METHOD FOR MAKING A HIGH PERFORMANCE TRANSISTOR INTEGRATED CIRCUIT AND THE RESULTING INTEGRATED CIRCUIT

    公开(公告)号:DE3467472D1

    公开(公告)日:1987-12-17

    申请号:DE3467472

    申请日:1984-08-08

    Applicant: IBM

    Abstract: A high performance NPN bipolar transistor functioning in a current switch logic circuit is formed within an isolated region of a monocrystalline silicon body (10) wherein the transistor includes an N+ subcollector (12), an N+ collector reach-through (20) which connects the subcollector to a major surface of the silicon body, a P base region (22) above the subcollector and adjacent to the reach-through region, an N+ emitter region (30) within the base region and extending from the major surface. The base region (22) includes intrinsic base region located below the emitter region (30) and an extrinsic region (34) located extending from the major surface and adjacent to the emitter region. The extrinsic base preferably completely surrounds or rings the emitter region. Using a mask (32) with openings (24) only in the areas of the extrinsic base regions a P+ type region (34) is formed by ion implanting with a P type dopant to a depth of less than the depth of the N emitter region (30) followed by a short thermal anneal to activate the P dopant. By the independent control of the intrinsic and extrinsic base resistances the performance of bipolar transistor integrated circuits for current switch logic applications is substantially increased.

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