Abstract:
Systems and methods employing at least one constant current source (114, 404) to facilitate programming of an organic memory cell (102, 302, 402, 904, 1102, 1206) and/or employing at least one constant voltage source (112, 304) to facilitate erasing of a memory device (200, 300, 400, 900, 1100). The present invention is utilized in single memory cell devices and memory cell arrays (100). Employing a constant current source (114, 404) prevents current spikes during programming and allows accurate control of a memory cell's (102, 302, 402, 904, 1102, 1206) state during write cycles, independent of the cell's resistance. Employing a constant voltage source (112, 304) provides a stable load for memory cells (102, 302, 402, 904, 1102, 1206) during erase cycles and allows for accurate voltage control across the memory cell (102, 302, 402, 904, 1102, 1206) despite large dynamic changes in cell resistance during the process.
Abstract:
An organic memory cell (100, 1300, 1500) made of two electrodes (104, 110, 1304, 1306, 1502, 1504) with a selectively conductive media (106/108, 1308) between the two electrodes (104, 110, 1304, 1306, 1502, 1504) is disclosed. The selectively conductive media (106/108, 1308) contains an organic layer (108, 300, 400, 500) and passive layer (106, 200). The selectively conductive media (106/108, 1308) is programmed by applying bias voltages that program a desired impedance state (1301, 1302, 1303) for a memory cell (100, 1300, 1500). The desired impedance state (1301, 1302, 1303) represents one or more bits of information and the memory cell (100, 1300, 1500) does not require constant power or refresh cycles to maintain the desired impedance state. Furthermore, the selectively conductive media (106/108, 1308) is read by applying a current and reading the impedance of the media (106/108, 1308) in order to determine the impedance state (1301, 1302, 1303) of the memory cell (100, 1300, 1500). Methods of making the organic memory devices/cells (100, 1300, 1500), methods of using the organic memory devices/cells (100, 1300, 1500), and devices such as computers containing the organic memory devices/cells (100, 1300, 1500) are also disclosed.
Abstract:
Disclosed is a semiconductor transistor device (100) with an annular gate (118) surrounding, at least in part, a channel (110) that conducts current between a first (104) and second (114) source/drain. Also disclosed is a semiconductor transistor device (100) having an annular gate (118) and containing a channel (110) composed of a polymer material. Yet also disclosed is the fabrication of a device utilizing a polymer channel (110) surrounded, at least in part, by an annular gate (118). Further disclosed is a system with a means to control (and/or amplify) current via an annular gate (118) surrounding a channel (110) which conducts current between a first (104) and second (114) source/drain.
Abstract:
A memory cell (104) made of two electrodes(106, 202, 108, 204) with a controllably conductive media between the two electrodes is disclosed. The controllably conductive media (110) contains an active low conductive layer (112) and passive layer (114). The controllably conductive media (110) changes its impedance when an external stimuli such as an applied electric field is imposed thereon. Methods of making the memory devices/cells, methods of using the memory devices/cells, and devices such as computers containing the memory devices/cells are also disclosed.
Abstract:
The present invention facilitates semiconductor devices by aiding the efficiency in the way individual devices change states in a semiconductor array (100, 200, 212, 300, 400). State change voltages can be applied to a single device in the array (100, 200, 212, 300, 400) of semiconductor devices without the need for transistor-type voltage controls. The diodic effect (114, 508, 510, 900, 1014, 1114, 1214, 1502, 1702, 1812) of the present invention facilitates this activity by allowing specific voltage levels necessary for state changes to only occur at the desired device. In this manner, an array of devices can be programmed with varying data or states without utilizing transistor technology. The present invention also allows for an extremely efficient method of producing these types of devices, eliminating the need to manufacture costly external voltage controlling semiconductor devices.
Abstract:
In a BIST (built-in-self-test) system (300) for testing flash memory cells (304) fabricated on a semiconductor substrate (302), a BIST (built-in-self-test) interface (312), a front-end state machine (314), and a back-end state machine (316) are fabricated on the semiconductor substrate (302). The BIST interface (312) inputs test mode data from an external test system (318), and the front-end state machine (314) decodes the test mode data to determine an order for performing at least one desired test mode. The back-end state machine (316) performs the at least one desired test mode on the flash memory cells (304) according to the order for on-chip testing of the flash memory cells (304).
Abstract:
A page mode write system for an E PROM array including active latches (48) for storing loaded data on bit lines (14), independent bit line grounds (28) for isolating the cells (8) in a byte (40), and program gate lines (38) in each byte (40) for tagging those bytes (40) that will undergo a charge/discharge cycle during the write cycle.
Abstract:
A method and system for controlling a boosted wordline voltage that is used during a read operation in a flash memory (10) is disclosed by the present invention. In the preferred embodiment, a gate voltage is generated by a voltage booster (48) in a wordline voltage booster circuit (20). An adjustable clamp circuit (12) is electrically connected with the wordline voltage booster circuit (20) for clamping the gate voltage that is generated by the voltage booster (48) at a predetermined voltage level. The predetermined voltage level may be adjusted with a trimming circuit (14) that is electrically connected to the adjustable clamp circuit (12), depending on process variations experienced during fabrication by the adjustable clamp circuit (12).
Abstract:
A memory cell (104) made of two electrodes(106, 202, 108, 204) with a controllably conductive media between the two electrodes is disclosed. The controllably conductive media (110) contains an active low conductive layer (112) and passive layer (114). The controllably conductive media (110) changes its impedance when an external stimuli such as an applied electric field is imposed thereon. Methods of making the memory devices/cells, methods of using the memory devices/cells, and devices such as computers containing the memory devices/cells are also disclosed.
Abstract:
A reference trimming verify circuit and method is provided for performing a program verify operation on a reference cell transistor in an array of Flash EEPROM memory cells. A reference current branch (14) is used to generate a reference current corresponding to a predetermined overdrive voltage of the reference cell to be programmed. A drain current branch (16) is coupled to the reference cell transistor to be programmed and generates a drain current at a fixed gate voltage applied to its control gate and at a predetermined drain voltage applied to its drain when the drain current is at the desired level. A comparator (18) is used to compare a sensed voltage corresponding to the drain current and a reference voltage corresponding to the reference current. The comparator generates an output signal which is at a low logic level when the sensed voltage is less than the reference voltage and which is at a high logic level when the sensed voltage is greater than the reference voltage. A program pulse is applied to the reference transistor each time the comparator generates the low logic level and terminates the program pulse when the comparator generates the high logic level.