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    193NM RESIST
    2.
    发明专利
    193NM RESIST 未知

    公开(公告)号：AU2003273924A1

    公开(公告)日：2004-04-19

    申请号：AU2003273924

    申请日：2003-08-28

    Applicant: IBM

    Inventor： VARANASI PUSHKARA RAO ,  NISHIMURA YUKIO ,  KOBAYASHI EIICHI ,  KHOJASTEH MAHMOUD M ,  CHEN KUANG-JUNG

    IPC: G03F7/039

    Abstract: Acid-catalyzed positive resist compositions which are imageable with 193 nm radiation and/or possibly other radiation and are developable to form resist structures of improved development characteristics and improved etch resistance are enabled by the use of resist compositions containing imaging polymer component comprising an acid-sensitive polymer having a monomeric unit with a pendant group containing a remote acid labile moiety.

    RADIATION-SENSITIVE RESIN COMPOSITION
    3.
    发明专利
    RADIATION-SENSITIVE RESIN COMPOSITION 审中-公开

    公开(公告)号：JP2004012551A

    公开(公告)日：2004-01-15

    申请号：JP2002162110

    申请日：2002-06-03

    Applicant: JSR CORP ,  IBM

    Inventor： NISHIMURA YUKIO ,  NISHIMURA ISAO ,  ITO HIROSHI ,  TOMAS I WOROU ,  VARANASI PUSHKARA RAO

    IPC: G03F7/039 ,  C08F220/10 ,  C08F232/00 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation, excellent in basic properties as a resist, such as sensitivity, resolution, dry etching resistance and pattern shape and suitable for use as a chemically amplified resist. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin which contains a repeating unit derived from α-perfluoroalkylacrylic esters typified by t-butyl α-trifluoromethylacrylate and a repeating unit derived from a norbornene compound typified by 5-ä2-hydroxy-2, 2-di(trifluoromethyl)ethyl}bicyclo[2.2.1]hept-2-ene or a compound of formula 7 as essential units and becomes alkali-soluble by the action of an acid and (B) a radiation-sensitive acid generator. COPYRIGHT: (C)2004,JPO

    RADIATION-SENSITIVE RESIN COMPOSITION
    4.
    发明专利
    RADIATION-SENSITIVE RESIN COMPOSITION 审中-公开

    公开(公告)号：JP2004012545A

    公开(公告)日：2004-01-15

    申请号：JP2002162080

    申请日：2002-06-03

    Applicant: JSR CORP ,  JSR MICRO INC ,  IBM

    Inventor： YAMAMOTO MASASHI ,  ISHII HIROYUKI ,  ISHIDA EIKO ,  NISHIMURA YUKIO ,  MARK SLEZAK ,  BRUNSVOLD WILLIAM R ,  CHEN KUANG-JUNG ,  VARANASI PUSHKARA RAO

    IPC: G03F7/039 ,  C08F20/28 ,  G03F7/004 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation, excellent in basic physical properties as a resist, such as sensitivity, resolution and pattern shape, and useful particularly as a chemically amplified resist excellent in focus latitude. SOLUTION: The radiation-sensitive resin composition comprises (A) a mixture of alkali-insoluble or slightly alkali-soluble resins having separate repeating units protected with acid-dissociating protective groups and typified by repeating units derived from 2-methyl-2-adamantyl (meth)acrylate, 1-ethylcyclohexyl (meth)acrylate, etc., wherein the acid-dissociating protective group of at least one of the resins is different from that of the other, and (B) a radiation-sensitive acid generator. COPYRIGHT: (C)2004,JPO

    RADIATION-SENSITIVE RESIN COMPOSITION
    5.
    发明专利
    RADIATION-SENSITIVE RESIN COMPOSITION 审中-公开

    公开(公告)号：JP2003241383A

    公开(公告)日：2003-08-27

    申请号：JP2002046520

    申请日：2002-02-22

    Applicant: JSR CORP ,  IBM

    Inventor： NISHIMURA YUKIO ,  HOSHI MICHIAKI ,  SOYANO AKIMASA ,  KAJITA TORU ,  ALLEN ROBERT D ,  VARANASI PUSHKARA RAO

    IPC: G03F7/039 ,  C08F220/26 ,  C08F220/34 ,  C08F220/38 ,  C08F222/06 ,  C08F232/08 ,  G03F7/004 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in contrast, capable of forming a fine resist pattern with a high degree of accuracy and excellent also in transparency to a radiation, sensitivity and resolution. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin comprising an acid-dissociable group-containing norbornene compound typified by 5-[(1-methylcyclohexyl)oxycarbonyl]norbornene or 5-(2-methyl-1- adamantyloxycarbonyl)norbornene and maleic anhydride, (B) a radiation-sensitive acid generator and (C) a compound typified by a di-t-butyl 1,3- adamantanedicarboxylate or 2,5-dimethyl-2,5-di(1-adamantylcarbonyloxy)hexane. Preferably the resin (A) further comprises a polar group-containing alicyclic ester of (meth)acrylic acid typified by 3-hydroxy-1-adamantyl (meth)acrylate. COPYRIGHT: (C)2003,JPO

    RADIATION-SENSITIVE RESIN COMPOSITION
    9.
    发明专利
    RADIATION-SENSITIVE RESIN COMPOSITION 审中-公开

    公开(公告)号：JP2003255539A

    公开(公告)日：2003-09-10

    申请号：JP2002056522

    申请日：2002-03-01

    Applicant: JSR CORP ,  IBM

    Inventor： NISHIMURA YUKIO ,  ISHII HIROYUKI ,  KOBAYASHI HIDEKAZU ,  TOMAS I WOROU ,  ALLEN ROBERT D ,  VARANASI PUSHKARA RAO

    IPC: G03F7/039 ,  C08F220/18 ,  C08F220/28 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation and suitable for use as a chemically amplified resist excellent in basic performances as a resist, such as sensitivity, resolution, dry etching resistance and pattern shape. SOLUTION: The radiation-sensitive resin composition comprises (A) an alkali-insoluble or slightly alkali-soluble resin which has a repeating unit represented by formula (1-1) (where R 1 is H or methyl) and a (meth)acrylic repeating unit typified by 2-ethyl-2-adamantyl (meth)acrylate, 2-norbornyl-2-(meth) acryloyloxypropane or 1-methylcyclopentyl (meth)acrylate as essential units and becomes alkali-soluble under the action of an acid and (B) a radiation- sensitive acid generator. COPYRIGHT: (C)2003,JPO

    RADIATION-SENSITIVE RESIN COMPOSITION
    10.
    发明专利
    RADIATION-SENSITIVE RESIN COMPOSITION 审中-公开

    公开(公告)号：JP2003248313A

    公开(公告)日：2003-09-05

    申请号：JP2002046974

    申请日：2002-02-22

    Applicant: JSR CORP ,  IBM

    Inventor： NISHIMURA YUKIO ,  ISHII HIROYUKI ,  KATAOKA ATSUKO ,  TOMAS I WOROU ,  ALLEN ROBERT D ,  VARANASI PUSHKARA RAO

    IPC: G03F7/039 ,  C08F222/06 ,  C08F232/08 ,  H01L21/027

    Abstract: PROBLEM TO BE SOLVED: To provide a new radiation-sensitive resin composition having high transparency to a radiation, excellent in basic physical properties as a resist, such as sensitivity, resolution, pattern shape and adhesion to a substrate, causing no development defect in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation-sensitive resin composition comprises (A) an acid-dissociable group-containing resin having a repeating unit represented by formula (I) and a repeating unit represented by formula (II) and (B) a radiation-sensitive acid generator. In the formula (I), X is methylene or carbonyl; R 1 and R 2 are each H, a 1-4C alkyl, a monovalent O-containing polar group or a monovalent N-containing polar group; R 3 is H, a 1-6C alkyl, a 1-6C alkoxyl or a 2-7C alkoxycarbonyl; and n is an integer of 0-2. COPYRIGHT: (C)2003,JPO

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