Fluid extract system, lithography apparatus, and device manufacturing method
    4.
    发明专利
    Fluid extract system, lithography apparatus, and device manufacturing method 有权
    流体萃取系统,光刻设备和装置制造方法

    公开(公告)号:JP2010141325A

    公开(公告)日:2010-06-24

    申请号:JP2009277243

    申请日:2009-12-07

    CPC classification number: G03F7/70341 F01N1/023 G03F7/709

    Abstract: PROBLEM TO BE SOLVED: To provide a fluid handling system in which a vibration produced by two phase extraction is reduced or eliminated. SOLUTION: A liquid-immersion lithography usually is equipped with a fluid handling system. The handling system generally has a two phase fluid extraction system which removes a mixture of a gas and a liquid from a predetermined place. Since the extract fluid contains two phases, the pressure in the extract system varies sometimes. It is likely that the pressure variation passes through the liquid-immersion liquid to cause an incorrect exposing light. A buffer chamber can be used to reduce the pressure variation in the extract system. The buffer chamber may be connected to the fluid extract system in order to provide a fixed volume of gas to reduce the pressure variation. Substitutively or additionally, a flexible wall portion may be provided to somewhere in the fluid extract system. The flexible wall portion may respond to the pressure variation in the fluid extract system to change its shape. The change of the shape may be a help when the flexible wall portion reduces or eliminates the pressure variation. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种流体处理系统,其中减少或消除由两相萃取产生的振动。

    解决方案:液浸光刻通常配备有流体处理系统。 处理系统通常具有从预定位置去除气体和液体的混合物的两相流体萃取系统。 由于萃取液含有两相,萃取系统中的压力有时会变化。 压力变化很可能通过液浸液体导致不正确的曝光。 可以使用缓冲室来减少提取系统中的压力变化。 缓冲室可以连接到流体提取系统,以提供固定体积的气体以减小压力变化。 替代地或另外地,柔性壁部分可以设置在流体提取系统的某处。 柔性壁部分可以响应于流体提取系统中的压力变化以改变其形状。 当柔性壁部分减小或消除压力变化时,形状的变化可能是有帮助的。 版权所有(C)2010,JPO&INPIT

    Methods relating to immersion lithography, and immersion lithography apparatus
    6.
    发明专利
    Methods relating to immersion lithography, and immersion lithography apparatus 有权
    与倾斜平面图相关的方法和倾斜平面图

    公开(公告)号:JP2009088508A

    公开(公告)日:2009-04-23

    申请号:JP2008239006

    申请日:2008-09-18

    CPC classification number: G03F7/70916 G03F7/70341

    Abstract: PROBLEM TO BE SOLVED: To provide a method of detecting contamination of a liquid containment system and/or a method of determining the time, at which the liquid containment system of an immersion lithography apparatus needs cleaning. SOLUTION: A method of operating the liquid containment system of the immersion lithography apparatus is disclosed. Performances of the liquid containment system are measured by several different methods. On the basis of a result of the performance measurement, for example, a signal showing that it is required to take aid measure is generated. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种检测液体容纳系统的污染物的方法和/或确定浸没式光刻设备的液体容纳系统需要清洁的时间的方法。 公开了一种操作浸没式光刻设备的液体容纳系统的方法。 液体容纳系统的性能通过几种不同的方法测量。 基于性能测量的结果,例如,产生表示需要进行辅助测量的信号。 版权所有(C)2009,JPO&INPIT

    Lithographic device and method of manufacturing the same
    7.
    发明专利
    Lithographic device and method of manufacturing the same 有权
    光刻设备及其制造方法

    公开(公告)号:JP2008258613A

    公开(公告)日:2008-10-23

    申请号:JP2008085232

    申请日:2008-03-28

    Abstract: PROBLEM TO BE SOLVED: To provide a position control system for a lithographic device in which an accuracy of positioning a target portion with respect to a lens column or a projection system may be improved. SOLUTION: The position control system for a substrate support of a lithographic device includes a position measurement system constructed to specify a position of a sensor or a sensor target on the substrate support, a controller constructed to provide a control signal based on a desired position of a target portion of the substrate and the specified position, and one or more actuators constructed to act on the substrate support. The position control system includes a stiffness compensation model of the substrate support, which includes a relation between a difference in a change in a position of the target portion and a change in position of the sensor or sensor target, as a result of a force exerted on the substrate support. The position control system is constructed to substantially correct the position of the target portion using the stiffness compensation model at least during projection of a patterned radiation beam on the target portion. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种用于光刻设备的位置控制系统,其中可以提高目标部分相对于透镜柱或投影系统的定位精度。 解决方案:用于光刻设备的基板支撑件的位置控制系统包括:位置测量系统,其被构造成指定传感器或传感器目标在基板支撑件上的位置;控制器,被构造成提供基于 基板的目标部分和指定位置的期望位置,以及构造成作用在基板支撑件上的一个或多个致动器。 位置控制系统包括基板支撑件的刚度补偿模型,其包括目标部分的位置变化的差异与传感器或传感器目标的位置变化之间的关系,作为施加的力 在基板支撑上。 位置控制系统被构造成至少在图案化的辐射束在目标部分的投影期间使用刚度补偿模型来基本上校正目标部分的位置。 版权所有(C)2009,JPO&INPIT

    Fluid handling structure, lithographic apparatus, and device manufacturing method
    10.
    发明专利
    Fluid handling structure, lithographic apparatus, and device manufacturing method 有权
    流体处理结构,平面设备和设备制造方法

    公开(公告)号:JP2010287889A

    公开(公告)日:2010-12-24

    申请号:JP2010126422

    申请日:2010-06-02

    CPC classification number: G03F7/70341 Y10T137/8593

    Abstract: PROBLEM TO BE SOLVED: To disclose a fluid handling structure configured to supply and confine an immersion liquid in a space demarcated between a projection system and a counter surface countered to the system itself. SOLUTION: In a first portion of a lower surface of the fluid handling structure, a distance from the counter surface when using the first portion is different from that of a second portion of the lower surface. The first portion is demarcated in the structure itself and has a supply opening configured to supply liquid to the counter surface and an extraction opening configured to remove fluid from the space between the fluid handling structure and the counter surface. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:公开一种流体处理结构,其被配置为将浸没液体提供并限制在与系统本身相反的投影系统和反面之间划分的空间中。 解决方案:在流体处理结构的下表面的第一部分中,当使用第一部分时与对置表面的距离不同于下表面的第二部分的距离。 第一部分在结构本身中划定,并且具有供应开口,其构造成将液体供应到相对表面,以及提取开口,构造成从流体处理结构和对置表面之间的空间移除流体。 版权所有(C)2011,JPO&INPIT

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