Abstract:
PURPOSE: A lithography apparatus and a method for manufacturing a device are provided to control the flow of fluid through a fluid inlet by varying the flux of the fluid. CONSTITUTION: An illuminator(IL) receives a radiation beam(B) from a radiation source(SO). The illuminator includes an adjusting unit(AD) which adjusts the angular intensity distribution of the radiation beam. The radiation beam passes through a projection system(PS) and is focused on the target parts(C) on a substrate(W). A first location setting unit(PM) accurately locates a pattern device(MA). A substrate table(WT) moves to locate the target parts in the path of the radiation beam.
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus in which a barrier member is combined with a shutter member so as to keep a final element of the projection system wet during substrate swap. SOLUTION: An immersion lithographic apparatus is disclosed that includes a fluid confinement system configured to confine fluid to a space between a projection system and a substrate. The fluid confinement system includes a fluid inlet to supply fluid, the fluid inlet connected to an inlet port and an outlet port. The immersion lithographic apparatus further includes a fluid supply system configured to control fluid flow through the fluid inlet by varying the flow rate of fluid provided to the inlet port and the flow rate of fluid removed from the outlet port. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic process where a process error caused by one or more heat sources can be reduced or minimized. SOLUTION: An immersion lithographic apparatus is provided. The immersion lithographic apparatus has a substrate table including a drain so configured as to receive an immersion liquid leaking into a gap between the edge of a substrate on the substrate table and the edge of a concave portion where the substrate is disposed. By directing one or more jets of the liquid toward the back side of a portion that supports the substrate, at least a portion of the concave portion that supports the substrate is thermally adjusted, thus providing a thermal adjustment system in the immersion lithographic apparatus. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system that reduces an influence of a droplet on a final optical element, or substantially avoids the formation of such a droplet. SOLUTION: This lithography device includes: a projection system PS; and a liquid confinement structure for at least partially confining an immersion liquid in an immersion space demarcated by the projection system, a liquid confinement structure 12, and also a substrate and/or a substrate table. A wet gas space for confining a wet gas is demarcated among the projection system, the liquid confinement structure, and the immersion liquid in the immersion space. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus that combines a barrier member with a shutter member to keep the final element of a projection system wet during the replacement of a substrate. SOLUTION: A liquid immersion lithographic apparatus includes a fluid confinement system for confining a fluid in a space between the projection system and a substrate. The liquid confinement system includes an inlet port to supply liquid, and a fluid entrance connected to an outlet port. The liquid immersion lithographic apparatus further includes a fluid supply system to control the fluid flow passing through the fluid entrance by changing a flow rate of fluid supplied to the entrance port and a flow rate of fluid removed from the outlet port. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system for reducing the effect of an interface between a last optical element and droplets and/or a gas and a liquid, on the last optical element.SOLUTION: A lithographic apparatus includes: a projection system; and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or a substrate table. Here, a measure is taken to reduce the effect of droplets and/or a liquid film on the last optical element of the projection system.
Abstract:
PROBLEM TO BE SOLVED: To provide a system to reduce effect of droplets and/or a boundary surface between gas/liquid and a final element on the final element, or to substantially avoid such droplet formation.SOLUTION: A lithographic apparatus comprises: a projection system; and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure, and a substrate and/or a substrate table. In the lithographic apparatus, means is taken for, e.g., reducing effect of droplets on a final element of the projection system or substantially avoiding such droplet formation.
Abstract:
PROBLEM TO BE SOLVED: To provide a system to reduce effect of droplets and/or an interface between gas/liquid and a final element on the final element or to substantially avoid such droplet formation.SOLUTION: A lithographic apparatus comprises a projection system, and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or substrate table. In the lithographic apparatus, means is taken for, e.g., reducing effect of droplets lying on a final element of the projection system or substantially avoiding such droplet formation.
Abstract:
PROBLEM TO BE SOLVED: To provide a system that reduces an influence of a droplet to a final element and/or an influence of gas and liquid to the interface of the final element, or substantially avoids the formation of such a droplet. SOLUTION: This lithography device includes: a projection system PS; and a liquid confinement structure for at least partially confining an immersion liquid in an immersion space demarcated by the projection system, a liquid confinement structure 12, and also a substrate and/or a substrate table. In the lithography device, for example, the influence of the droplet on the final element of the projection system PS is reduced, or the formation of such a droplet is avoided substantially. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system to reduce effect of droplets on a last optical element or substantially to avoid such droplet formation.SOLUTION: A lithographic apparatus comprises a projection system, and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or substrate table. A humid gas space is defined between the projection system, the liquid confinement structure and the immersion liquid in the immersion space, the humid gas space being configured to confine humid gas.