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    Semiconductor chip attachment
    1.
    发明专利
    Semiconductor chip attachment 审中-公开
    半导体芯片附件

    公开(公告)号：JP2008252091A

    公开(公告)日：2008-10-16

    申请号：JP2008069682

    申请日：2008-03-18

    Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

    Inventor： GUTH KARSTEN ,  SPECKELS ROLAND ,  KEMPER ALFRED

    IPC: H01L21/52

    CPC classification number: H01L21/6838 ,  H01L21/67005 ,  H01L24/75 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

    Abstract: PROBLEM TO BE SOLVED: To provide a device and a method for chip attachment which achieve uniformity in thickness of an adhesive layer between a semiconductor chip and a substrate. SOLUTION: A pick-up arm 10 has a collet 15, a ball 16 and a rod 17. The rod 17 is connected to the ball 16 disposed below it. The ball 16 is connected to the collet 15 as a rotatable chip-receiving member provided below it. The collet 15 is rotatable essentially around a point, and the attachment method of the semiconductor chip 11 achieves uniformity in thickness of the adhesive layer 12 disposed between the semiconductor chip 11 and the substrate 13 by compensating inclination between the semiconductor chip 11 and the substrate 13. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种实现半导体芯片和基板之间的粘合剂层的厚度均匀性的芯片附接装置和方法。 解决方案：拾取臂10具有夹头15，球16和杆17.杆17连接到设置在其下方的球16。 球16作为设置在其下方的可旋转的芯片接收构件连接到夹头15。 夹头15基本上围绕点旋转，并且半导体芯片11的附接方法通过补偿半导体芯片11和基板13之间的倾斜来实现设置在半导体芯片11和基板13之间的粘合剂层12的厚度的均匀性 版权所有（C）2009，JPO＆INPIT

    Mounting of semiconductor chip
    2.
    发明专利
    Mounting of semiconductor chip 有权
    半导体芯片的安装

    公开(公告)号：JP2011018937A

    公开(公告)日：2011-01-27

    申请号：JP2010212581

    申请日：2010-09-22

    Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

    Inventor： GUTH KARSTEN ,  SPECKELS ROLAND ,  KEMPER ALFRED

    IPC: H01L21/52

    CPC classification number: H01L21/6838 ,  H01L21/67005 ,  H01L24/75 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

    Abstract: PROBLEM TO BE SOLVED: To provide a chip carrier member for mounting a semiconductor chip on a substrate.SOLUTION: A chip carrier member includes a rotatable chip-receiving element which is rotatable around a point, a supporting part which is connected to a surface of the rotatable chip-receiving element, a vacuum suction channel having a first terminal connected to a bottom of the rotatable chip-receiving element and a second terminal connected to a surface of the supporting part, and a heating part. The supporting part has a vibration board 46' provided in a gap between the supporting part and the rotatable chip-receiving element. The vibration board 46' has a projection part 47' disposed inside a groove 45' of the supporting part.

    Abstract translation: 要解决的问题：提供一种用于将半导体芯片安装在基板上的芯片载体构件。解决方案：芯片载体构件包括可绕点旋转的可转动的芯片接收元件，连接到 可旋转的芯片接收元件，具有连接到可旋转的芯片接收元件的底部的第一端子和连接到支撑部件的表面的第二端子的真空吸引通道和加热部件。 支撑部具有设置在支撑部和可旋转芯片接收元件之间的间隙中的振动板46'。 振动板46'具有设置在支撑部的槽45'的内侧的突出部47'。

    4.
    发明专利
    未知

    公开(公告)号：DE102007047698A1

    公开(公告)日：2008-04-17

    申请号：DE102007047698

    申请日：2007-10-05

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KEMPER ALFRED ,  SPECKELS ROLAND

    IPC: H01L21/58 ,  H01L21/60

    Abstract: An apparatus for connecting at least two components contains a lower die and an upper die. The lower die has the components which are to be connected, with the first component supporting the at least second component with an at least partial overlap relative to the first component. The lower die and the upper die can be moved relative to one another. The upper die carries at least two heatable plungers which are connected so as to be able to move relative to one another via a sealed pressure pad. The plungers and the pressure pad have a first flexible layer between them. A second flexible layer is arranged between the upper die and the lower die.

    5.
    发明专利
    未知

    公开(公告)号：DE102005045100A1

    公开(公告)日：2007-03-29

    申请号：DE102005045100

    申请日：2005-09-21

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KEMPER ALFRED ,  STROTMANN GUIDO

    IPC: H01L21/607 ,  H01L23/49 ,  H01L23/498 ,  H01L25/07

    Abstract: A method for producing a power semiconductor module including forming a contact between a contact region and a contact element as an ultrasonic welding contact via a sonotrode. The ultrasonic welding operation also being used for joining the contact regions with the contact ends and consequently for joining the contacts and the foot regions.

    6.
    发明专利
    未知

    公开(公告)号：DE102006034600A1

    公开(公告)日：2008-02-07

    申请号：DE102006034600

    申请日：2006-07-26

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KEMPER ALFRED

    IPC: H05K3/34 ,  B23K1/002

    Abstract: A method for producing an electronic device is disclosed. One embodiment provides two soldering partners to be connected to one another at an envisaged joining location and at least one of which includes an electronic component or is formed as such a component, a soldering apparatus having an inductor, and an intermediate plate The soldering partners, the inductor and the intermediate plate are positioned in such a way that the intermediate plate is arranged between the electronic component and the envisaged joining location, on the one hand, and the inductor. The soldering partners are connected at the envisaged joining location by using a solder that is melted by energy emitted by the inductor.

    9.
    发明专利
    未知

    公开(公告)号：DE102006034600B4

    公开(公告)日：2010-01-14

    申请号：DE102006034600

    申请日：2006-07-26

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KEMPER ALFRED

    IPC: H05K3/34 ,  B23K1/002 ,  H05B6/10

    Abstract: A method for producing an electronic device is disclosed. One embodiment provides two soldering partners to be connected to one another at an envisaged joining location and at least one of which includes an electronic component or is formed as such a component, a soldering apparatus having an inductor, and an intermediate plate The soldering partners, the inductor and the intermediate plate are positioned in such a way that the intermediate plate is arranged between the electronic component and the envisaged joining location, on the one hand, and the inductor. The soldering partners are connected at the envisaged joining location by using a solder that is melted by energy emitted by the inductor.

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