Abstract:
A random access memory comprises a first circuit (130) configured to receive a strobe signal (132) and provide pulses in response to transitions in the strobe signal. The random access memory comprises a second circuit (100, 100n) configured to receive the strobe signal to latch data into the second circuit, and to receive the pulses to latch the latched data into the second circuit after the transitions in the strobe signal.
Abstract:
The system has an isolation block connected to a semiconductor die. A routing mechanism (114) is connected to the isolation block. The die is electrically disconnected from the routing mechanism when the block is activated. A die test pad is connected to the semiconductor die and the isolation block. The test pad is electrically disconnected from the routing mechanism when the isolation block is activated. An Independent claim is also included for a method of isolating a semiconductor die.
Abstract:
A random access memory includes a control circuit configured to receive a strobe signal and generate a pulse after one edge of the strobe signal and before the next edge of the strobe signal for each cycle of a clock signal and a latch circuit configured to receive the strobe signal and the pulse. The latch circuit is configured to latch data signals into the latch circuit with the strobe signal and to receive the pulse to prevent post-amble noise on the strobe signal from latching other signals into the latch circuit.
Abstract:
A system and method for monitoring internal voltage sources in an integrated circuit, such as a DRAM integrated circuit, includes an internal analog multiplexing circuit, an internal analog-to-digital converter, and an interface circuit. Through the analog multiplexing circuit, the analog-to-digital converter sequentially connects to each voltage source and converts the measured voltage level of the source to a binary word. The interface circuit presents the binary word, e.g., serially, to test equipment off the integrated circuit.
Abstract:
Verfahren zum Steuern eines Spannungserzeugers (112) für eine Speichervorrichtung (100), wobei das Verfahren folgende Schritte aufweist: Messen einer Temperatur der Speichervorrichtung (100); wenn die gemessene Temperatur außerhalb eines Schwellentemperaturbereichs ist, Erlauben, dass die Speichervorrichtung (100) in einem getakteten Standby-Modus (CSM) platziert wird, wodurch der Spannungserzeuger (112) selektiv mit einem Taktsignal aktiviert wird; und wenn die gemessene Temperatur innerhalb eines Schwellentemperaturbereichs ist, Verhindern, dass die Speichervorrichtung (100) in dem getakteten Standby-Modus (CSM) platziert wird.
Abstract:
An off-chip driver (OCD) circuit and technique to reduce skew between rising and falling edges of output signals as process conditions vary are provided. Variations in process conditions may result in stronger or weaker relative current drive between NMOS and PMOS transistors. One or more process-dependent compensating current paths may be added to conventional pull-up and/or pull-down current paths to compensate for process variations by supplementing the current drive of transistors used to charge (PMOS) or discharge (NMOS) an output node of and end driver (e.g., inverter) stage of an OCD.