Abstract:
A solution for performing a data correction on a hierarchical integrated circuit layout is provided. A method includes: receiving a CD compensation map for the long range critical dimension variation prior to the data correction; grouping compensation amounts of the CD compensation into multiple compensation ranges; generating multiple target layers corresponding to the multiple compensation ranges; super-imposing a region of the CD compensation map having a compensation amount falling into a compensation range over a respective target layer to generate a target shape; performing the data correction on the layout to generate a data corrected layout; performing the data correction on the target shape separately to generate a data corrected target shape; and combining the data corrected layout and the data corrected target shape based on the CD compensation map.
Abstract:
The present invention provides a lithographic difficulty metric that is a function of an energy ratio factor that includes a ratio of hard-to-print energy to easy-to-print energy of the diffraction orders along an angular coordinate i{ of spatial frequency space, an energy entropy factor comprising energy entropy of said diffraction orders along said angular coordinate ft, a phase entropy factor comprising phase entropy of said diffraction orders along said angular coordinate 6,, and a total energy entropy factor comprising total energy entropy of said diffraction orders (430, 440). The hard-to-print energy includes energy of the diffraction orders at values of the normalized radial coordinates r of spatial frequency space in a neighborhood of r=0 and in a neighborhood of r=l, and the easy-to-print energy includes energy of the diffraction orders located at intermediate values of normalized radial coordinates r between the neighborhood of r=0 and the neighborhood of r=l. The value of the lithographic difficulty metric may be used to identify patterns in a design layout that are binding patterns in an optimization computation. The lithographic difficulty metric may be used to design integrated circuits that have good, relatively easy-to-print characteristics.
Abstract:
A fast method of verifying a lithographic mask design is provided wherein catastrophic errors (432) are identified by iteratively simulating and verifying images for the mask layout using progressively more accurate image models (411), including optical and resist models. Progressively accurate optical models include SOCS kernels that provide successively less influence. Corresponding resist models are constructed that may include only SOCS kernel terms corresponding to the optical model, or may include image trait terms of varying influence ranges. Errors associated with excessive light, such as bridging, side- lobe or SRAF printing errors, are preferably identified with bright field simulations, while errors associated with insufficient light, such as necking or line-end shortening overlay errors, are preferably identified with dark field simulations.
Abstract:
A method for preparing a alignment layer surface provides a surface on the alignment layer. A chemically modified surfae [117] is formed as a result of quenching and/or ion beam treatment in accordance with the present invention, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Layer [117] is now substantially free from dangling bonds and free radicals which could degrade properties of a liquid crystal display. Now, a substrate [101] is formed for use in a liquid crystal displax device. Another method for preparing an alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for calculating intermediate-range and long-range image contributions from mask polygons. SOLUTION: An algorithm is introduced having application to optical proximity correction in optical lithography. A finite integral for each sector of a polygon replaces an infinite integral. A finite integral is achieved by integrating over two triangles instead of integrating on full sectors. An analytical approach is presented for a power law kernel to reduce the numerical integration of a sector to an analytical expression evaluation. The mask polygon is divided into a plurality of regions to calculate effects of interaction such as intermediate-range and long-range effects, by truncating the mask instead of truncating the kernel function. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To obtain a light bulb containing a twisted nematic liquid crystal(LC) layer in which the contrast and efficiency are improved and visibility of spacer posts in a black state is decreased by forming a reflection electrode with its edges parallel or perpendicular to the director axis of liquid crystal molecules when the director axis is projected on the surface of a back face. SOLUTION: A reflection pixel electrode 10 is formed on the lower side of a LC layer 4. The general alignment of the LC molecules is shown as a series of arrows from an arrow 2 on the upper face of the LC layer 4 to the arrow 3 on the lower face. The twisting orientation of the arrows from the upper part to the lower part represents the twist of the LC. The axis of the LC molecule and the rubbing direction on the lower substrate 6 are aligned along the edge of the pixel electrode 10 except for a small pretilt angle of the molecules on the back face. The polarization direction of the input polarized light is parallel or perpendicular to the LC director projected on the upper substrate. The LC director having specified depth in the LC is slightly tilted from the back face, which means that the LC director is oriented in the direction in which the refractive index for abnormal rays is minimum or maximum.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for carrying out model-based optical proximity correction by disposing a mask matrix having a region of interest (ROI) and locating a plurality of points of interest within the mask matrix, and to provide a program storage device for executing the above method. SOLUTION: A first polygon 200 having a plurality of vertices representative of the located points of interest is computed, followed by determining a spatial relationship between the vertices and the ROI 100. The vertices of the first polygon are pinned to boundaries of and within the ROI to form a second polygon 300 on the ROI. This processing is repeated for all vertices of the first polygon to collapse the second polygon on the ROI. The collapsed second polygon is used to correct for optical proximity. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for computing a phase map within an optical proximity correction simulation kernel. SOLUTION: A first method utilizes simulated wavefront information from randomly generated data. A second method uses measured data from optical tools. A phase map is created by analytically embedding a randomly generated two-dimensional array comprising complex numbers of wavefront information, and performing an inverse Fourier transform on the resultant array. A filtering function requires the amplitude of each element of the array to be multiplied by a Gaussian function. A power law is then applied to the array. The elements of the array are shuffled, and converted from a phasor form to a real/imaginary form. A two-dimensional fast Fourier transform is applied. The array is then unshuffled and converted back to the phasor form. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for computing manufacturability of a lithographic mask to be used for fabricating a semiconductor device. SOLUTION: A set of a plurality of target edges is selected from mask layout data of a lithographic mask (402). Then, target edge pairs are selected from the selected set of target edges (404). The manufacturability of the lithographic mask, including the manufacturing penalty in making the lithographic mask, is computed based on the target edge pairs selected (406). The manufacturability of the lithographic mask is output (408). The manufacturability of the lithographic mask is dependent on the manufacturing penalty in making the lithographic mask. COPYRIGHT: (C)2010,JPO&INPIT