公开(公告)号：DE2250140A1

公开(公告)日：1973-05-17

申请号：DE2250140

申请日：1972-10-13

Applicant: IBM

Inventor： ARNETT PATRICK CLINTON ,  HELLER LAWRENCE GRIFFITH ,  STAPPER CHARLES HENRI

IPC: G11C27/04 ,  H01L21/339 ,  H01L29/423 ,  H01L29/43 ,  H01L29/762 ,  H01L29/768 ,  G11C11/34

Abstract: 1383977 Semi-conductor devices INTERNATIONAL BUSINESS MACHINES CORP 18 Oct 1972 [10 Nov 1971] 47952/72 Heading H1K In a semi-conductor device, such as a shift register or delay line, utilizing the drift of an injected group 30 of minority-charge carriers through a depletion region 23À1 induced in a substrate 10À1 beneath an electrode structure 20À1, there is provided a graded-impurityconcentration region 17À1 of the same conductivity type as the substrate 10À1. The region 17À1 is graded in such a way that in the presence of the appropriate operating voltages on the substrate electrode 21À1, electrode structure 20À1, injecting electrode 15À1 and detecting electrode 16À1. The boundary of the depletion region 23À1 extends parallel to the device surface. In the Si shift register illustrated the electrode structure 20À1 comprises a plurality of interconnected A1 strips capacitively coupled to the ion implanted region 17À1 through a SiO2 layer 18À1. For P-type material a negative bias on the substrate electrode 21À1 induces the depletion region 23À1, the presence of the grounded strips 20À1 producing shallow potential wells 25 which are rapidly filled with injected charge-carriers. A subsequently injected charge-carrier group 30 will drift along the depletion region 23À1, but will tend to become progressively loss spatially localized due to space charge spreading. The group 30 is periodically reshaped by the application of a positive clock pulse to the electrode structure 20À1. Such a pulse temporarily deepens the potential walls 25, causing the drifting group 30 to be trapped and hence relocalized. Using this techique charge-carrier groups may be directed around carriers and in opposed directions. In a simplified embodiment constituting a delay line the electrode structure 20À1 is replaced by a single continuous electrode (20), Fig. 1 (not shown), overlying the whole length of the graded region (17À1), there being in this case no localized potential walls to reshape an injected pulse.

公开(公告)号：DE69123372D1

公开(公告)日：1997-01-16

申请号：DE69123372

申请日：1991-01-24

Applicant: IBM

Inventor： BARTH JOHN EDWARD ,  DRAKE CHARLES EDWARD ,  FIFIELD JOHN ATKINSON ,  HOVIS WILLIAM PAUL ,  KALTER HOWARD LEO ,  LEWIS SCOTT CLARENCE ,  NICKEL DANIEL JOHN ,  STAPPER CHARLES HENRI ,  YANKOSKY JAMES ANDREW

IPC: G11C11/401 ,  G06F11/10 ,  G11C29/00 ,  G11C29/42 ,  G06F11/20

Abstract: A DRAM having on-chip ECC (30) and both bit and word redundancy that have been optimized to support the on-chip ECC. The bit line redundancy features a switching network that provides an any-for-any substitution for the bit lines in the associated memory array. The word line redundancy is provided in a separate array section (20), and has been optimized to maximize signal while reducing soft errors. The array stores data in the form of error correction words (ECWs) on each word line. A first set of data lines (formed in a zig-zag pattern to minimize unequal capacitive loading on the underlying bit lines) are coupled to read out an ECW as well as the redundant bit lines. A second set of data lines receive the ECW as corrected by bit line redundancy, and a third set of data lines receive the ECW as corrected by the word line redundancy. The third set of data lines are coupled to the ECC block, which corrects errors encountered in the ECW. The ECC circuitry (30) is optimized to reduce the access delays introduced by carrying out on-chip error correction. The ECC block (30) provides both the corrected data bits and the check bits to an SRAM (40). Thus, the check bits can be externally accessed, improving testability of the memory chip. At the same time, having a set of interrelated bits in the SRAM (40) improves access performance when using multi-bit access modes, which compensates for whatever access delays are introduced by the ECC. To maximize the efficiency of switching from mode to mode, the modes are set as a function of received address signals.

公开(公告)号：DE2250198A1

公开(公告)日：1973-05-17

申请号：DE2250198

申请日：1972-10-13

Applicant: IBM

Inventor： ARNETT PATRICK CLINTON ,  STAPPER CHARLES HENRI

IPC: G11C27/04 ,  H01L21/339 ,  H01L29/10 ,  H01L29/762 ,  H01L29/768 ,  G11C11/34

公开(公告)号：SG43875A1

公开(公告)日：1997-11-14

申请号：SG1996003608

申请日：1991-01-24

Applicant: IBM

Inventor： BARTH JOHN EDWARD JR ,  DRAKE CHARLES EDWARD ,  FIFIELD JOHN ATKINSON ,  HOVIS WILLIAM PAUL ,  KALTER HOWARD LEO ,  LEWIS SCOTT CLARENCE ,  NICKEL DANIEL JOHN ,  STAPPER CHARLES HENRI ,  YANKOSKY JAMES ANDREW

IPC: G06F11/10 ,  G11C29/00 ,  G11C29/42 ,  G11C11/401 ,  G06F11/20

Abstract: A DRAM having on-chip ECC (30) and both bit and word redundancy that have been optimized to support the on-chip ECC. The bit line redundancy features a switching network that provides an any-for-any substitution for the bit lines in the associated memory array. The word line redundancy is provided in a separate array section (20), and has been optimized to maximize signal while reducing soft errors. The array stores data in the form of error correction words (ECWs) on each word line. A first set of data lines (formed in a zig-zag pattern to minimize unequal capacitive loading on the underlying bit lines) are coupled to read out an ECW as well as the redundant bit lines. A second set of data lines receive the ECW as corrected by bit line redundancy, and a third set of data lines receive the ECW as corrected by the word line redundancy. The third set of data lines are coupled to the ECC block, which corrects errors encountered in the ECW. The ECC circuitry (30) is optimized to reduce the access delays introduced by carrying out on-chip error correction. The ECC block (30) provides both the corrected data bits and the check bits to an SRAM (40). Thus, the check bits can be externally accessed, improving testability of the memory chip. At the same time, having a set of interrelated bits in the SRAM (40) improves access performance when using multi-bit access modes, which compensates for whatever access delays are introduced by the ECC. To maximize the efficiency of switching from mode to mode, the modes are set as a function of received address signals.

公开(公告)号：HK62097A

公开(公告)日：1997-05-16

申请号：HK62097

申请日：1997-05-08

Applicant: IBM

Inventor： BARTH JOHN EDWARD JR ,  DRAKE CHARLES EDWARD ,  FIFIELD JOHN ATKINSON ,  HOVIS WILLIAM PAUL ,  KALTER HOWARD LEO ,  LEWIS SCOTT CLARENCE ,  NICKEL DANIEL JOHN ,  STAPPER CHARLES HENRI ,  YANKOSKY JAMES ANDREW

IPC: G06F11/10 ,  G11C29/00 ,  G11C29/42 ,  G11C11/401 ,  G06F11/20

Abstract: A DRAM having on-chip ECC (30) and both bit and word redundancy that have been optimized to support the on-chip ECC. The bit line redundancy features a switching network that provides an any-for-any substitution for the bit lines in the associated memory array. The word line redundancy is provided in a separate array section (20), and has been optimized to maximize signal while reducing soft errors. The array stores data in the form of error correction words (ECWs) on each word line. A first set of data lines (formed in a zig-zag pattern to minimize unequal capacitive loading on the underlying bit lines) are coupled to read out an ECW as well as the redundant bit lines. A second set of data lines receive the ECW as corrected by bit line redundancy, and a third set of data lines receive the ECW as corrected by the word line redundancy. The third set of data lines are coupled to the ECC block, which corrects errors encountered in the ECW. The ECC circuitry (30) is optimized to reduce the access delays introduced by carrying out on-chip error correction. The ECC block (30) provides both the corrected data bits and the check bits to an SRAM (40). Thus, the check bits can be externally accessed, improving testability of the memory chip. At the same time, having a set of interrelated bits in the SRAM (40) improves access performance when using multi-bit access modes, which compensates for whatever access delays are introduced by the ECC. To maximize the efficiency of switching from mode to mode, the modes are set as a function of received address signals.