Abstract:
A horizontal insulated gate bipolar transistor according to an embodiment of the present invention comprises: a first conductive semiconductor substrate; a second conductive drift region formed on the upper part of the first conductive semiconductor substrate; a gate electrode arranged on the first conductive semiconductor substrate; a first emitter electrode which is spaced apart from the gate electrode and is arranged on the first conductive semiconductor substrate to be adjacent to one side surface of the gate electrode; a collector electrode which is spaced apart from the gate electrode and is arranged on a second conductive semiconductor substrate to be adjacent to the other side surface of the gate electrode; a second emitter electrode arranged between the gate electrode and the collector electrode; and a trench insulation film formed between the second emitter electrode and the collector electrode in the second conductive drift region.
Abstract:
A voltage regulator according to an embodiment of the present invention includes a reference voltage generator which generates a reference voltage; an error amplifier which compares and amplifies a difference between the reference voltage and an input voltage; a pass transistor which changes the level of a drive current according to an output voltage which is generated from the error amplifier; and a voltage distributor which distributes the output voltage of the pass transistor and provides the output voltage as an input voltage of the error amplifier. The error amplifier comprises an input end of a rail-to-rail structure which respectively receives the reference voltage and the input voltage by using a pair of NMOS and PMOS transistors; and an output end of a voltage buffer structure for driving a load.
Abstract:
An error amplifier according to an embodiment of the present invention includes an amplifying unit amplifying and outputting the voltage difference between a first signal and a second signal; a first current source providing a bias current for operating the amplifying unit; and a first voltage generation unit generating first and second body voltages by using a body biasing method and providing the first current source of the generated first and second body voltages. The first current source includes first and second PMOS transistors including a cascade connection structure, and the first and second PMOS transistors individually receive the first and second body voltages through a body terminal.
Abstract:
반도체 소자의 제조 방법이 제공된다. 반도체 소자의 제조 방법은 제1 도전형의 반도체 기판에 트렌치를 형성하는 것, 트렌치의 측벽 및 바닥면 상에 제2 도전형의 도펀트를 포함하는 트렌치 도펀트 함유막을 형성하는 것, 트렌치 도펀트 함유막 내의 도펀트를 반도체 기판으로 확산시키는 것, 및 트렌치 도펀트 함유막을 제거하는 것을 포함한다.
Abstract:
PURPOSE: An energy storage system which is equipped with a wired and wireless energy transmission function is provided to store and distribute various energies by providing a system for smart grid. CONSTITUTION: An energy input unit (110) inputs energy. An energy wireless transceiver (130) wirelessly transmits and receives the energy. An energy storage/control unit (140) stores the energy. An energy output unit (160) consumes the stored energy. An energy output control unit (150) distributes the stored energy to the energy output unit. [Reference numerals] (110) Energy input unit; (120) Energy input control unit; (130) Energy wireless transmission/receiving unit; (140) Energy storage/control unit; (150) Energy output control unit; (160) Energy output unit
Abstract:
PURPOSE: A MEMS(Micro Electro Mechanical Systems) type semiconductive gas sensor using a micro heater having a plurality of holes and a method for manufacturing the same are provided to obtained a MEMS semiconductive gas sensor which is structural/mechanically/electrically stable, thereby extending a lifetime of the sensor. CONSTITUTION: A MEMS(Micro Electro Mechanical Systems) type semiconductive gas sensor using a micro heater having a plurality of holes comprises a substrate(110), a second membrane(120), a heating resistant(130), a first membrane(140), a sensing electrode(150), and a sensing material(160). A predetermined thickness of the central part of the substrate is etched. The second membrane is formed in the upper part of the central part of the substrate and comprises a plurality of holes. The heating resistant is formed in the second membrane and comprises a plurality of holes. The first membrane is formed on the second membrane and comprises a plurality of holes. The sensing electrode is formed in the first membrane and comprises a plurality of holes. The sensing material is formed in the sensing electrode.