Abstract:
A channel (16) of a FinFET (10) has a channel core (24) and a channel envelope (32), each made from a semiconductor material defining a different lattice structure to exploit strained silicon properties. A gate is coupled to the channel envelope through a gate dielectric. Exemplary materials are Si and SixGe1-x, wherein 78
Abstract:
PROBLEM TO BE SOLVED: To provide a method and structure for a computer model for a device having a performance parameter. SOLUTION: A first bounded range and a second bounded range are included in the performance parameter. The first bounded range has performance parameter fluctuation within a single production process, and the second bounded range has performance parameter fluctuation in different device design. COPYRIGHT: (C)2003,JPO
Abstract:
System and method for compact model algorithms (310-350) to accurately account for effects of layout-induced changes in nitride liner (260) stress in semiconductor devices (200). The layout- sensitive compact model algorithms (310-350) account for the impact of large layout variation on circuits by implementing algorithms for obtaining the correct stress response approximations and layout extraction algorithms for obtaining the correct geometric parameters that drive the stress response. In particular, these algorithms include specific information from search "buckets" that are directionally-oriented and include directionally-specific distance measurements for analyzing in detail the specific shape neighborhood of the semiconductor device. The algorithms are additionally adapted to enable the modeling and stress impact determination of a device having single stress liner film and dual-stress liners (260) (two different liner films that abut at an interface).
Abstract:
A channel (16) of a FinFET (10) has a channel core (24) and a channel envelope (32), each made from a semiconductor material defining a different lattice structure to exploit strained silicon properties. A gate is coupled to the channel envelope through a gate dielectric. Exemplary materials are Si and SixGe1-x, wherein 78
Abstract:
A method of manufacture and device for a dual-gate CMOS structure. The structure includes a first plate (106a-d) in an insulating layer (100) and a second plate (110a-d) above the insulating layer electrically corresponding to the first plate. An isolation structure (108a-d) is between the first plate and the second plate.