COPOLYMERIZABLE ETHYLENIC UNSATURATED-GROUP CONTAINING COMPOUND FOR AQUEOUS DISPERSANT AND ITS STABILIZER

    公开(公告)号:JPH1060223A

    公开(公告)日:1998-03-03

    申请号:JP9039197

    申请日:1997-04-09

    Applicant: BASF AG

    Abstract: PROBLEM TO BE SOLVED: To obtain a dispersion of a copolymerizable ethylenic unsaturated- group containing compound that if prepared to have an excellent storage stability of polymer particles without coagulation of the dispersion by containing a specific stabilizer and useful for production of coatings, etc. SOLUTION: This copolymerizable ethylenic unsaturated-group containing compound contains, out of stabilizers of formula I [(m) is 1-100; R and R are each a 1-4C alkyl, phenyl, etc.; R3 is H, hydroxyl, a primary amino, etc,; R is H, a 1-12C alkyl, etc.)] that have one or more piperidine-N-oxide groups tetra-substituted in their 2, 2, 6, and 6 sites, a stabilizer of formula II, etc., preferably in a quantity of 0,.001-0.5wt.% based on the above copolymerizable ethylenic unsaturated-group containing compound, which is preferably polyurethane, the content of ethylenic unsaturated groups of which is preferably 0.005-0.4mol based on 100g of the polyurethane.

    4-ACYLAMINOPIPERIDINE-N-OXYLS
    5.
    发明专利

    公开(公告)号:CZ274397A3

    公开(公告)日:1998-01-14

    申请号:CZ274397

    申请日:1996-03-15

    Applicant: BASF AG

    Abstract: PCT No. PCT/EP96/01122 Sec. 371 Date Sep. 22, 1997 Sec. 102(e) Date Sep. 22, 1997 PCT Filed Mar. 15, 1996 PCT Pub. No. WO96/29311 PCT Pub. Date Sep. 26, 19964-Acylaminopiperidine N-oxides IaA1B1(Ia)where A1 is hydrogen or an organic radical and B1 is a radical IIa where R1-R4 are each C1-C4-alkyl and R1 and R2, on the one hand, and R3 and R4, on the other hand, may furthermore be bonded to form a 5-membered or 6-membered ring, R5 is H or C114 C4-alkyl and R6 is H or C1-C18-alkyl, are used for stabilizing organic materials against the harmful effect of free radicals, particularly in the distillation of monomers which undergo free radical polymerization, especially styrene.

    9.
    发明专利
    未知

    公开(公告)号:DE19650563A1

    公开(公告)日:1998-06-10

    申请号:DE19650563

    申请日:1996-12-05

    Applicant: BASF AG

    Abstract: The invention concerns flame-resistant thermoplastic moulding compounds containing: A) between 1 and 97 wt % of at least one polycarbonate, polyamide, polyester, polyolefin or polymethacrylate or a mixture of the above-mentioned thermoplastic polymers; B) between 1 and 97 wt % of at least one graft polymer consisting of: b1) between 40 and 80 wt % of a graft basis comprising a rubber-elastic polymer with a glass transition temperature of less than 0 DEG C; and b2) between 20 and 60 wt % of a graft overlay comprising: b21) between 50 and 95 wt % vinylaromatic monomers of general formula PHI , in which R designates a C1-C8 alkyl group or a hydrogen atom and R designates a C1-C8 alkyl group, and n has the value 0, 1, 2 or 3 or methylmethacrylate or mixtures thereof; and b22) between 5 and 50 wt % acrylonitrile, methacrylonitrile, methylmethacrylate, maleic acid anhydride or mixtures thereof; C) between 1 and 97 wt % of at least one thermoplastic copolymer comprising: c1) between 50 and 95 wt % vinylaromatic monomers of general formula PHI or methylmethacrylate or mixtures thereof; and c2) between 5 and 50 wt % acrylonitrile, methacrylonitrile, methylmethacrylate, maleic acid anhydride or mixtures thereof; D) between 1 and 50 wt % flame retardants containing iminophosphoranes; and E) between 0 and 50 wt % further additives.

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