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公开(公告)号:JPS61248470A
公开(公告)日:1986-11-05
申请号:JP445586
申请日:1986-01-14
Applicant: IBM
Inventor: JACKSON THOMAS NELSON , KIRCHNER PETER DANIEL , PETTIT GEORGE DAVID , RUTZ RICHARD FREDERICK , WOODALL JERRY MACPHERSON
IPC: H01L21/338 , H01L21/28 , H01L21/285 , H01L29/41 , H01L29/43 , H01L29/45 , H01L29/80 , H01L29/812
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公开(公告)号:JPS61248561A
公开(公告)日:1986-11-05
申请号:JP663786
申请日:1986-01-17
Applicant: IBM
Inventor: FREEOUF JOHN LAWRENCE , JACKSON THOMAS NELSON , KIRCHNER PETER DANIEL , TANG JEFFREY YUH-FONG , WOODALL JERRY MACPHERSON
IPC: H01L29/73 , H01L21/331 , H01L29/68 , H01L29/737 , H01L29/76
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公开(公告)号:DE3685842T2
公开(公告)日:1993-02-04
申请号:DE3685842
申请日:1986-04-11
Applicant: IBM
Inventor: JACKSON THOMAS NELSON , KIRCHNER PETER DANIEL , PETTIT GEORGE DAVID , RUTZ RICHARD FREDERICK , WOODALL JERRY MACPHERSON
IPC: H01L21/338 , H01L21/28 , H01L21/285 , H01L29/41 , H01L29/43 , H01L29/45 , H01L29/80 , H01L29/812
Abstract: An ohmic contact is formed to a device region in the surface of an extrinsic conductivity type group III-V semiconductor crystal (1) by providing a layer (3) of an amphoteric dopant on the surface of the crystal and providing in that layer, at the desired location of the ohmic contact, a localised quantity of atoms of the element of the crystal which is capable of imparting with the amphoteric dopant the aforesaid extrinsic conductivity type, and heating the structure to diffuse atoms from the layer into the surface of the crystal to form the ohmic contact. A layer of Si on GaAs upon heating normally forms a rectifying contact. If a region of the Si layer contains As atoms, an ohmic contact is formed on heating.
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公开(公告)号:DE3786717D1
公开(公告)日:1993-09-02
申请号:DE3786717
申请日:1987-05-29
Applicant: IBM
IPC: H01L29/812 , H01L21/338 , H01L29/205 , H01L29/66 , H01L29/778 , H01L39/22 , H01L29/26 , H01L29/80 , H01L39/12
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公开(公告)号:DE3380863D1
公开(公告)日:1989-12-21
申请号:DE3380863
申请日:1983-02-23
Applicant: IBM
Inventor: JACKSON THOMAS NELSON
IPC: H01L29/80 , H01L21/28 , H01L21/308 , H01L21/338 , H01L29/06 , H01L29/417 , H01L29/812
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公开(公告)号:DE3480009D1
公开(公告)日:1989-11-09
申请号:DE3480009
申请日:1984-05-23
Applicant: IBM
Inventor: JACKSON THOMAS NELSON , KIRCHNER PETER DANIEL , PETTIT GEORGE DAVID , ROSENBERG JAMES JORDAN , WOODALL JERRY MACPHERSON , WRIGHT STEVEN LORENZ
Abstract: A silicon source for molecular beam epitaxial deposition heated by electric current through the silicon is provided wherein the silicon is configured in a plurality of filaments positioned between two broader electrical contact areas. … The figures shows such a source comprising Z-shaped silicon filaments 15, 16, 17 integrated with an extending between electrical contact headers 18, 19. A current source is connected in series with the source and causes resistance heating of the source.
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公开(公告)号:DE3687425D1
公开(公告)日:1993-02-18
申请号:DE3687425
申请日:1986-04-16
Applicant: IBM
Inventor: FREEOUF JOHN LAWRENCE , JACKSON THOMAS NELSON , KIRCHNER PETER DANIEL , TANG JEFFREY YUH-FONG , WOODALL JERRY MACPHERSON
IPC: H01L29/73 , H01L21/331 , H01L29/68 , H01L29/737 , H01L29/76
Abstract: The composition and doping profile of the emitter (4) produces an electron gas (16) in the base (3) adjacent a band offset heterojunction interface between the emitter and the base. When a suitable bias is applied, the electron gas is confined adjacent to the interface by a low barrier (produced by layer 10). The kinetic energy of ballistic electrons crossing the base to the collector (2) is controlled to prevent intervalley scattering by an electrostatic barrier (7) that under influence of bias provides an essentially level conduction band in the portion of the base adjacent the collector.
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公开(公告)号:DE3783162D1
公开(公告)日:1993-02-04
申请号:DE3783162
申请日:1987-05-26
Applicant: IBM
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公开(公告)号:DE3379701D1
公开(公告)日:1989-05-24
申请号:DE3379701
申请日:1983-10-05
Applicant: IBM
Inventor: FREEOUF JOHN LAWRENCE , JACKSON THOMAS NELSON , OELHAFEN PETER UNIVERSITY OF B , PETTIT GEORGE DAVID , WOODALL JERRY MACPHERSON
IPC: H01L21/306 , H01L21/314 , H01L21/316 , H01L23/29 , H01L23/31 , H01L23/28
Abstract: A monocrystalline compound semiconductor substrate (1) is passivated with a layer (3) of the most volatile element of the semiconductor compound to prevent the formation of oxides that would interfere with further processing. A surface layer of arsenic is formed on a GaAs substrate by exposing the substrate to light having a photon energy greater than 1.8 eV, at a power density of 0.01 to 0.5 watts per cm for a period of 10 to 30 minutes while the substrate is immersed in a 1 : 1 HCl : H2O solution. The passivated substrate may be stored and handled in air. When desired, the As layer can be removed by low temperature baking, for example at 150 DEG to 300 DEG C.
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10.
公开(公告)号:DE3567555D1
公开(公告)日:1989-02-16
申请号:DE3567555
申请日:1985-06-11
Applicant: IBM
Inventor: JACKSON THOMAS NELSON , KIRCHNER PETER DANIEL , PETTIT GEORGE DAVID , WOODALL JERRY MACPHERSON
Abstract: A metallic ohmic contact (1) is formed on the surface of an intermetallic compound semiconductor body (2) in which the net donor density of an amphoteric dopant is greater in a thin surface region extending into the body from the interface (3) between the contact (1) and the body (2) than in the bulk of the body (2). Preferably, the surface region has a net donor density greater than 5 x 10 atoms per cc and is 2 to 5 nm thick. The contact can be formed by growing a body of gallium arsenide in the presence of an arsenic over-pressure and a source of germanium or silicon and then depositing a metal on the surface of the body.
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