开(公告)号：KR100797967B1
公开(公告)日：2008-01-24
申请号：KR1020060139241
申请日：2006-12-31
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for packaging a semiconductor device, and a semiconductor device packaged by using the composition are provided to reduce the separation due to the surface adhesive strength of palladium and to reduce the crack of a pad surface and a chip. An epoxy resin composition comprises 3-12 wt% of an o-cresol novolac epoxy resin represented by the formula 1; 1-8 wt% of a diglycidyl ether bisphenol modified epoxy resin represented by the formula 2; 1-8 wt% of a curing agent; 0.11-2.1 wt% of a coupling agent comprising a compound represented by X3-Si-CH2-CH2-CH2-O-CH2-R (wherein R is a cyclo epoxy group, an amino group, a methacryl group, or a vinyl group; and X are independently a methoxy group or an ethoxy group); 0.01-1.5 wt% of a triazine-based resin represented by the formula 5; 0.02-0.4 wt% of a curing accelerator; and 70-90 wt% of an inorganic filler. In the formulae 1 and 2, R is a hydroxyl group or a methyl group; G is a glycidyl group; and n is an integer of 0-3. In the formula 5, R1 and R2 are independently a mercapto group, a C1-C10 alkyl group or an amino group.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物和通过使用该组合物封装的半导体器件，以减少由于钯的表面粘合强度而引起的分离并减少焊盘表面和芯片的裂纹。 环氧树脂组合物包含3-12重量％的由式1表示的邻甲酚酚醛环氧树脂; 1-8重量％的由式2表示的二缩水甘油醚双酚改性环氧树脂; 1-8wt％的固化剂; 0.11-2.1重量％的由X3-Si-CH2-CH2-CH2-O-CH2-R（其中R是环氧基，氨基，甲基丙烯酰基或乙烯基）表示的化合物的偶联剂 ; X独立地为甲氧基或乙氧基）; 0.01-1.5重量％的由式5表示的三嗪基树脂; 0.02〜0.4重量％的固化促进剂; 和70-90重量％的无机填料。 在式1和式2中，R是羟基或甲基; G是缩水甘油基; n为0-3的整数。 在式5中，R 1和R 2分别是巯基，C 1 -C 10烷基或氨基。
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