Abstract:
A method for depositing the metal thin films on the polymer based materials is provided to improve interface adhesion between the deposited metal thin films by executing a process of high flux ion irradiation having hundreds of beam energy before depositing the metal thin films. A method for depositing the metal thin films on the polymer based materials comprises a first step of washing the surface of the polymer based materials by injecting a metal ion generated from a high flux metallic ion source(10) applying high voltage while having hundreds of beam energy onto the polymer based materials; a second step of modifying the surface of the polymer based materials by the carbonization effect of the polymer surface through elastic scatter between the metal ion and the polymer atom of the polymer based materials; a third step of forming a metallic ion injection layer on the surface of the modified polymer based materials through a continuous injection of the metal ion; and a fourth step of depositing the metal thin films on the metallic ion injection layer.
Abstract:
A photo device epitaxial layer of a lattice-matched InGaAs/InGaAsP multiple-quantum-well structure and a method of manufacturing the same are provided to maximize the wavelength shift of band gap by optimizing a quantum well intermixing process. An n-InP lower cladding layer is formed on a substrate. An active layer is formed on the n-InP lower cladding layer. The active layer is composed of InGaAs well layers and InGaAsP barrier layers alternately stacked each other. A p-InP upper cladding layer and an InGaAs electrode layer are sequentially formed on the resultant structure. An InP protection layer is formed on the InGaAs electrode layer to prevent the contamination of an upper surface of the InGaAs electrode layer and the generation of vacancy due to the deviation of Ga from the InGaAs electrode layer.
Abstract:
PURPOSE: A method for forming a high voltage Schottky diode is provided to increase a breakdown voltage, by performing an ion implantation process in a self-aligned method to carry out an edge termination. CONSTITUTION: A metal layer pattern is formed on a silicon substrate(110). Ions are implanted into the silicon substrate by using the meal layer pattern as an ion implantation mask. Boron ions are used in the ion implantation process. The silicon substrate has an N-type conductivity. The metal layer pattern is composed of gold.
Abstract:
본 발명은 리튬 이온 전지의 전해질로 이용되는 LiPON 박막의 원료인 박막 전지를 위한 전해질용 리튬인산염 스퍼터링 타겟 제조 방법에 관한 것으로, 리튬인산염 분말을 600∼950℃의 온도 범위에서 하소 처리하는 단계와; 상기 단계에서 하소 처리된 분말을 분쇄하는 단계와; 상기 단계에서 분쇄된 분말을 압축 성형하는 단계와; 상기 단계에서 압축 성형된 성형체를 500∼1500℃의 온도 범위에서 소결 처리하는 단계를 포함하여 이루어진다.
Abstract:
PURPOSE: A method for forming a high voltage Schottky diode is provided to increase a breakdown voltage, by performing an ion implantation process in a self-aligned method to carry out an edge termination. CONSTITUTION: A metal layer pattern is formed on a silicon substrate(110). Ions are implanted into the silicon substrate by using the meal layer pattern as an ion implantation mask. Boron ions are used in the ion implantation process. The silicon substrate has an N-type conductivity. The metal layer pattern is composed of gold.