토출재 토출 장치 및 임프린트 장치

    公开(公告)号:KR20200125494A

    公开(公告)日:2020-11-04

    申请号:KR20200049260

    申请日:2020-04-23

    Applicant: CANON KK

    Abstract: 토출재토출장치는, 토출재를토출하도록구성되는토출구를포함하는토출유닛; 토출재의토출을제어하도록구성되는전기기판; 토출유닛에접속되는제1 가요성케이블; 전기기판에접속되는제2 가요성케이블; 및제1 가요성케이블및 제2 가요성케이블이이방성도전필름에의해접합되는접합부를포함하며, 접합부는토출재에내성이있는밀봉재로피복된다.

    Exposure apparatus and device manufacturing method
    6.
    发明授权
    Exposure apparatus and device manufacturing method 有权
    曝光装置和装置制造方法

    公开(公告)号:US6424405B2

    公开(公告)日:2002-07-23

    申请号:US79434001

    申请日:2001-02-28

    Applicant: CANON KK

    CPC classification number: G03F7/70558 G03F7/70358

    Abstract: An exposure apparatus includes an illumination system for illuminating, with pulse light, a reticle having a pattern formed thereon, a reticle stage for scanning the reticle, a projection system for projecting the pattern onto a wafer, a wafer stage for scanning the wafer, an interface into which information related to the reticle is inputted and a controller for changing illumination conditions on the basis of the information inputted to the interface. The reticle is illuminated with the pulse light while the reticle and the wafer are scanned, by which the pattern of the reticle is transferred to the wafer sequentially.

    Abstract translation: 曝光装置包括照明系统,用于用脉冲光照射具有形成在其上的图案的掩模版,用于扫描掩模版的标线片台,用于将图案投影到晶片上的投影系统,用于扫描晶片的晶片台, 输入与掩模版有关的信息的接口,以及基于输入到界面的信息来改变照明条件的控制器。 在掩模版和晶片被扫描的同时用脉冲光照亮掩模版,通过该标线将光罩的图案依次传送到晶片。

    IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE

    公开(公告)号:SG11201605280UA

    公开(公告)日:2016-08-30

    申请号:SG11201605280U

    申请日:2015-01-20

    Applicant: CANON KK

    Abstract: The present invention provides an imprint apparatus that molds an imprint material on a shot region of a substrate by using a mold, comprising a detection unit configured to detect first light with which a first mark of the mold and a second mark of the substrate are irradiated and measure a position deviation between the first mark and the second mark, a heating unit configured to irradiate the substrate with second light for heating the substrate and deforming the shot region, and a control unit configured to control alignment between the mold and the substrate based on the position deviation, wherein a parameter of the detection unit or the heating unit is set not to detect the second light by the detection unit while the first light is detected and the substrate is irradiated with the second light.

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