Semiconductor device and package structure

    公开(公告)号:US11227978B2

    公开(公告)日:2022-01-18

    申请号:US16680214

    申请日:2019-11-11

    Abstract: A semiconductor device and a package structure are provided. The semiconductor device includes a substrate, a light-emitting structure, a first semiconductor layer, a second semiconductor layer and a first electrode. The light-emitting structure is on the substrate. The first semiconductor layer is on the light-emitting structure. The second semiconductor layer is between the first semiconductor layer and the light-emitting structure. The first electrode is on the second semiconductor layer. At least a portion of the first electrode is separated from the first semiconductor layer.

    Light-emitting device
    8.
    发明授权
    Light-emitting device 有权
    发光装置

    公开(公告)号:US09331239B1

    公开(公告)日:2016-05-03

    申请号:US14793389

    申请日:2015-07-07

    CPC classification number: H01L33/06 H01L33/025 H01L33/14 H01L33/30

    Abstract: A light-emitting device is provided. The light-emitting device comprises a light-emitting stack comprising a first cladding layer of n type, a second cladding layer of p type, and an active layer between the first cladding layer and the second cladding layer wherein the active layer comprises a well layer interposed between adjacent barrier layers. The light-emitting device further comprises a means for reducing a flicker noise of the light-emitting device.

    Abstract translation: 提供了一种发光装置。 发光装置包括发光层,其包括n型的第一包层,p型的第二包层和在第一包层和第二包层之间的有源层,其中有源层包括阱层 介于相邻阻挡层之间。 发光装置还包括用于降低发光装置的闪烁噪声的装置。

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