公开(公告)号：JP2000315307A

公开(公告)日：2000-11-14

申请号：JP12328899

申请日：1999-04-30

Applicant: IBM

Inventor： ITO KENJI ,  MITA YASUHIRO ,  NANBA MASAAKI ,  YOSHIDA TATSUSHI

IPC: G11B5/60 ,  G11B5/48

Abstract: PROBLEM TO BE SOLVED: To lower the wire height of HGA(head gimbal assembly) and to stabilize the stationary posture of a head/slider. SOLUTION: The HGA is equipped with a head/slider 40 consisting of a slider for flying on a disk surface and a head for reading/writing data in a non-contact state for the disk surface; with four electrically conductive data- transmitting wires 61 connected to the head at one end; and with a load beam 20 which is loaded with the wires 61, which carries the head/slider 40 near the front end 24, and which is supported at the rear end 23 by an actuator. Further, in the HGA, the wires 61 are fixed on the wire loading surface 21 of the load beam 20 at the fixing point E (E1, E2) between the head connecting end H and the rear end 23, with a wire loop 610 provided between the head connecting end H and the wire fixing point E, and a distance De is shorter than the conventional one between the head connecting position Hg and the wire fixing position Eg, that is, approximately 3.8 (mm) or less.

公开(公告)号：JP2001043647A

公开(公告)日：2001-02-16

申请号：JP20163099

申请日：1999-07-15

Applicant: IBM

Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  TSUCHIDA HIROYASU ,  INOUE HIROO ,  SURUYA PATANAIKU ,  ISHIKAWA HIROMI ,  NANBA MASAAKI

IPC: G11B21/21 ,  G11B5/48 ,  G11B21/02

Abstract: PROBLEM TO BE SOLVED: To prevent short-circuiting caused by the oozing-out of flexure adhesive, to absorb distortion caused by the contraction of a soldered part by reducing the rigidity of a flexure, and to improve the quality of the soldered part by arranging pads adjacently to each other as much as possible when the bonding pad formed in a slider held in the flexure and the leading pad for a lead fixed to the platform of the flexure are soldered to each other. SOLUTION: Holes 21 and 22 are bored in a flexure 8 portion near the soldered parts of the bonding pads 28 to 31 of a slider 25 and the leading pads 41 to 44 of a lead end part. Thus, since adhesive for adhering the slider 25 to a flexure tongue 20 is moved downward from the holes 21 and 22, the adhesive is prevented from being brought into contact with the bonding pads 28 to 31.