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    MANUFACTURING METHOD FOR SEMICONDUCTOR LASER ELEMENT
    2.
    发明专利
    MANUFACTURING METHOD FOR SEMICONDUCTOR LASER ELEMENT 审中-公开

    公开(公告)号：JP2002124729A

    公开(公告)日：2002-04-26

    申请号：JP2001249229

    申请日：2001-08-20

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： ACKLIN BRUNO ,  GROETSCH STEFAN

    IPC: H01L21/301 ,  H01L21/48 ,  H01S5/024

    Abstract: PROBLEM TO BE SOLVED: To provide an improved manufacturing method, for a semiconductor laser element, in which a semiconductor substrate can be attached at low costs and simply. SOLUTION: The manufacturing method for the semiconductor laser element is provided with a step in which a cooling element is manufactured by using an electrical insulating platelike substrate (1) comprising the main surface covered with a metal layer, a step in which the metal layer is structured into a plurality of chip mounting regions (2), a step in which a plurality of semiconductor laser chips (11) are mounted and a step in which the cooling element is divided into a plurality of semiconductor laser elements equipped with at least one each of a semiconductor laser chip and a part of the cooling element.

    5.
    发明专利
    未知

    公开(公告)号：DE59806609D1

    公开(公告)日：2003-01-23

    申请号：DE59806609

    申请日：1998-09-03

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： GROETSCH STEFAN ,  WICKE MARKUS ,  SPAETH WERNER ,  ACKLIN BRUNO

    IPC: H01S5/00 ,  G02B27/14 ,  H01S3/00 ,  H01S5/022 ,  H01S5/22 ,  H01S5/40

    Abstract: The laser component has a laser array (2) and an optical device (1) for rearranging a laser beam bundle emitted from the array. The component has at least two individual laser beams with the same first emission direction (10). The beam axes are parallel to each other, lie in a common plane and are spaced apart by a first distance (a1). The optical device has a reversing mirror element (3) after the laser array in the beam direction. The beams of the bundle (11) are deflected by the mirror element parallel and perpendicular to the common plane (5). The mirror element has the same number of beam passing waveguide strips (4) as the number of individual beams. The strips are combined in a stack and their thickness is less than the first distance. The strips lie parallel to each other and at an angle to the common plane of the beams. A waveguide strip is associated with each individual beam. The corresponding beam is coupled into the first end (13) of the strip through a beam coupling surface (12). Each strip has a reflection surface (7) which intersects the beam axis of the respective beam. The reflection surface faces a second end (14) of the associated strip and reflects the beam to the second end region. The second end has a beam output surface (15) through which the individual laser beam exits from the waveguide strip.

    7.
    发明专利
    未知

    公开(公告)号：DE10040450B4

    公开(公告)日：2008-07-10

    申请号：DE10040450

    申请日：2000-08-18

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： GROETSCH STEFAN ,  ACKLIN BRUNO

    IPC: H01S5/024 ,  H01L21/301 ,  H01L21/48 ,  H01L23/36 ,  H01S5/022

    Abstract: A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components.

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