公开(公告)号：DE3888685T2

公开(公告)日：1994-10-20

申请号：DE3888685

申请日：1988-10-10

Applicant: IBM

Inventor： RICHARD HEINZ

IPC: B26F3/00 ,  B28D5/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/00

Abstract: The method comprises : scribing a workpiece surface; placing the workpiece (4), with its scribed surface facing upwards, in sandwich (3) between an upper (6) and a lower (5) foil both flexible and stretchable and extending beyond the workpiece, an adhesive joining the workpiece (4) to the lower foil (5); stretching the sandwich (3); applying an upward force to the lower side of the sandwich (3) to bend the workpiece (4) normal to the scribed lines; and removing the upper foil (6), whereafter the individual bars broken off the workpiece (4) are taken from the lower foil (5). The individual bars become separated sufficient to avoid mutual damage of the neighboring broken off surfaces. Preferably, the tensile strength of the lower foil (5) is lower that that of the upper foil (6) and the sandwich (3) is stretched in excess of the elastic limit of both foils. An intermediate foil (26) of polyester or polyimide can be interposed between the upper surface of the workpiece (4) and the upper foil (6). The device comprises: a base element (1); first gripping means (7) fixed at the base element for releasably holding one sandwich (3) end; second gripping means (8) arranged at the base element and movable in the longitudinal direction while releasably holding the other sandwich (3) end; means (13-18) for adjustably displacing the second gripping means (8) in the longitudinal direction; and a cylindrical rod (19) placed on the base element (1) parallel to the transverse direction and movable in the longitudinal direction.

公开(公告)号：PL175130B1

公开(公告)日：1998-11-30

申请号：PL32001894

申请日：1994-09-03

Applicant: IBM

Inventor： GFELLER FRITZ ,  RICHARD HEINZ ,  WEISS BEAT

IPC: H01L33/00 ,  G02B5/02 ,  G08C19/36 ,  H04B10/114 ,  H04B10/40 ,  H04B10/10

Abstract: 1. An optical module for data transmission containing a matrix of infrared electroluminescent diodes positioned in a regular and symmetric way and a dome-shaped housing creating a recess characterised by a fact that a matrix of electroluminescent diodes (11, 31, 41, 51, 71, 81, 91, 101, 111, 121, 201, 221) is located in a recess and a dome-shaped housing (52,72, 102, 112, 122) contains an element (53, 73, 103, 113, 123) dispersing infrared radiation emitted by electroluminescent diodes (51, 71, 101, 111, 121).

公开(公告)号：DE69426839T2

公开(公告)日：2001-07-26

申请号：DE69426839

申请日：1994-09-03

Applicant: IBM

Inventor： GFELLER FRITZ ,  RICHARD HEINZ ,  WEISS BEAT

IPC: H04B10/10

公开(公告)号：BR9408606A

公开(公告)日：1999-06-29

申请号：BR9408606

申请日：1994-09-03

Applicant: IBM

Inventor： GFELLER FRITZ ,  RICHARD HEINZ ,  WEISS BEAT

IPC: H01L33/00 ,  G02B5/02 ,  G08C19/36 ,  H04B10/114 ,  H04B10/40 ,  H04B10/10

Abstract: The optical transmission module has an array of infra-red LEDs (51) arranged in a regular, and preferably symmetrical manner in the cavity formed by a dome-shaped housing (52). The housing has a diffuser for apparent source enlargement. The LEDs are either individually or commonly addressable. Pref., the LEDs of the array (11) are located on a mounting base (10) such that the main radiation axis of the diodes is approx parallel to the centre axis of the housing. Infra-red light is emitted from the array through the housing (52). There is a substrate for circuitry underneath the diodes. A transceiver for wireless data communication and for use in connection with the module is also claimed, which incorporates a receiver consisting of photodiodes.

公开(公告)号：CA2043173C

公开(公告)日：1993-09-21

申请号：CA2043173

申请日：1991-05-24

Applicant: IBM

Inventor： BROOM RONALD F ,  GASSER MARCEL ,  HARDER CHRISTOPH S ,  LATTA ERNST E ,  OOSENBRUG ALBERTUS ,  RICHARD HEINZ ,  VETTIGER PETER

IPC: B28D5/00 ,  H01L21/301 ,  H01S5/00 ,  H01S5/02 ,  H01L21/304

Abstract: A method for cleaving semiconductor wafers, or segments thereof, which comprises placing the wafer (11), provided with scribe lines (15) defining the planes where cleaving is to take place, inbetween a pair of flexible transport bands (12, 13) and guiding it around a curved, large radius surface (21) therebyapplying a bending moment. With a moment of sufficient magnitude, individual bars (22) are broken off the wafer as this is advanced, the bars having frontand rear-end facets. On cleaving, each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighbouring bars is prevented. For further handling, e.g. for the transport of the bars to an evaporation station for passivation layer deposition, provisions are made to keep the bars separated. Cleaving and the subsequent passivation coating can be carried out in-situ in a vacuum system to prevent facet contamination prior to applying the passivation.

公开(公告)号：DE69425447T2

公开(公告)日：2009-09-10

申请号：DE69425447

申请日：1994-09-03

Applicant: IBM

Inventor： GFELLER FRITZ ,  RICHARD HEINZ ,  WEISS BEAT

IPC: H01L33/00 ,  G02B5/02 ,  G08C19/36 ,  H04B10/114 ,  H04B10/40

Abstract: The optical transmission module has an array of infra-red LEDs (51) arranged in a regular, and preferably symmetrical manner in the cavity formed by a dome-shaped housing (52). The housing has a diffuser for apparent source enlargement. The LEDs are either individually or commonly addressable. Pref., the LEDs of the array (11) are located on a mounting base (10) such that the main radiation axis of the diodes is approx parallel to the centre axis of the housing. Infra-red light is emitted from the array through the housing (52). There is a substrate for circuitry underneath the diodes. A transceiver for wireless data communication and for use in connection with the module is also claimed, which incorporates a receiver consisting of photodiodes.

公开(公告)号：CZ292638B6

公开(公告)日：2003-11-12

申请号：CZ28497

申请日：1994-09-03

Applicant: IBM

Inventor： GFELLER FRITZ ,  RICHARD HEINZ ,  WEISS BEAT

IPC: H01L33/00 ,  G02B5/02 ,  G08C19/36 ,  H04B10/114 ,  H04B10/40 ,  H04B10/10

Abstract: The optical transmission module has an array of infra-red LEDs (51) arranged in a regular, and preferably symmetrical manner in the cavity formed by a dome-shaped housing (52). The housing has a diffuser for apparent source enlargement. The LEDs are either individually or commonly addressable. Pref., the LEDs of the array (11) are located on a mounting base (10) such that the main radiation axis of the diodes is approx parallel to the centre axis of the housing. Infra-red light is emitted from the array through the housing (52). There is a substrate for circuitry underneath the diodes. A transceiver for wireless data communication and for use in connection with the module is also claimed, which incorporates a receiver consisting of photodiodes.

公开(公告)号：SG32472A1

公开(公告)日：1996-08-13

申请号：SG1995001212

申请日：1995-08-25

Applicant: IBM

Inventor： GFELLER FRITZ ,  RICHARD HEINZ ,  WEISS BEAT

IPC: H01L33/00 ,  G02B5/02 ,  G08C19/36 ,  H04B10/114 ,  H04B10/40 ,  H04B10/00

Abstract: The optical transmission module has an array of infra-red LEDs (51) arranged in a regular, and preferably symmetrical manner in the cavity formed by a dome-shaped housing (52). The housing has a diffuser for apparent source enlargement. The LEDs are either individually or commonly addressable. Pref., the LEDs of the array (11) are located on a mounting base (10) such that the main radiation axis of the diodes is approx parallel to the centre axis of the housing. Infra-red light is emitted from the array through the housing (52). There is a substrate for circuitry underneath the diodes. A transceiver for wireless data communication and for use in connection with the module is also claimed, which incorporates a receiver consisting of photodiodes.

公开(公告)号：CA2197916A1

公开(公告)日：1996-03-14

申请号：CA2197916

申请日：1994-09-03

Applicant: IBM

Inventor： GFELLER FRITZ ,  RICHARD HEINZ ,  WEISS BEAT

IPC: H01L33/00 ,  G02B5/02 ,  G08C19/36 ,  H04B10/114 ,  H04B10/40 ,  H04B10/10 ,  G06F3/00

Abstract: Disclosed are optical transmitter and transceiver modules for data communication. Such a transceiver module comprises an array of light emitting diodes mounted on a mounting base (140) being arranged in a regular and symmetrical manner in a dome-shaped housing (142). This housing (142) comprises diffusor means for source enlargement. In addition to the transmitter part consisting of said diodes, the transceiver module comprises a receiver. The receiver has four photodiodes (143) arranged below the mounting base (140). These photodiodes are tilted and face in different directions to receive light from all around the module. The photodiodes are protected by a thin wire mesh (145) which serves as Faraday cage to reduce electro magnetic interference. A substrate (144) for electronic circuitry in SMD-Technology is situated underneath the photodiodes (143).

公开(公告)号：DE69006353T2

公开(公告)日：1994-06-23

申请号：DE69006353

申请日：1990-05-25

Applicant: IBM

Inventor： BROOM RONALD F DR ,  GASSER MARCEL ,  HARDER CHRISTOPH DR ,  LATTA ERNST-EBERHARD DR ,  OOSENBRUG ALBERTUS ,  RICHARD HEINZ ,  VETTIGER PETER

IPC: B28D5/00 ,  H01L21/301 ,  H01S5/00 ,  H01S5/02 ,  H01L21/00

Abstract: A method for cleaving semiconductor wafers, or segments thereof, which comprises placing the wafer (11), provided with scribe lines (15) defining the planes where cleaving is to take place, inbetween a pair of flexible transport bands (12,13) and guiding it around a curved, large radius surface (21) thereby applying a bending moment. With a moment of sufficient magnitude, individual bars (22) are broken off the wafer as this is advanced, the bars having front- and rear-end facets. On cleaving, each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighbouring bars is prevented. For further handling, e.g. for the transport of the bars to an evaporation station for passivation layer deposition, provisions are made to keep the bars separated. Cleaving and the subsequent passivation coating can be carried out in-situ in a vacuum system to prevent facet contamination prior to applying the passivation.