公开(公告)号：NL2004322A

公开(公告)日：2010-10-14

申请号：NL2004322

申请日：2010-03-02

Applicant: ASML NETHERLANDS BV

Inventor： KNARREN BASTIAAN ,  TURK RAYMOND ,  KOOIKER EELCO ,  BOONEN NICO

IPC: G03F7/20

Abstract: A cooling arrangement is described and includes a heat sink having a first thermal contact surface, an object having a second thermal contact surface and a resilient wall. The first thermal contact surface and the second thermal contact surface face each other and define a gap. The resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and the cooling arrangement includes a facility to maintain a pressure difference between the space and an environment of the cooling arrangement. Additionally, a lithographic apparatus comprising such a cooling arrangement is described.

公开(公告)号：NL2010477A

公开(公告)日：2013-11-25

申请号：NL2010477

申请日：2013-03-19

Applicant: ASML NETHERLANDS BV

Inventor： LAURENT THIBAULT ,  JACOBS JOHANNES HENRICUS WILHELMUS ,  KOK HAICO ,  VIJVER YURI ,  WAL JOHANNES ,  KNARREN BASTIAAN ,  VOOGD ROBBERT JAN ,  WESTERLAKEN JAN STEVEN CHRISTIAAN ,  RIJDT HANS ,  KOOIKER EELCO ,  HURKENS-MERTENS WILHELMINA MARGARETA JOZEF ,  TEILLET YOHANN BRUNO YVON

IPC: G03F7/20

公开(公告)号：NL2004242A

公开(公告)日：2010-10-14

申请号：NL2004242

申请日：2010-02-15

Applicant: ASML NETHERLANDS BV

Inventor： KNARREN BASTIAAN ,  TURK RAYMOND ,  KOOIKER EELCO

IPC: G03F7/20