公开(公告)号：WO2013085277A1

公开(公告)日：2013-06-13

申请号：PCT/KR2012/010478

申请日：2012-12-05

Applicant: 제일모직주식회사

Inventor： 송규석 ,  호종필 ,  김상균 ,  전종철 ,  최재원

IPC: H01L21/301

CPC classification number: H01L21/6836 ,  C09J7/10 ,  C09J2201/28 ,  C09J2203/326 ,  H01L2221/68327

Abstract: 본 발명의 반도체 조립용 접착 테이프는, 이형필름, 상기 이형필름 상에 형성된 원형 모양의 접착층, 상기 접착층을 덮고 상기 접착층의 주위에서 상기 이형필름에 접촉하도록 설치된 원형 모양의 점착필름, 및 상기 이형필름의 길이 방향의 양단부에 연속적으로 형성된 패턴 점착필름을 포함하며, 상기 패턴 점착필름 아래에 상기 접착층과 동일한 두께의 패턴 접착층이, 상기 접착층 원주의 폭방향 접선과 이웃하는 접착층 원주의 폭방향 접선 사이에 형성되어 있는 것을 특징으로 한다.

Abstract translation: 本发明的半导体装配用胶带包括：剥离膜; 形成在剥离膜上的圆形粘合剂层; 覆盖粘合剂层的圆形粘合膜，设置成与粘合剂层附近的剥离膜接触; 以及在剥离膜的长度方向上的两端连续形成的图案粘合膜，其中，在图案粘合膜下形成与粘合剂层相同厚度的图案粘合剂层，位于图案粘合剂膜之间的宽度方向切线 粘合剂层的周长和相邻粘合剂层的圆周上的宽度方向切线。

公开(公告)号：KR101033045B1

公开(公告)日：2011-05-09

申请号：KR1020090134713

申请日：2009-12-30

Applicant: 제일모직주식회사

Inventor： 송규석 ,  호종필 ,  최재원 ,  임수미 ,  송기태

IPC: C09J163/00 ,  C09J7/02 ,  H01L21/58

CPC classification number: C09J163/00 ,  C08L33/04 ,  C08L61/06 ,  C08L2205/03 ,  Y10T428/31515 ,  C09J7/00 ,  C09J2203/326

Abstract: PURPOSE: A bonding film composition for a semiconductor assembly is provided to improve void removal ability and to enable stable wire bonding by controlling a curing reaction heat generation start temperature and the viscosity after curing. CONSTITUTION: A bonding film composition for a semiconductor assembly includes a polymer binder resin, epoxy-based resin, phenol type epoxy hardener, curing catalyst, silane coupling agent and inorganic filler. The curing reaction heat generation start temperature is 300 °C or greater. The melting point at 175 °C after curing at 150 °C for 1 hour and the melting point at 175 °C after curing at °C for 2 hours is 1.0×10^5 - 5.0×10^6 poise.

Abstract translation: 目的：提供一种用于半导体组件的接合膜组合物，以通过控制固化反应发热开始温度和固化后的粘度来提高空隙去除能力并实现稳定的引线接合。 构成：用于半导体组合物的接合膜组合物包括聚合物粘合剂树脂，环氧基树脂，酚型环氧固化剂，固化催化剂，硅烷偶联剂和无机填料。 固化反应发热开始温度为300℃以上。 在150℃下固化1小时后，175℃下的熔点为175℃，在2℃下固化2小时后的熔点为1.0×10 ^ 5〜5.0×10 ^ 6泊。

公开(公告)号：KR101309811B1

公开(公告)日：2013-10-14

申请号：KR1020100098504

申请日：2010-10-08

Applicant: 제일모직주식회사

Inventor： 최재원 ,  송기태 ,  호종필

IPC: C09J7/02 ,  C09J11/00 ,  C09J133/04 ,  H01L21/58

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: 본딩 와이어(bonding wire)가 본딩된 하부 칩 상에 상부 칩이 적층되는 적층형 패키지에서, 상부 칩 하면에 접착되고 본딩 와이어가 침투되어 수용되는 제1접착층, 및 제1접착층 하부에 접착되어 하부 칩 상에 접착되는 제 2 접착층을 포함하고, 경화전 점도는 제1접착층이 제2접착층보다 낮은 점도를 갖는 반도체 패키지용 접착 필름을 제시한다.

公开(公告)号：KR1020130062817A

公开(公告)日：2013-06-13

申请号：KR1020110129287

申请日：2011-12-05

Applicant: 제일모직주식회사

Inventor： 송규석 ,  호종필 ,  김상균 ,  전종철 ,  최재원

IPC: H01L21/301

CPC classification number: H01L21/6836 ,  C09J7/10 ,  C09J2201/28 ,  C09J2203/326 ,  H01L2221/68327

Abstract: PURPOSE: An adhesive tape for assembling a semiconductor device is provided to prevent the imprint mark fault generated due to the multi-laminate layer of a bonding layer. CONSTITUTION: A bonding layer(1) of a circular shape is formed on a release film(6). An adhesive film(2) of a circular shape is contacted with the release film around the bonding layer. A pattern adhesive film(3) is consecutively formed in both ends of the release film in a longitudinal direction. A pattern bonding layer(4) is formed under the pattern adhesive film. The width direction length(X) of the pattern bonding layer is shorter than the width direction length(Y) of the pattern adhesive film.

Abstract translation: 目的：提供一种用于组装半导体器件的胶带，以防止由于粘结层的多层叠层而产生的印痕标记故障。 构成：在剥离膜（6）上形成圆形的接合层（1）。 环状粘合膜（2）与粘合层周围的剥离膜接触。 沿剥离膜的长度方向的两端连续形成图形粘合膜（3）。 在图案粘合膜下方形成图案接合层（4）。 图案接合层的宽度方向长度（X）比图案粘合膜的宽度方向长度（Y）短。

公开(公告)号：KR1020120036691A

公开(公告)日：2012-04-18

申请号：KR1020100098504

申请日：2010-10-08

Applicant: 제일모직주식회사

Inventor： 최재원 ,  송기태 ,  호종필

IPC: C09J7/02 ,  C09J11/00 ,  C09J133/04 ,  H01L21/58

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  C09J7/35 ,  C09J7/29 ,  C09J11/00 ,  C09J133/04 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327

Abstract: PURPOSE: Adhesive film is provided to retrain the failure of bonding wire with retraining the introduce of separate spacer between semiconductor chips, and to restrain adhesive defect like void in interface. CONSTITUTION: Adhesive film for semiconductor packaging comprises a first adhesive layer(60) in which bonding wire is penetrated and accepted, and a second bonding layer attached to a lower chip. Before hardening, the first adhesive layer has lower viscosity than the second adhesive layer. The first adhesive layer and the second adhesive layer has the viscosity difference of 10^1-10^3 poise at 100 °C.

Abstract translation: 目的：提供粘合膜，通过重新引导半导体芯片之间的单独间隔物，重新制备接合线的故障，并抑制接口中的无孔等粘合剂缺陷。 构成：用于半导体封装的粘合膜包括第一粘合层（60），其中接合线被穿透并被接受，第二粘合层附接到下芯片。 在硬化之前，第一粘合剂层具有比第二粘合剂层低的粘度。 第一粘合剂层和第二粘合剂层在100℃下的粘度差为10 ^ 1-10 ^ 3泊。

公开(公告)号：KR100882540B1

公开(公告)日：2009-02-06

申请号：KR1020070141343

申请日：2007-12-31

Applicant: 제일모직주식회사

Inventor： 한승 ,  박현진 ,  호종필 ,  유제홍

IPC: C08L63/00 ,  C08K5/527 ,  H01L23/29

Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent flame retardancy without the use of a halogen-based flame retardant, moldability and reliability by using a bishydroxydeoxybenzoin-based polyphosphonate as a flame retardant. An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resin, curing agent, curing accelerator, inorganic filler and flame retardant. The flame retardant is the bishydroxydeoxybenzoin-based polyphosphonate indicated as the chemical formula 1. In the chemical formula 1, the average of n is 10-120. The bishydroxydeoxybenzoin-based polyphosphonate has the average molecular weight of 10,000-40,000 and is used in the amount of 0.01~10 weight% based on the total epoxy resin composition.

Abstract translation: 提供用于封装半导体器件的环氧树脂组合物，以通过使用基于双羟基脱氧苯偶姻的聚膦酸盐作为阻燃剂，而不使用卤素类阻燃剂，成型性和可靠性来确保优异的阻燃性。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，固化剂，固化促进剂，无机填料和阻燃剂。 阻燃剂是以化学式1表示的基于双羟基苯偶姻的聚膦酸酯。在化学式1中，n的平均值为10-120。 基于双羟基苯偶姻的聚膦酸盐的平均分子量为10,000〜40,000，相对于总环氧树脂组合物，其用量为0.01〜10重量％。