IMPROVED CMP EVENNESS
    1.
    发明专利

    公开(公告)号:JP2000280166A

    公开(公告)日:2000-10-10

    申请号:JP2000078478

    申请日:2000-03-21

    Abstract: PROBLEM TO BE SOLVED: To even the distribution of the slurry during the polishing by distributing the slurry from plural positions onto a polishing cloth. SOLUTION: A multi-position slurry dispenser 242 has a discharge pipe, and this discharge pipe has plural outlets 248 formed in the discharge pipe. The discharge pipe can be formed into a cylindrical shape. The discharge pipe is positioned along the radius of a polishing cloth. The slurry is distributed onto the polishing cloth 246 through outlets. The slurry is distributed to various parts of the polishing cloth 246 by having plural outlets, and distribution of the slurry capable of being controlled more for improvement of the CMP process is generated. The multi-position dispenser is optimally used in response to a set of an operation parameter and/or expendable supplies so as to form a slurry profile for generating a desirable polishing characteristic.

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