公开(公告)号：JP2006019730A

公开(公告)日：2006-01-19

申请号：JP2005184662

申请日：2005-06-24

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： BEZAMA RASCHID J ,  COLGAN EVAN GEORGE ,  MAGERLEIN JOHN H ,  SCHMIDT ROGER R

IPC: H01L23/473

CPC classification number: F28F3/04 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method of cooling an electronic device such as an IC chip or the like uneven in power density distribution, mounted on a package substrate upside down with efficiency and low operating pressure. SOLUTION: The invention comprises the apparatus and the method operated by microchannel cooling which locally improve cooling capability with respect to a (hot spot) region of the IC chip higher than an average in power density by operating a mechanism varying local cooling capability with respect to a high power density region (namely, "hot spot") of a semiconductor chip higher than the average in the power density. For example, an integrally formed microchannel cooling device (or a microchannel heat sink device) cooling the IC chip is designed so that the local cooling capability with respect to the high power density region (namely, "hot spot") of the IC chip higher than the average in the power density can vary in such a way that a cooling fluid flows and distributed uniformly, and that a pressure drop along a cooling liquid passage is suppressed to a minimum. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种以功率密度分布不​​均匀的电子器件如IC芯片等的冷却装置和方法，其以效率和低的操作压力上下颠倒地安装在封装衬底上。 解决方案：本发明包括通过微通道冷却操作的装置和方法，其通过操作改变局部冷却能力的机构来局部地提高相对于IC芯片的（热点）区域的功率密度的平均值的冷却能力 相对于高于功率密度的平均值的半导体芯片的高功率密度区域（即，“热点”）。 例如，设计冷却IC芯片的整体形成的微通道冷却装置（或微通道散热装置），使得相对于IC芯片的高功率密度区域（即，“热点”）的局部冷却能力更高 功率密度的平均值可以以冷却流体均匀流动并分布的方式变化，并且沿着冷却液通道的压降被抑制到最小。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2003330007A

公开(公告)日：2003-11-19

申请号：JP2003133517

申请日：2003-05-12

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

Inventor： SUZUKI MASARU ,  COLGAN EVAN GEORGE ,  DOANY FUAD ELIAS ,  SINGH RAMA NAND

IPC: F21V8/00 ,  G02B3/00 ,  G02B6/00 ,  G02F1/1335 ,  G02F1/13357 ,  G09F9/00

CPC classification number: G02B6/0053 ,  G02B6/0038 ,  G02F1/133526

Abstract: PROBLEM TO BE SOLVED: To provide a liquid crystal display panel having heightened luminance and heightened radiation distribution of light emitted from the liquid crystal display panel. SOLUTION: In a direct view liquid crystal display device 1, a lenticular lens sheet 5 is disposed on the rear surface of the liquid crystal display panel 4. Light irradiating lenses 52 of the lenticular lens sheet 5 once converges in the liquid crystal display panel 4 and subsequently diffuses and when the light is emitted from the liquid crystal display panel 4 the radiation distribution of the light is broadened. Consequently a bright display screen is realized throughout a wide viewing angular range. COPYRIGHT: (C)2004,JPO

Abstract translation: 解决的问题：提供一种液晶显示面板发出的光的亮度增加和辐射分布提高的液晶显示面板。 解决方案：在直视液晶显示装置1中，双凸透镜片5设置在液晶显示面板4的后表面上。双凸透镜片5的光照射透镜52一旦会聚在液晶 显示面板4，随后扩散，并且当从液晶显示面板4发出光时，光的辐射分布变宽。 因此，在广泛的视角范围内实现了明亮的显示屏。 版权所有（C）2004，JPO

公开(公告)号：JP2009278089A

公开(公告)日：2009-11-26

申请号：JP2009113560

申请日：2009-05-08

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： COLGAN EVAN GEORGE ,  MAGERLEN JOHN HAROLD ,  SCHMIDT ROGER R ,  GAYNES MICHAEL ANTHONY ,  MARSTON KENNETH CHARLES ,  HILTON T TOY

IPC: H01L23/473 ,  H01L25/04 ,  H01L25/18

CPC classification number: H01L23/473 ,  F28F3/086 ,  F28F3/12 ,  F28F2260/02 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a multi-chip module having a liquid-cooling module which provides a thermal conductive path having a different thermal resistance for each chip, and minimizes a stress at a thermally conductive adhesive portion by heat in order to dissipate effectively heat from the plurality of chips having cooling requirements different from each other, and to provide a method for manufacturing the same. SOLUTION: An electronic apparatus is thermally conductively connected to a first chip 12 and a second chip 13, and includes a cooling liquid inlet, a cooling liquid outlet, and a cooling module 20 having a cooling liquid flow path extending from the cooling liquid inlet to the cooling liquid outlet. The first chip is thermally conductively connected to a first portion to be cooled by a cooling liquid flowing in the cooling liquid flow path in the cooling module, and the second chip is thermally conductively connected to a second portion to be cooled by the cooling liquid being warmed as a result of cooling the first chip and flowing in the cooling liquid flow path in the cooling module. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种具有液体冷却模块的多芯片模块，其为每个芯片提供具有不同热阻的导热路径，并且通过热量按顺序将热导电粘合剂部分处的应力最小化 有效地散热来自具有彼此不同的冷却要求的多个芯片的热量，并提供其制造方法。 解决方案：电子设备与第一芯片12和第二芯片13导热连接，并包括冷却液入口，冷却液出口和冷却模块20，冷却模块20具有从冷却 冷却液出口的液体入口。 第一芯片与通过在冷却模块中的冷却液流路中流动的冷却液冷却的第一部分导热连接，第二芯片与第二部分导热连接，第二部分被冷却液冷却 由于冷却第一芯片并在冷却模块中的冷却液流动路径中流动而加热。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2001308345A

公开(公告)日：2001-11-02

申请号：JP2001090670

申请日：2001-03-27

Applicant: IBM

Inventor： PAUL STEVEN ANDREE ,  COLGAN EVAN GEORGE ,  JOHN C FLAKE ,  PETER FRYER ,  WILLIAM GRAHAM ,  EUGENE O'SULLIVAN

IPC: H01L21/28 ,  H01L21/225 ,  H01L21/336 ,  H01L29/417 ,  H01L29/45 ,  H01L29/786

Abstract: PROBLEM TO BE SOLVED: To provide a method for simplifying formation of an ohmic contact for a thin film transistor. SOLUTION: The method for forming an ohmic contact for a semiconductor device includes a step of forming a metal-contained layer containing integrally formed dopants. The metal-contained layer is patterned to form a constituent element of the semiconductor device, and a semiconductor layer is deposited in contact with the metal-contained layer. The semiconductor device is annealed so that dopants are outwardly diffused from the metal-contained layer within the semiconductor layer to thereby form an ohmic contact.

公开(公告)号：CA2358685C

公开(公告)日：2007-04-10

申请号：CA2358685

申请日：2001-10-12

Applicant: IBM

Inventor： COLGAN EVAN GEORGE ,  NOGUCHI MICHIKAZU ,  SUZUKI MASARU ,  HEITOH TSUNEO

IPC: G02B27/62 ,  G02F1/13 ,  G01B11/27 ,  G02B7/28 ,  G02F1/1333 ,  G02F1/1335

Abstract: The present invention provides a method of alignment between sheet materials , a method of alignment, a substrate assembling method, and an aligning apparatus, which a re capable of easily and surely performing highly accurate alignment and suppressing a reduction in material yield. After alignment performed based on a band-like light as a reference, alignment is performed based on a joint of a condenser lens portion of a lenticular lens as a reference. More specifically, the deviation of a liquid crystal display cell in a rotational direction is corrected by using a light emitted from a light source and condensed to be band-like at the lenticular lens as a reference. Subsequently, by changing a depth of focus of a microscope, measurement is performed for positions of a black matrix of the liquid crystal display cell and the joint of the condenser lens porti on of the lenticular lens. Then, based on the result of the measurement, horizontal alignment is performed between the liquid crystal display cell and the lenticular lens.

公开(公告)号：CA2172751A1

公开(公告)日：1996-10-29

申请号：CA2172751

申请日：1996-03-27

Applicant: IBM

Inventor： COLGAN EVAN GEORGE ,  HARPER JAMES MCKELL EDWIN ,  KAUFMAN FRANK BENJAMIN ,  MANNY MARGARET PAGGI ,  MELCHER ROBERT LEE ,  SPEIDELL JAMES LOUIS

IPC: G02F1/1335 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  G09G3/36

Abstract: A reflective spatial light modulator array is described incorporating liquid crystal devices, mirrors, a semiconductor substrate, electrical circuits, and a reflector/absorber layer for blocking light. The invention overcomes the problem of shielding light from semiconductor devices, high optical throughput and contrast, pixel storage capacitance to hold the voltage across the liquid crystal device and precise control of the liquid crystal device thickness without spacers obscuring the mirrors.

公开(公告)号：CA2358685A1

公开(公告)日：2002-06-12

申请号：CA2358685

申请日：2001-10-12

Applicant: IBM

Inventor： SUZUKI MASARU ,  COLGAN EVAN GEORGE ,  NOGUCHI MICHIKAZU ,  HEITOH TSUNEO

IPC: G02F1/13 ,  G02F1/1333 ,  G02F1/1335 ,  G02B27/62 ,  G02B7/28

Abstract: The present invention provides a method of alignment between sheet materials , a method of alignment, a substrate assembling method, and an aligning apparatus, which a re capable of easily and surely performing highly accurate alignment and suppressing a reduction in material yield. After alignment performed based on a band-like light as a reference, alignment is performed based on a joint of a condenser lens portion of a lenticular lens as a reference. More specifically, the deviation of a liquid crystal display cell in a rotational direction is corrected by using a light emitted from a light source and condensed to be band-like at the lenticular lens as a reference. Subsequently, by changing a depth of focus of a microscope, measurement is performed for positions of a black matrix of the liquid crystal display cell and the joint of the condenser lens porti on of the lenticular lens. Then, based on the result of the measurement, horizontal alignment is performed between the liquid crystal display cell and the lenticular lens.

公开(公告)号：DE69611053T2

公开(公告)日：2001-05-10

申请号：DE69611053

申请日：1996-04-09

Applicant: IBM

Inventor： COLGAN EVAN GEORGE ,  HARPER JAMES MICKELL EDWIN ,  KAUFMAN FRANK BENJAMIN ,  MANNI MARGARET PAGGY ,  MELCHER ROBERT LEE ,  SPEIDELL JAMES LOUIS

IPC: G02F1/1335 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368

Abstract: A reflective spatial light modulator array is described incorporating liquid crystal devices, mirrors, a semiconductor substrate, electrical circuits, and a reflector/absorber layer for blocking light. The invention overcomes the problem of shielding light from semiconductor devices, high optical throughput and contrast, pixel storage capacitance to hold the voltage across the liquid crystal device and precise control of the liquid crystal device thickness without spacers obscuring the mirrors.

公开(公告)号：DE112016000381B4

公开(公告)日：2020-06-18

申请号：DE112016000381

申请日：2016-02-15

Applicant: IBM

Inventor： COLGAN EVAN GEORGE ,  DENNEAU MONTY MONTAGUE ,  KNICKERBOCKER JOHN

IPC: H01L23/367 ,  G06F1/18 ,  G06F1/20 ,  H01L23/473 ,  H01L23/52

Abstract: Halbleiterstruktur, aufweisend:mindestens einen Halbleiterprozessor-Wafer, der starr an einer von Einheiten freien Seite an einem flüssigkeitsgekühlten Substrat angebracht ist, dessen Wärmeausdehnungskoeffizient dem des Halbleiterprozessor-Wafers gleich ist, wobei der Halbleiterprozessor-Wafer zwei oder mehr Chips enthält, die durch eine On-Chip-Verdrahtungsebene miteinander verbunden sind, wobei Substrate jedes Chips an einzelnen Chips auf einer Einheitenseite des Halbleiterprozessor-Wafers angebracht sind, wobei die Chip-Substrate eine kleinere Fläche einnehmen als die Chips auf dem Wafer, undeine oder mehrere an jedem Chip-Substrat angebrachte Karten, wobei eine Hauptfläche jeder Karte senkrecht zu einer Fläche des Halbleiterprozessor-Wafers steht.

公开(公告)号：DE112016000381T5

公开(公告)日：2017-10-05

申请号：DE112016000381

申请日：2016-02-15

Applicant: IBM

Inventor： COLGAN EVAN GEORGE ,  DENNEAU MONTY MONTAGUE ,  KNICKERBOCKER JOHN

IPC: H01L21/70

Abstract: Eine Halbleiterstruktur enthält ein Substrat mit Kühlschichten, Kühlkanälen, Kühlmittelzuleitungen und -ableitungen in Fluidverbindung mit den Kühlkanälen, und eine Einheitenschicht auf den Kühlschichten mit einem oder mehreren Verbindungspunkten und eine Einheitenschichtfläche. Der Wärmeausdehnungskoeffizient der Einheitenschicht ist im Wesentlichen gleich dem der Kühlschichten. Eine Mehrzahl von Laminatsubstraten sind auf der Einheitenschicht angeordnet und elektrisch mit dieser verbunden. Der Wärmeausdehnungskoeffizient des Laminatsubstrats ist von dem der Einheitenschicht verschieden, jedes Laminatsubstrat ist kleiner als ein Bereich der Einheitenschicht, auf dem es angebracht ist, und jedes Laminatsubstrat enthält Lücken zwischen Seiten benachbarter Laminatsubstrate. Die Laminatsubstrate sind über die Lücken zwischen ihnen hinweg nicht elektrisch oder mechanisch miteinander verbunden, und die Laminatsubstrate sind klein genug, um ein Aufwölben der Einheitenschichten, der Verbindungsschichten und der Kühlschichten aufgrund von Wärmeausdehnung zu verhindern.