Abstract:
FABRICATION METHOD OF A MICROMECHANICAL DEVICE 5 A METHOD FOR FABRICATING A MICROMECHANICAL DEVICE COMPRISES THE STEPS OF PROVIDING A SUBSTRATE HAVING A FIRST DIELECTRIC LAYER ON TOP SURFACE OF SAID SUBSTRATE, A BOTTOM CONDUCTIVE LAYER ON TOP SURFACE OF SAID FIRST DIELECTRIC LAYER, A SECOND DIELECTRIC LAYER ON SAID BOTTOM CONDUCTIVE LAYER, A 0 SACRIFICIAL LAYER ON SAID SECOND DIELECTRIC LAYER, A THIRD DIELECTRIC LAYER ON SAID SACRIFICIAL LAYER, AND A TOP CONDUCTIVE LAYER ON SAID THIRD DIELECTRIC LAYER, ETCHING A PLURALITY OF HOLES AT SAID TOP CONDUCTIVE LAYER, THEN AT SAID THIRD DIELECTRIC LAYER AND SAID SACRIFICIAL LAYER, AND SEALING 5 SAID ETCHED HOLES OF SAID TOP CONDUCTIVE LAYER AND THIRD DIELECTRIC LAYER BY DEPOSITING A FOURTH DIELECTRIC LAYER ON TOP OF SAID TOP CONDUCTIVE LAYER. MOST ILLUSTRATIVE DIAGRAM:
Abstract:
THE PRESENT INVENTION RELATES TO CAPACITIVE SENSORS FOR MEASURING HUMIDITY AND MOISTURE AND TO AN IMPROVED PROCESS FOR MAKING THE SAME. THE FABRICATION PROCESS FOR A CAPACITIVE SENSOR HAVING A MULTI-LAYER ELECTRODES FOR MEASURING HUMIDITY AND MOISTURE COMPRISING DISPOSING THE MULTI-LAYER INTERDIGITATED ELECTRODES (2, 9) IN A MULTI-LAYER POLYIMIDES (5, 6, 7); PROVIDING A PLURALITY OF TRENCHES (12) ON THE SURFACE OF THE ELECTRODE BY LIFT OFF PROCESS; AND COVERING THE SENSOR WITH PHOTOSENSITIVE NEGATIVE POLYIMIDE.
Abstract:
A METHOD OF PACKAGING A MICROMECHANICAL WAFER WITH A DIELECTRIC LAYER (23) OVER SAID MICROMECHANICAL WAFER USING A SPINNING TECHNIQUE. THE DIELECTRIC LAYER (23) IS THEN HEATED (25) TO REMOVE WATER AND CURED (26) THE LAYER OF THE MICROMECHANICAL DEVICE TO PROVIDE A PROTECTIVE COATING TO THE MICROMECHANICAL DEVICE. THE MICROMECHANICAL DEVICE IS THEN FURTHER ENCAPSULATED (30) WITH A PLASTIC MATERIAL.
Abstract:
The present invention relates to capacitive sensors for measuring humidity and moisture and to an improved process for making the same. The fabrication process for a capacitive sensor having a multi-layer electrodes for measuring humidity and moisture comprising disposing the multi-layer interdigitated electrodes in a multi-layer polyimides; providing a plurality of trenches on the surface of the electrode by lift off process; and covering the sensor with photosensitive negative polyimide.