Abstract:
L'invention concerne un procédé de formation de vias traversants (14) reliant la face avant à la face arrière d'un substrat semiconducteur (1), comprenant les étapes suivantes : a) former des ouvertures dans le substrat, b) oxyder thermiquement des parois des ouvertures, c) remplir les ouvertures d'un matériau sacrificiel, d) réaliser des composants électroniques (T1, T2) dans le substrat, e) graver le matériau sacrificiel, f) remplir les ouvertures d'un métal, g) graver la face arrière du substrat jusqu'au niveau du fond des ouvertures.
Abstract:
L'invention concerne une mémoire vive (45) comprenant un transistor (30) ; un élément mémoire magnétique (10) comprenant une face inférieure du côté du transistor et une face supérieure opposée à la face inférieure ; une première ligne conductrice (22) disposée entre le transistor et l'élément mémoire au niveau de la face inférieure et isolée de l'élément mémoire ; une seconde ligne conductrice (50) au contact de la face inférieure et interposée entre la première ligne conductrice et l'élément mémoire ; et un pont de connexion (51) reliant la face supérieure à une borne principale du transistor.
Abstract:
Boîtier, en particulier pour biopile, comprenant trois éléments de boîtier (EL1, EL2, EL3) comportant chacun une membrane poreuse (MBC1, MBC2, MB3) dont deux d'entre elles (MBC1, MBC2) sont électriquement conductrices et forment la cathode et l'anode de la biopile.
Abstract:
Procédé de fabrication d'un dispositif comportant une membrane poreuse électriquement conductrice fixée sur un support, caractérisé en ce qu'il comprend une réalisation de la membrane et du support à partir d'un même élément en silicium (SB), ladite réalisation comportant une formation locale d'une région de silicium poreux (RP) dans ledit élément en silicium (SB) et une siliciuration au moins partielle de ladite région de silicium poreux, la région siliciurée formant ladite membrane poreuse électriquement conductrice (MBC) et la partie restante en silicium dudit élément formant ledit support (SP).
Abstract:
PROBLEM TO BE SOLVED: To provide an FAMOS memory location which can have at least three completely natural program levels. SOLUTION: An FAMOS memory location is provided with a single floating gate (GR) overlapping the active plane of a semiconductor substrate along contour (PF1, PF2) of at least two asymmetric overlaps in order to determine at least two electrodes in an active region. A memory location program means (MC, SW) applies a set of specified different voltages selectively to the electrodes such that at least three program logical levels are outputted to the memory location.
Abstract:
PROBLEM TO BE SOLVED: To prevent a read error caused by variation of a property of a reference memory cell. SOLUTION: This method is a method for refreshing a reference memory cell (Cref) in a non-volatile memory. This method has a step in which the reference cell (Cref) and a test cell (Cveri) are simultaneously selected during read, read signals are compared when a signal read by the reference cell is smaller than a signal read by the test cell, and refresh signals (Sr1, Sr2, Sr3) are outputted to the reference cell (Cref). This method is applied to an electronic memory of a non-volatile type.
Abstract:
PROBLEM TO BE SOLVED: To provide a memory device which overcomes the data holding problem caused by the thinness of its grid dielectric present in the interface between its STI-type isolation region and its grid material. SOLUTION: The semiconductor memory device comprises a non-volatile programmable and electrically erasable memory cell having a single layer of grid material. Also, the memory cell comprises a floating grid transistor and a control grid within an active semiconductor area which is formed in a region of a substrate and is delimited by an isolation region. The single layer of grid material wherein the floating grid is formed extends integrally above the active semiconductor area without overlapping part of the isolation region. The floating grid transistor is electrically isolated from the control grid by PN junctions that are inversely polarized. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To electrically erase an FAMOS memory cell. SOLUTION: The memory cell is electrically erased by applying a substrate with a voltage VB, having a value less than the threshold predetermined not to break a cell, which is higher at least by 4 volt than a voltage which is the lower of a voltage VS applied to a source and a voltage VD applied to a drain.
Abstract:
PROBLEM TO BE SOLVED: To prevent access to confidential information. SOLUTION: This integrated circuit has a reference ground voltage Gnd and a power supply voltage Vdd for logical operation and is applied with a high voltage HV. It has a protective device 2 that has, at least, one gate oxide circuit element in combination. The protective device 2 is applied with a logical operation voltage Vdd at the power supply node N of, at least, one of the gate oxide circuit elements when operating normally, but the high voltage VH is applied to break down the gate oxide when malfunctioning.