公开(公告)号：JP2005117021A

公开(公告)日：2005-04-28

申请号：JP2004230703

申请日：2004-08-06

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： ABRAHAM DAVID WILLIAM ,  O'SULLIVAN EUGENE JOHN

IPC: H01L21/314 ,  C23F4/00 ,  G11B5/31 ,  G11B5/39 ,  H01F10/32 ,  H01F41/34 ,  H01L21/8246 ,  H01L27/105 ,  H01L43/08 ,  H01L43/12

CPC classification number: B82Y25/00 ,  B82Y10/00 ,  C23F4/00 ,  G11B5/3116 ,  G11B5/3163 ,  G11B5/3903 ,  G11B5/3909 ,  H01F10/3254 ,  H01F41/308 ,  H01F41/34 ,  H01L43/12 ,  Y10T428/12542

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming patterns on a magnetic thin film (and an obtained structure). SOLUTION: The method comprises a step of transforming a part of the magnetic thin film to a non-magnetic and electrically insulating state by using a chemical transformation of the part of the magnetic thin film. By exposing the magnetic thin film to a reactive plasma having a low output, magnetic and electrical properties can be transformed, while an adhesive property of the magnetic thin film being left as it is. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种在磁性薄膜上形成图案的方法（和获得的结构）。 解决方案：该方法包括通过使用该磁性薄膜的一部分的化学变换将一部分磁性薄膜转变为非磁性和电绝缘状态的步骤。 通过将磁性薄膜暴露于具有低输出的反应性等离子体，可以转变磁性和电性能，同时使磁性薄膜的粘合性能保持原样。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：DE69116422D1

公开(公告)日：1996-02-29

申请号：DE69116422

申请日：1991-02-08

Applicant: IBM

Inventor： AHN BYUNG TAE ,  BEYERS ROBERT BRUCE ,  COOPER EMANUEL ISRAEL ,  GIESS EDWARD AUGUST ,  O'SULLIVAN EUGENE JOHN ,  ROLDAN JUDITH MARIE ,  ROMANKIW LUBOMYR TARAS

IPC: C01G1/00 ,  C01G29/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/06 ,  H01B13/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L39/02 ,  H01L39/24 ,  H01L39/08 ,  H01L21/768 ,  C04B41/51

Abstract: A superconducting multilayer ceramic substrate is disclosed, prepared by firing a laminate of at least two polymer bonded cast sheets of a ceramic dielectric oxide powder, at least one sheet of which has a metallization pattern provided thereon, to thereby form a superconducting oxide reaction layer at the interface between the sintered ceramic material and the embedded metallic conductor lines of the metallization pattern.

公开(公告)号：MY134716A

公开(公告)日：2007-12-31

申请号：MYPI9300721

申请日：1993-04-21

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  RIELEY SHELDON COLE ,  WALKER GEORGE FREDERICK ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT ,  MIKALSEN DONALD JOSEPH ,  MOSKOWITZ PAUL ANDREW ,  O'SULLIVAN EUGENE JOHN ,  O'TOOLE TERRENCE ROBERT ,  PURUSHOTHAMAN SAMPATH

IPC: H01L21/60 ,  H01L23/485 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: SILICON AND GERANIUM CONTAINING MATERIALS ARE USED AT SURFACE OF CONDUCTORS IN ELECTRONIC DEVICES. SOLDER CAN BE FLUXLESSLY BONDED AND WIRES CAN BE WIRED BONDED TO THESE SURFACES. THESE MATERIAL ARE USED AS A SURFACE COATING FOR LEAD FRAMES FOR PACKAGING INTEGRATED CIRCUIT CHIPS. THESE MATERIALS CAN BE DECAL TRANSFERRED ONTO CONDUCTOR SURFACES OR ELECTROLESSLY OR ELECTROLYTICALLY DISPOSED THEREON.(FIG. 1)