Abstract:
PROBLEM TO BE SOLVED: To obtain a semiconductor memory having memory banks in which a design cost for a memory bank decoder is small. SOLUTION: In a semiconductor memory having memory banks, plural memory banks are operated by a memory bank decoder. Even if two groups of the memory bank are controlled through the same memory bank decoder, switching between the memory bank decoders is performed by using a pre- decoder. Thereby, layout of the memory bank decoder having comparatively small memory capacity can be succeeded to memories of memory bank decoder having comparatively large capacity.
Abstract:
PROBLEM TO BE SOLVED: To improve an integrated circuit by selecting a MOS transistor and supplying stable voltage. SOLUTION: A differential amplifier 1 has two input transistors T1, T2, a load element 2, and a current source 3 having a N channel MOS transistor T3, a section to be controlled of the transistor is connected to an input transistor and a current source supply connection terminal 31, and a control connection terminal G is connected to a connection terminal of a potential V3 being positive for a reference potential GND. An integrated circuit is inclined in a circuit device of a dynamic memory, the supply connection terminal of the current source is connected to a voltage source 4 for cutting off an array panel transistor of an integrated dynamic memory, and the voltage source has a negative potential V2 for the reference potential.
Abstract:
PROBLEM TO BE SOLVED: To prevent an interconnection portion from being made longer, while making a module thinner, in an integrated circuit chip laminated multi-chip module. SOLUTION: A multi-chip module (MCM) is provided with a first integrated circuit 310, a second integrated circuit 320, and a bridge layer 330, in at least one upper side of the second integrated circuit 320. The bridge layer 330 forms a signal path between the first contact section 331 of the bridge layer 330 and the second contact section 336 of the bridge layer 330. In order to transmit a signal from the first integrated circuit 310 to the outside of a package 340 and/or to receive the signal from the outside of the package 340 to the first integrated circuit 310, the bridge layer 330 forms the signal path between the first contact section 331 of the bridge layer 330 and an input/output (I/O) circuit element of the second integrated circuit 320, and also forms the signal path between the I/O circuit element of the second integrated circuit 320 and the second contact section 336 of the bridge layer 330. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To supply or introduce control voltage caused by a refresh-current to differential amplifiers functioning as receivers respectively in order to introduce a right operation point. SOLUTION: A receiver circuit, especially, parts arranged in a circuit for switching between a standby mode and an operation mode.
Abstract:
A system and method for refreshing data in a dynamic random access memory ("DRAM") is provided, where the system includes a data memory having a plurality of memory banks, a map memory in signal communication with the data memory for translating an internal address of each of the plurality of memory banks into a corresponding external address, a map comparator in signal communication with the map memory for selectively enabling a memory bank in accordance with its external address, a refresh address generator in signal communication with the map comparator for selectively refreshing the enabled memory bank in accordance with its external address, and a refresh counter in signal communication with the refresh address generator for signaling a refresh in accordance with the maximum required refresh time of the enabled memory bank; and where the corresponding method includes determining the maximum required refresh period for each of the memory banks, respectively, prioritizing the memory banks in accordance with their respective refresh periods, utilizing the memory banks in order of their respective prioritizations, selectively disabling at least one of the memory banks in reverse-order of their respective prioritizations, and refreshing only the remaining non-disabled memory banks.
Abstract:
An integrated dynamic memory includes a memory cell array having memory cells each assigned to one of a plurality of groups. The plurality of groups are divided into defect-free groups having exclusively defect-free memory cells and into defective groups having at least one defective memory cell. The memory further includes a memory configuration table that contains a list of the defect-free groups and an assignment unit that, based upon the entries in the memory configuration table, executes memory accesses only to those memory cells assigned to a defect-free group. The total capacity of the memory module, then, is not fixed once and for all with fabrication, but, rather, results only after a memory test, or may even vary in the course of the module lifetime.
Abstract:
The invention creates an oscillator circuit, in particular for a refresh timer device of a dynamic semiconductor memory, having a capacitor device (C; C') which is connected between a first node (6) and a first supply potential (P2); a current mirror circuit (T1; T2) for supplying a charging current for the capacitor device (C; C') which is connected via a first transistor device (T4) to the first node (6) and which has a current source (SQ) for supplying a substantially temperature-independent reference current (Iref); a second transistor device (T5), which is connected between the first node (6) and the first supply potential (P2); the first and second transistor devices (T4; T5) and a control signal being configured in such a way that the capacitor device (C; C') can be charged via the first node (6) when a potential (Vcomp) at the first node (6) is lower than the reference potential (Vref), and can be discharged via the first node (6) when the potential (Vcomp) at the first node (6) is higher than the reference potential (Vref) such that the signal at an output (A) oscillates.
Abstract:
The method provides parallel amplification of 2 input signals for providing 2 amplified output signals, with alternation of the amplitudes of the input signals within a given time frame, for providing a first output signal which has a relatively large gradient over a first time frame and a lesser gradient over a second time frame and a second output signal which has a relatively small gradient over a first time frame and a greater gradient over a second time frame. An Independent claim for a circuit with 2 driver stages for parallel read-out of signals is also included.
Abstract:
Production of a heat deviating surface of a component (1) comprises inserting trenches (3) into the component using an etching process. Preferred Features: The surface of the component is covered with a masking layer (2) in prescribed regions and during etching trenches are etched into the non-covered regions of the surface of the component. An etching solution comprising a 25 vol.% tetramethylammonium hydroxide solution or ethylene diamine or hydrazine is used at 70 deg C. The masking layer is applied to regions of the surface of the component in which the component is divided during the subsequent process steps.
Abstract:
An integrated circuit has a differential amplifier in a basic circuit having two input transistors, a load element and a power source. The power source has an N-type channel MOS transistor whose controlled path is connected to the input transistors and to a supply terminal of the power source. A control terminal of the transistor is connected to a potential that is positive with respect to a reference potential. The supply terminal of the power source is connected to a potential which is negative with respect to the reference potential and which is made available by a voltage source for switching off cell field transistors of a DRAM memory. The gate-source voltage that is increased in this way improves the behavior of the circuit with respect to fluctuations in potential and permits more favorable dimensioning of the transistor.