公开(公告)号：JPH0641763A

公开(公告)日：1994-02-15

申请号：JP16230391

申请日：1991-06-07

Applicant: IBM

Inventor： HARII RANDORU BITSUKUFUOODO ,  PIITAA JIEIMUZU DEYUUKU ,  ERIZABESU FUOSUTAA ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  BOYA RISUTA MARUKOBITSUKU ,  RINDA KARORIN MASHIYUU ,  DONARUDO JIIN MAKUBURAIDO ,  TERENSU ROBAATO OTOUURU ,  SUTEIIBUN RIIOU TEISUDEIRU ,  ARUFURETSUDO BIIBETSUKU

IPC: C08J3/24 ,  C23C18/20 ,  C23C18/28 ,  C25D5/56 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

公开(公告)号：JPH09103732A

公开(公告)日：1997-04-22

申请号：JP23449696

申请日：1996-09-04

Applicant: IBM

Inventor： ERIZABESU FUOSUTAA ,  JIEFURII SHII HEDORITSUKU ,  ROBAATO EMU JIYATSUPU ,  KONSUTANTEINOSU PAPATOMASU ,  SUTEFUAN ERU TEISUDEERU ,  ARUFURETSUDO BUIIBETSUKU

IPC: B05C11/10 ,  B05C5/02 ,  B05C5/04 ,  B29B15/12

Abstract: PROBLEM TO BE SOLVED: To precisely and easily supply a fluid to a substrate by providing a head member having plural fluid injectors and a means for controlling the amt. of the fluid to be supplied to a workpiece. SOLUTION: Two parallel head members 11 and 11' each having plural fluid injectors are provided with the means 23 and 23' to seal the second fluids 25 and 25' at a second pressure almost equal to or higher than the pressure of the first fluids 15 and 15'. The first fluids 15 and 15', e.g. an epoxy resin soln., are supplied to the specified positions 17 and 17' on a glass substrate 19 as the workpiece. Namely, the substrate 19 is coated with the fluids before being used as the material for a printed circuit board. At this time, the second fluids 25 and 25', e.g. nitrogen, are supplied to the specified positions 17 and 17' to limit the first fluids 15 and 15' and collided with almost the central position of the feeder 10. The fluids are supplied to the substrate 19 precisely and easily in this way.

公开(公告)号：JPH07173637A

公开(公告)日：1995-07-11

申请号：JP24634794

申请日：1994-10-12

Applicant: IBM

Inventor： HARII RANDORU BITSUKUFUOODO ,  PIITAA JIEIMUZU DEYUUKU ,  ERIZABESU FUOSUTAA ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  BOYA RISUTA MARUKOBITSUKU ,  RINDA KARORIN MASHIYUU ,  DONARUDO JIIN MAKUBURAIDO ,  TERENSU ROBAATO OTOUURU ,  SUTEIIBUN RIIOU TEISUDEIRU ,  ARUFURETSUDO BIIBETSUKU

IPC: C08J3/24 ,  C23C18/20 ,  C23C18/28 ,  C25D5/56 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

公开(公告)号：JPH0661597A

公开(公告)日：1994-03-04

申请号：JP24157292

申请日：1992-09-10

Applicant: IBM

Inventor： ARI AFUZARIIARUDAKANI ,  BODEIRU ERISABESU BUREIREN ,  SHIYAAROKU DAIJIYABUA ,  RODONII TOREBOO HODOSON ,  SUTEIIBUN AARU MORISU ,  ARUFURETSUDO BIIBETSUKU ,  ASHITSUTO AABINDO MEETA ,  SUTEFUAN REO TEISUDEERU ,  JIEFURII KAATEISU HEDORITSUKU ,  JIEEN MAAGARETSUTO SHIYAU ,  ERIZABESU FUOSUTAA ,  JIYUAN AYARAESUKUIRIN ,  JIEMUSU RUPUTON HEDORITSUKU JI

IPC: C08J7/00 ,  C08K3/04 ,  C08K9/02 ,  H01B3/30 ,  H01L21/312 ,  H05K1/03 ,  H05K3/10

Abstract: PURPOSE: To obtain a composite material which allows the physical properties of a polymer material to be changed. CONSTITUTION: This material contains a composite materials of a fluorinated granular carbon dispersed in a polymer material and conductor pattern. The fluorocarbon content of the composite material is enough to make the dispersed content. of the composite material lower than that of the polymer material. The composite material can be made conductive by irradiating with an UV excimer laser.