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公开(公告)号：JPH05197147A
公开(公告)日：1993-08-06
申请号：JP16475691
申请日：1991-07-05
Applicant: IBM
Inventor： BOYA RISUTA MARUKOBITSUKU , ASHITO AABINDO MEETA , YUUJIIN ROOMAN SUKARUBINKO , DEIBITSUDO UEI WAN
IPC: G03F7/004 , G03F7/023 , G03F7/029 , G03F7/038 , G03F7/30 , H01L21/027 , H01L21/30 , H05K3/06 , H05K3/28 , H05K3/34
Abstract: PURPOSE: To lower a heat expansion coefficient and to enhance resistance to high temperature and photopatternability characteristics and the like by using the composition comprising a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. CONSTITUTION: The photopatternable composition comprises the cationically polymerizable epoxy resin, the solvent material and the photosensitive cationic photoiniciator mixed with the optically transparent ceramic filler and it is thermally stable at 360 deg.C. This composition is polymerized by exposure to ultraviolet rays. The unexposed areas of the composition are not polymerized by selectively shielding the composition from ultraviolet rays with a pattern or stencil, and these nonpolymerized areas are dissolved in a proper solvent and removed, and the remaining developed areas are hardened to a sufficient cross-linking degree and made resistant enough to exposure at 360 deg.C and to be made a tough protective coat having a heat expansion coefficient similar to solder.
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