Abstract:
PURPOSE: A positive type photosensitive resin composition, a photosensitive resin film using the same, and a semiconductor device including the film are provided to improve residual film rate by adjusting the dissolution speed of an exposing part and a non-exposing part. CONSTITUTION: A positive type photosensitive resin composition includes a polybenzoxazole precursor, a dissolution adjusting agent, a photosensitive diazoquinone compound, a silane compound, and a solvent. The dissolution adjusting agent includes a compound represented by chemical formula 6. The polybenzoxazole precursor is selected from a group including a first polybenzoxazole precursor, a second polybenzoxazole precursor, and the combination of the same. The first polybenzoxazole precursor includes a repeating unit represented by chemical formula 1, a repeating unit represented by chemical formula 2, or the combination of the same. A thermal polymerizable functional group is arranged at one or more end parts of the first polybenzoxazole precursor. The second polybenzoxazole precursor includes a repeating unit represented by chemical formula 4, a repeating unit represented by chemical formula 5, or the combination of the same. In chemical formula 6, Z1 and Z2 are identical or different and are respectively single bonds, O, CO, CONH, S, or SO_2-substituted or non-substituted C1 to C10 alkyleneoxy groups(OR203) or -substituted or non-substituted C6 to C15 aryleneoxy groups(OR204); in the alkyleneoxy groups, R203 is a substituted or non-substituted alkylene group; in the aryleneoxy group, R204 is a substituted or non-substituted arylene group; and G1 is a hydrogen element, a substituted or non-substituted C1 to C30 aliphatic organic group, a substituted or non-substituted C3 to C30 alicyclic organic group, a substituted or non-substituted C6 to C30 aromatic organic group, a substituted or non-substituted C2 to C30 heterocyclic group, or -Ti-R300.
Abstract:
PURPOSE: A positive type photosensitive resin composition, a photosensitive resin film using the composition, and a semiconductor device including the film are provided to adjust the dissolution speed of an exposing part and a non-exposing part. CONSTITUTION: A positive type photosensitive rein composition includes a polybenzoxazole precursor, a novolak resin, a photosensitive diazoquinone compound, a silane compound, and a solvent. The novolak resin includes a compound with a repeating unit represented by chemical formula 6. The polybenzoxazole precursor is selected from a group including a first polybenzoxazole precursor, a second polybenzoxazole precursor, and the combination of the same. The first polybenzoxazole precursor includes a repeating unit represented by chemical formula 1, a repeating unit represented by chemical formula 2, or the combination of the same. A thermal polymerizable functional group is arranged at one end part of the first polybenzoxazole precursor. The second polybenzoxazole precursor includes a repeating unit represented by chemical formula 4, a repeating unit represented by chemical formula 5, or the combination of the same. In chemical formula 6, R7 is identical or different in each repeating unit and is a C1 to C20 aliphatic organic group.
Abstract:
PURPOSE: A liquid crystal photo-alignment agent is provided to obtain excellent printability and liquid crystal photo-alignment and to prevent the degradation of vertical alignment power due to the dropped liquid crystal through a one drop filling mode. CONSTITUTION: A liquid crystal photo-alignment comprises: a first polymer which is selected from a group comprising polyamic acid of a chemical formula 1 or a polyimide polymer of a chemical formula 2; a polymer including a second polymer of a polyimide photopolymer which is marked as a chemical formula 3; and a functional silane compound which is marked as a chemical formula 4. The functional silane compound is included with an amount of 0.01-10 parts by weight.
Abstract:
(A) 화학식 1로 표시되는 반복단위, 화학식 2로 표시되는 반복단위, 또는 이들의 조합을 포함하고, 적어도 한 쪽의 말단 부분에 열중합성 관능기를 갖는 제1 폴리벤조옥사졸 전구체(polybenzoxazole precursor), 화학식 4로 표시되는 반복단위, 화학식 5로 표시되는 반복단위, 또는 이들의 조합을 포함하는 제2 폴리벤조옥사졸 전구체, 및 이들의 조합으로 이루어진 군에서 선택되는 폴리벤조옥사졸 전구체; (B) 용해 조절제; (C) 감광성 디아조퀴논 화합물; (D) 실란 화합물; 및 (E) 용매를 포함하고, 상기 용해 조절제는 화학식 6으로 표시되는 화합물을 포함하는 것인 포지티브형 감광성 수지 조성물 및 이를 사용하여 제조된 감광성 수지막을 제공한다.
Abstract:
하기 화학식 1로 표시되는 제1 광디아민으로부터 유도된 제1 구조 단위, 하기 화학식 2로 표시되는 제2 광디아민으로부터 유도된 제2 구조 단위 및 하기 화학식 3으로 표시되는 디아민으로부터 유도된 제3 구조 단위를 포함하는 폴리아믹산, 폴리이미드 중합체 또는 이들의 조합인 고분자 화합물 및 용매를 포함하는 액정 광배향제를 제공한다. [화학식 1]
[화학식 2]
[화학식 3]
상기 화학식 1 내지 3에서, 각 치환기의 정의는 명세서에 정의된 바와 같다. 수직 배향력, 액정광배향제, 액정광배향막
Abstract:
PURPOSE: A positive type photosensitive resin composition, a photosensitive resin film manufactured using the same, and a semiconductor device including the photosensitive resin film are provided to suppress dissolution to an alkali developing solution and to improve the residue eliminating characteristic of the film. CONSTITUTION: A positive type photosensitive resin composition includes a polybenzoxazole precursor, photosensitive diazoquinone, a silane compound, a phenol compound, and a solvent. The polybenzoxazole precursor includes a first polybenzoxazole precursor with a thermal polymerizable functional group at least one end part. The first polybenzoxazole precursor includes a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2. In chemical formulas 1 and 2, X1 is identical or different in each repeating unit and is respectively a substituted or non-substituted C6 to C30 aromatic organic group, a substituted or non-substituted tetravalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or non-substituted tetravalent to hexavalent C3 to C30 aliphatic organic group; X2 is identical or different in each repeating unit and is respectively a functional group represented by chemical formula 3; and Y1 and Y2 are identical or different and are respectively substituted or non-substituted C6 to C30 aromatic organic groups, substituted or non-substituted divalent to hexavalent C1 to C30 aliphatic organic groups, or substituted or non-substituted divalent to hexavalent C3 to C30 alicyclic organic groups.
Abstract:
PURPOSE: A positive type photo-sensitive resin composition, a photo-sensitive resin film using the same, and a semiconductor device including the photo-sensitive resin film are provided to improve sensitivity and resolution. CONSTITUTION: A positive type photo-sensitive resin composition includes a polybenzoxazole precursor with a repeating unit in the form of random copolymer, a photo-sensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The repeating unit is represented by chemical formula 1. In chemical formula 1, X1 is derived from a diamine compound represented by chemical formula 30; X2 is an aromatic organic group or a tetravalent to hexavalent aliphatic organic group; Y1 and Y2 are respectively aromatic organic groups or divalent to hexavalent aliphatic organic groups; m and n are molar ratios, the sum of m and n is 100 mol%; m is 1 to 99mol%; and n is 1 to 99mol%.
Abstract:
PURPOSE: A liquid crystal photo-alignment agent is provided to improve printability, vertical alignment property, and liquid crystal phtoalignment property. CONSTITUTION: A liquid crystal photo-alignment agent includes a polyamic acid including a repeating unit represented by chemical formula 1, polyimide including a repeating unit represented by chemical formula 2, or combination thereof. In chemical formulas 1 and 2, X1 and X2 are the same or different and represent tetravalent organic group induced from cycloaliphatic acid dianhydride or aromatic acid dianhydride; Y1 and Y2 are the same or different and represent a divalent organic group induced from diamine represented by chemical formula 3 and a divalent and a divalent organic group induced from diamine represented by chemical formula 4.
Abstract:
PURPOSE: A liquid crystal alignment agent is provided to ensure chemical resistance and to prevent orientation reduction of the liquid crystal. CONSTITUTION: A liquid crystal alignment agent contains a polymer selected from the group consisting of polyamic acid, polyimide, and mixture thereof; and epoxy compound of chemical formula 1. In chemical formula 1, X is linear, branched, or cyclic alkyl group of 1-20 carbon atoms in which one or more halogen atom is substituted or non-substituted.