NONPOLYMERIC ANTIREFLECTION COMPOSITIONS CONTAINING ADAMANTYL GROUPS

    公开(公告)号:SG11201404229YA

    公开(公告)日:2014-08-28

    申请号:SG11201404229Y

    申请日:2013-01-17

    Abstract: Nonpolymeric compounds, compositions, and methods for forming microelectronic structures, and the structures formed therefrom are provided. The nonpolymeric compounds are ring-opened, epoxide-adamantane derivatives that comprise at least two epoxy moieties and at least one adamantyl group, along with at least one chemical modification group, such as a chromophore, bonded to a respective epoxy moiety. Anti-reflective and/or planarization compositions can be formed using these compounds and used in lithographic processes, including fabrication of microelectronic structures.

    SPIN-ON CARBON COMPOSITIONS FOR LITHOGRAPHIC PROCESSING
    8.
    发明公开
    SPIN-ON CARBON COMPOSITIONS FOR LITHOGRAPHIC PROCESSING 审中-公开
    安格鲁布·柯林顿·弗朗西斯·马萨诸塞

    公开(公告)号:EP2766920A4

    公开(公告)日:2015-05-27

    申请号:EP12840652

    申请日:2012-10-10

    Abstract: The invention described herein is directed towards spin-on carbon materials comprising polyamic acid compositions and a crosslinker in a solvent system. The materials are useful in trilayer photolithography processes. Films made with the inventive compositions are not soluble in solvents commonly used in lithographic materials, such as, but not limited to PGME, PGMEA, and cyclohexanone. However, the films can be dissolved in developers commonly used in photolithography. In one embodiment, the films can be heated at high temperatures to improve the thermal stability for high temperature processing. Regardless of the embodiment, the material can be applied to a flat/planar or patterned surface. Advantageously, the material exhibits a wiggling resistance during pattern transfer to silicon substrate using fluorocarbon etch.

    Abstract translation: 本文描述的本发明涉及在溶剂体系中包含聚酰胺酸组合物和交联剂的旋涂碳材料。 这些材料在三层光刻工艺中是有用的。 用本发明组合物制成的薄膜不溶于通常用于平版印刷材料的溶剂中,例如但不限于PGME,PGMEA和环己酮。 然而,这些膜可以溶解在通常用于光刻中的显影剂中。 在一个实施方案中,可以在高温下加热膜以改善用于高温处理的热稳定性。 不管实施例如何,材料可以应用于平面/平面或图案化的表面。 有利的是,使用碳氟化合物蚀刻在材料图案转移到硅衬底期间材料表现出摆动阻力。

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