Abstract:
PROBLEM TO BE SOLVED: To disclose a fluid handling structure designed for all wet liquid immersion lithography. SOLUTION: The fluid handling structure has: a first opening for providing a fluid to a space between the final element of a projection system and a substrate and/or a substrate table; a barrier for preventing a liquid flow coming out of a space between the fluid handling structure and the substrate; and a second opening for being open to the radial outer side of the space and providing a fluid flow to the upper surface of the substrate and/or the substrate table on the radial outer side of the space from the fluid handling structure. A controller can be set so that a fluid flow going toward the center of the substrate table becomes larger than a fluid flow in a direction apart from the center of the substrate table. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system that reduces an influence of a droplet on a final optical element, or substantially avoids the formation of such a droplet. SOLUTION: This lithography device includes: a projection system PS; and a liquid confinement structure for at least partially confining an immersion liquid in an immersion space demarcated by the projection system, a liquid confinement structure 12, and also a substrate and/or a substrate table. A wet gas space for confining a wet gas is demarcated among the projection system, the liquid confinement structure, and the immersion liquid in the immersion space. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system to reduce effect of droplets on a last optical element or substantially to avoid such droplet formation.SOLUTION: A lithographic apparatus comprises a projection system, and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or substrate table. A humid gas space is defined between the projection system, the liquid confinement structure and the immersion liquid in the immersion space, the humid gas space being configured to confine humid gas.
Abstract:
PROBLEM TO BE SOLVED: To provide an immersion lithographic device capable of keeping the position of a liquid as constant as possible by controlling the position of an immersion liquid in the immersion lithographic device.SOLUTION: The immersion lithographic device includes a curved surface that is curved so that drainage force of surface tension acts in a certain direction on a film of an immersion liquid on the curved surface. In relation to a liquid trapping structure constructed or configured to trap a liquid in an immersion space between a final element of a projection system and a board table and/or a board supported to the board table, a liquid trapping structure is also provided including a curved surface that is curved so that drainage force of surface tension acts in a certain direction on a film of an immersion liquid on the curved surface.
Abstract:
PROBLEM TO BE SOLVED: To provide a system for reducing the effect of an interface between a last optical element and droplets and/or a gas and a liquid, on the last optical element.SOLUTION: A lithographic apparatus includes: a projection system; and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or a substrate table. Here, a measure is taken to reduce the effect of droplets and/or a liquid film on the last optical element of the projection system.
Abstract:
PROBLEM TO BE SOLVED: To disclose a lithographic projection apparatus including a cleaning station. SOLUTION: Several embodiments of a cleaning station are disclosed. In an embodiment, measures are taken to avoid contact of a cleaning fluid with a final element of a projection system. In an embodiment, measures are taken to avoid foaming of the cleaning fluid. The use of a thermally isolated island is also disclosed as well as its optimal position. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system to reduce effect of droplets and/or a boundary surface between gas/liquid and a final element on the final element, or to substantially avoid such droplet formation.SOLUTION: A lithographic apparatus comprises: a projection system; and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure, and a substrate and/or a substrate table. In the lithographic apparatus, means is taken for, e.g., reducing effect of droplets on a final element of the projection system or substantially avoiding such droplet formation.
Abstract:
PROBLEM TO BE SOLVED: To provide a system to reduce effect of droplets and/or an interface between gas/liquid and a final element on the final element or to substantially avoid such droplet formation.SOLUTION: A lithographic apparatus comprises a projection system, and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or substrate table. In the lithographic apparatus, means is taken for, e.g., reducing effect of droplets lying on a final element of the projection system or substantially avoiding such droplet formation.
Abstract:
PROBLEM TO BE SOLVED: To provide a system that reduces an influence of a droplet to a final element and/or an influence of gas and liquid to the interface of the final element, or substantially avoids the formation of such a droplet. SOLUTION: This lithography device includes: a projection system PS; and a liquid confinement structure for at least partially confining an immersion liquid in an immersion space demarcated by the projection system, a liquid confinement structure 12, and also a substrate and/or a substrate table. In the lithography device, for example, the influence of the droplet on the final element of the projection system PS is reduced, or the formation of such a droplet is avoided substantially. COPYRIGHT: (C)2010,JPO&INPIT