公开(公告)号：JP2004128497A

公开(公告)日：2004-04-22

申请号：JP2003334361

申请日：2003-09-25

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： EGITTO FRANK D ,  FARQUHAR DONALD S ,  MARKOVICH VOYA R ,  MARK D POLIKS ,  POWELL DOUGLAS O

IPC: H01L23/12 ,  G02F1/1347 ,  H01L21/48 ,  H01L23/373 ,  H05K3/46

CPC classification number: H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer interconnection structure using a LCP dielectric layer and a method for forming the structure. SOLUTION: Each of a first and second LCP (liquid crystal polymer) dielectric layers is bonded directly to each of a first and second opposed layers of a heat conduction layer without an extrinsic adhesive material that bonds the heat conduction layer to either of a first and second LCP dielectric layers. Alternatively, each of a first and second 2S1P substructures is bonded directly to each of a first and second opposed layers of a LCP dielectric bonding layer without an extrinsic adhesive material that bonds the LCP dielectric bonding layer to either of the first and second 2S1P substructures. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供使用LCP介电层的多层互连结构和形成该结构的方法。 解决方案：第一和第二LCP（液晶聚合物）电介质层中的每一个直接结合到导热层的第一和第二相对层中的每一个，而不需要将导热层粘合到 第一和第二LCP电介质层。 或者，第一和第二2S1P子结构中的每一个直接结合到LCP电介质结合层的第一和第二相对层中的每一个上，而不会将LCP电介质结合层结合到第一和第二2S1P子结构中的任一个的外在粘合材料。 版权所有（C）2004，JPO

公开(公告)号：ID24794A

公开(公告)日：2000-08-16

申请号：ID991157

申请日：1999-12-20

Applicant: IBM

Inventor： EGITTO FRANK D ,  GAYNES MICHAEL A ,  KODNANI RAMESH ,  MATIONSO LUIS J ,  PIERSON MARK V

IPC: B29C59/14 ,  H01L21/56 ,  D03D11/00

公开(公告)号：JP2004119968A

公开(公告)日：2004-04-15

申请号：JP2003302180

申请日：2003-08-26

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： EGITTO FRANK D ,  KNADLE KEVIN T ,  SEMAN ANDREW M

IPC: H05K3/06 ,  H01L21/3213 ,  H01L21/48 ,  H01L21/768 ,  H05K3/00 ,  H05K3/02 ,  H05K3/08

CPC classification number: H05K3/06 ,  B32B15/08 ,  B32B15/20 ,  B32B27/04 ,  B32B27/06 ,  B32B27/30 ,  B32B27/38 ,  H01L21/32134 ,  H01L21/4846 ,  H01L21/76838 ,  H01L2924/0002 ,  H05K3/027 ,  H05K3/061 ,  H05K3/064 ,  H05K2203/0369 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24322 ,  Y10T428/24802 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an effective circuit board at low cost, and to provide a method for manufacturing it, in order to produce the circuit boards having high electrical performance and thin lines with narrow interval, on a large scale. SOLUTION: This circuit board contains an almost flat top surface and a conductive layer arranged on the surface. The conductive layer contains at least one side wall in itself, and the opening of the conductive layer is formed there. The conductive layer contains an end part kept which is away from the opening. The end part makes an acute angle with the almost flat top surface of the board. At least one sidewall makes an almost right angle with the almost flat top surface of the board. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了以较低的成本提供有效的电路板，并提供一种制造方法，以便大规模生产具有高电气性能的电路板和间隔窄的细线。

解决方案：该电路板包含几乎平坦的顶表面和布置在表面上的导电层。 导电层本身包含至少一个侧壁，并且导电层的开口形成在那里。 导电层包含保持远离开口的端部。 端部与板的几乎平坦的顶表面形成锐角。 至少一个侧壁与板的几乎平坦的顶表面几乎成直角。 版权所有（C）2004，JPO

公开(公告)号：JP2001009585A

公开(公告)日：2001-01-16

申请号：JP2000124302

申请日：2000-04-25

Applicant: IBM

Inventor： EGITTO FRANK D ,  MATHIENZO LOUIS J

IPC: B23K31/02 ,  B23K1/20 ,  B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  C23C14/34 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To joint solders without flux in a low temperature by exposing a bulk solder to excited ions of spattering gas while halogen exists for a given time, making composition ratio of first and second metals smaller than bulk ratio before the treatment, and forming a surface layer which has a desired depth and a surface film having halogen on the surface part. SOLUTION: It is preferable that halogen is fluorine, a first metal is lead, a second metal is tin, and lead whose bulk ratio is at least 90% is included. An alloy solder 32 is exposed to the ions to which spattering gas is excited, so as to form a surface layer 44 and a surface film 42'. A solder cluster 40 has the original composition ratio, but the surface layer 44 has the composition ratio of tin and lead smaller than the bulk ratio and does not include metallic oxides, so as to cause tin enrichment. The surface film 42' is fluorided or halogenized, and is unstable because of its hydrolysis property, and so it is fused on the metal surface without flux.

公开(公告)号：CA1314197C

公开(公告)日：1993-03-09

申请号：CA530786

申请日：1987-02-27

Applicant: IBM

Inventor： EGITTO FRANK D ,  EMMI FRANCIS ,  MLYNKO WALTER E ,  SUSKO ROBIN A

IPC: B08B3/08 ,  H01L21/302 ,  H01L21/304 ,  H01L21/3065 ,  H05K3/00 ,  H05K3/08 ,  H05K3/26 ,  H05K3/42 ,  B23K10/00

Abstract: EN984-029 PROCESS FOR REMOVING CONTAMINANT Contaminant is removed from holes by etching in a gaseous plasma by first removing contaminant from the vicinity of the edges of the hole. Next, a mask is provided in the vicinity of the edges to prevent etching by contacting with a gaseous plasma which is different from the gaseous plasma employed in the first etching step. The holes are then etched in a gaseous plasma to remove contaminant from the interior of the holes in the vicinity of the center of the holes, whereby the mask protects the edges from being etched.