Abstract:
오디오 신호의 무손실 부호화/복호화 장치 및 그 방법이 개시된다. 현 프레임의 주파수 계수에 대한 양자화 인덱스들로부터 각 레벨에 대한 제1 비트열을 생성하고, 각 레벨에 대한 제1 비트열을 일렬로 나열한 제2 비트열의 런 길이로 구성되는 심볼을 생성한 후, 심볼을 제3 비트열로 부호화한다. 이로써, 오디오 신호의 부호화 성능을 향상시킬 수 있다.
Abstract:
A quantizer and method of an LSF coefficient in a wide-band speech coder using trellis coded quantization algorithm are provided to improve an SD performance and assigned bits by reducing an error transfer as a result of using in parallel both a predictional structure and a non-predictional structure. A quantizer of an LSF coefficient in a wide-band speech coder includes a predictional structure quantizing portion(200), a non-predictional structure quantizing portion(210), and a switching portion(220). The predictional structure quantizing portion calculates a quantized candidate vector by quantizing an LSF coefficient vector, and a predictional quantization final vector of the LSF coefficient vector by trellis coded quantizing the candidate vector with reference to a predicted LSF vector of the LSF coefficient vector. The non-predictional structure quantizing portion calculates a quantized candidate vector by quantizing the LSF coefficient vector, and a non-predictional quantization final vector of the LSF coefficient vector by trellis coded quantizing the candidate vector. The switching portion selects smaller one of differences between the LSF coefficient vector and the predictional and non-predictional quantization final vectors as the final quantization vector of the LSF coefficient vector.
Abstract:
A lossless encoding/decoding apparatus and a method thereof are provided to execute compression on audio signals through bitstreams having small numbers by enhancing the capability of lossless encoding of frequency coefficients. A lossless encoding apparatus includes a bit converter(422), a run length converter(424), and a run length encoder(430). The bit converter generates first bitstreams on respective levels from quantization indexes on frequency coefficients of a current frame. The run length converter generates symbols which are formed by a run length of second bitstreams where the first bit streams are disposed in one row. The run length encoder encodes the symbols to third bitstreams.
Abstract:
본 발명은 기판의 이방성 식각과 기판접합기술을 이용하여 광을 여러방향으로 분할시킬 수 있도록 하는 이방성 식각과 기판접합에 의한 광분할기 및 제작방법에 관한 것으로 서로 다른 방향을 갖는 〈100〉기판과〈410〉기판을 접합하여 한 기판을 식각한 다음 상기 식각영역을 틀로하여 광반사층을 형성한 뒤 다결정 규소 등의 물질을 채워 평탄화한 다음 상기 기판을 제거하므로서 광반사면을 갖도록하여 광신호 처리에서 들어오는 광신호를 피라미드형 광분할기의 상기 광반사면에 의하여 반사방향을 변화시켜 광신호를 분할하도록 하는 것이다.
Abstract:
The method is for manufacturing a heterojunction and homojunction dipole transistor using a substrate connection method. The method includes the steps of: (A) forming silicon layers (31,32) on a P-type substrate (30); (B) etching the silicon layer to form device region and forming an insulating layer (33); (C) spraying polycrystal silicon (3) and connecting to another P-type silicon substrate (35); (D) polishing the silicon layer (31) until an insulating layer (33) is exposed; (E) forming connecting area (36) on a silicon layer (32) and forming an insulating layer (37), a polycrystal silicon layer (38), and a silicon layer (39); (F) etching to form an active region and forming a groove on side wall of an insulating layer (37); and (G) spraying polycrystal silicon and heating to form an oxide layer.
Abstract:
The production method employing the general LOCOS method to build up the activated region (24) and the field oxide film (23) comprises: (A) forming the polycrystalline silicon pattern (25) on the upper side of the activated region; (B) forming a gate silicon oxide film (26) by thermal oxidation of a part of the silicon pattern, and polycrystalline silicon patterns (25a),(25b) ion implanted with phosphorus and arsenic; (C) forming an N negative polycrystalline silicon source (28) and a drain (29) rare-doped with phosphorus at the both sides of channel region (30), and also an arsenic-rich-doped N positive polycrystalline silicon source (31) and a drain (32), with heat treating for making the gate silicon oxide film (27).
Abstract:
The method is characterized by consisting of the following steps: (a) depositing a silicon nitride layer (11) on a supporting silicon substrate (12) to a fixed thickness and forming a region (13) for selective oxidation by etching the silicon nitride layer with photolithography and nitride layer etching, (b) forming a silicon oxide layer (13) by the selective oxidation of the region for a gas channel, removing the nitride layer and the selective oxide layer sequentially by using the selective oxide mask, and finally forming the gas channel (14). In this method, both selective oxidation and dry etching can be applied to make the gas channel.