公开(公告)号：WO2018099690A1

公开(公告)日：2018-06-07

申请号：PCT/EP2017/078288

申请日：2017-11-06

Applicant: ASML NETHERLANDS B.V.

Inventor： VAN HAREN, Richard, Johannes, Franciscus ,  CALADO, Victor, Emanuel ,  VAN DIJK, Leon, Paul ,  WERKMAN, Roy ,  MOS, Everhardus, Cornelis ,  WILDENBERG, Jochem, Sebastiaan ,  JOCHEMSEN, Marinus ,  RAJASEKHARAN, Bijoy ,  JENSEN, Erik ,  URBANCZYK, Adam, Jan

IPC: G03F7/20 ,  H01L21/30 ,  H01L21/67 ,  H01L21/66

Abstract: A method to change an etch parameter of a substrate etching process, the method comprising: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.

公开(公告)号：WO2019110238A1

公开(公告)日：2019-06-13

申请号：PCT/EP2018/080708

申请日：2018-11-09

Applicant: ASML NETHERLANDS B.V.

Inventor： WERKMAN, Roy ,  RAJASEKHARAN, Bijoy ,  VERGAIJ-HUIZER, Lydia, Marianna ,  WILDENBERG, Jochem, Sebastiaan ,  VAN ITTERSUM, Ronald ,  SMORENBERG, Pieter, Gerardus, Jacobus ,  VAN DER HEIJDEN, Robertus, Wilhelmus ,  WEI, Xiuhong ,  YAGUBIZADE, Hadi

IPC: G03F7/20

Abstract: Disclosed is s method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method comprising: determining the plurality of corrections comprising a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein said determining step comprises determining corrections for each layer simultaneously in terms of a matching parameter.

公开(公告)号：WO2018197144A1

公开(公告)日：2018-11-01

申请号：PCT/EP2018/057961

申请日：2018-03-28

Applicant: ASML NETHERLANDS B.V.

Inventor： WILDENBERG, Jochem, Sebastiaan ,  JOCHEMSEN, Marinus ,  JENSEN, Erik ,  WALLERBOS, Erik, Johannes, Maria ,  RIJNIERSE, Cornelis, Johannes ,  RAJASEKHARAN, Bijoy ,  WERKMAN, Roy ,  SCHOONUS, Jurgen, Johannes, Henderikus, Maria

IPC: G03F7/20 ,  G05B19/418

Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating (406) measurement results of performance parameters (fingerprints) with the recorded process characteristics (context); obtaining (408) a characteristic (context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining (410) a characteristic (context) of a subsequent process (exposure) in the sequence to be performed on the product unit; determining (412) a predicted performance parameter (fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (fingerprints) corresponding to the recorded characteristics; and determining (414, 416) corrections to be applied (418) to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.

公开(公告)号：WO2020156738A1

公开(公告)日：2020-08-06

申请号：PCT/EP2019/085974

申请日：2019-12-18

Applicant: ASML NETHERLANDS B.V.

Inventor： WERKMAN, Roy ,  DECKERS, David, Frans, Simon ,  RAJASEKHARAN, Bijoy ,  VAZQUEZ RODARTE, Ignacio, Salvador ,  ROY, Sarathi

IPC: G03F7/20 ,  G03F9/00

Abstract: A method of determining a control parameter for a lithographic process is disclosed, the method comprising: defining a substrate model for representing a process parameter fingerprint across a substrate, the substrate model being defined as a combination of basis functions including at least one basis function suitable for representing variation of the process parameter fingerprint between substrates and/or batches of substrates; receiving measurements of the process parameter across at least one substrate; calculating substrate model parameters using the measurements and the basis functions; and determining the control parameter based on the substrate model parameters and the similarity of the at least one basis function to a process parameter fingerprint variation between substrates and/or batches of substrates.

公开(公告)号：EP3495889A1

公开(公告)日：2019-06-12

申请号：EP17205900.8

申请日：2017-12-07

Applicant: ASML Netherlands B.V.

Inventor： WERKMAN, Roy ,  RAJASEKHARAN, Bijoy ,  VERGAIJ-HUIZER, Lydia Marianna ,  WILDENBERG, Jochem Sebastiaan ,  VAN ITTERSUM, Ronald

IPC: G03F7/20

Abstract: Disclosed is a method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers. The method comprises determining (e.g., optimizing simultaneously) the plurality of corrections comprising a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer. The method may also take into account the allowed a process window for each layer.