公开(公告)号：JP2009182883A

公开(公告)日：2009-08-13

申请号：JP2008021984

申请日：2008-01-31

Applicant: Toshiba Corp ,  株式会社東芝

Inventor： TEJIMA MASAO ,  SATO KOICHI ,  SUZUKI HIROMICHI ,  MORI MIKI ,  YAMAMOTO TETSUYA

IPC: H01Q7/00 ,  G06K19/07 ,  G06K19/077 ,  H01Q1/24 ,  H04B5/02 ,  H04M1/02

CPC classification number: H01Q1/243 ,  G06K19/07749 ,  H01Q7/00

Abstract: PROBLEM TO BE SOLVED: To provide a mobile terminal that has eliminated a housing case essentially, which incorporates a printed board, a loop antenna, etc., and which has high rigidity and a thinned shape. SOLUTION: The mobile terminal 100 is solidified by a resin 5 with a loop antenna 20 in the shape of a plate, a printed board 30, and other parts being incorporated. The loop antenna 20 is used as an RFID antenna. On the backside of the mobile terminal 100, a display that also serves as an ID card, such as a staff identity card, is printed and is utilized to identify/manage staff along with the loop antenna 20. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种基本上消除了外壳的移动终端，其包括印刷板，环形天线等，并且具有高刚性和变薄的形状。 解决方案：移动终端100被树脂5固化，环形天线20呈板状，印刷板30和其它部件的形式。 环形天线20用作RFID​​天线。 在移动终端100的背面，打印也用作身份证（如工作人员身份证）的显示器，并用于与环形天线20一起识别/管理人员。版权所有（C） ）2009，JPO＆INPIT

公开(公告)号：JP2006073413A

公开(公告)日：2006-03-16

申请号：JP2004257100

申请日：2004-09-03

Applicant: Toshiba Corp ,  株式会社東芝

Inventor： KOIWA KAORU ,  MORI MIKI

IPC: H01J31/12 ,  H01J9/14 ,  H01J29/04

Abstract: PROBLEM TO BE SOLVED: To provide a display device and a manufacturing method of the display device wherein display quality is superior.
SOLUTION: The display device is provided with the front substrate and the rear substrate 12 which are opposingly arranged by placing a gap and the peripheral fringe parts are mutually joined together, a plurality of electron emitting elements installed on the surface opposite to the front substrate of the rear substrate, and the plurality of wirings to supply driving voltages to these display elements. After forming the wirings on the rear substrate 12 when forming the wirings, the wirings are formed by pressing the surface of the wirings and by having the surface of the wirings planarized.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决的问题：提供一种显示装置及其显示质量优越的显示装置的制造方法。 解决方案：显示装置设置有通过放置间隙而相对布置的前基板和后基板12，并且外围边缘部分相互连接在一起，多个电子发射元件安装在与 后基板的前基板和多个布线以向这些显示元件提供驱动电压。 在形成布线后，在后基板12上形成布线之后，通过按压布线的表面并使布线的表面平坦化而形成布线。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2000348650A

公开(公告)日：2000-12-15

申请号：JP2000069825

申请日：2000-03-14

Applicant: TOSHIBA CORP

Inventor： ITO TAKESHI ,  OKUMURA HARUHIKO ,  MORI MIKI ,  FUKUDA YUMI ,  FUJIWARA HISAO ,  HARA YUJIRO ,  KOBAYASHI HITOSHI ,  YAMAMOTO MASAHIKO ,  SAITO MASAYUKI ,  NAKAMOTO MASAYUKI

IPC: G09F9/30 ,  G09G3/20 ,  G09G3/22 ,  H01J29/04 ,  H01J31/12 ,  H01J63/04 ,  H04N5/68

Abstract: PROBLEM TO BE SOLVED: To suppress a step-cut caused by cathode wiring width and image quality degradation caused by increase of wiring resistance, by making different the number of emitters connected each cathode wiring in a unit picture element. SOLUTION: Four parallel cathode wiring lines 43 are provided longitudinally, one gate wiring line 51 is provided transversely, crossing parts between them form one picture element region 60. Different numbers of electric-field-emission- type emitter elements 42 are provided on the cathode wiring lines 43 to form regions 65, 66, 67, 68. Wiring widths of four cathode wiring lines 43 are the same in the regions 65, 66, 67, 68, and four emitter elements 42 are provided in the region 65, eight emitter elements 42 are provided in the region 66, 16 emitter elements 42 are provided in the region 67, 32 emitter elements 42 are provided in the region 68, on each of the cathode wiring lines 43. When an image is displayed, scan signals are impressed on the gate wiring line 51 selectively one by one, and synchronously a cathode wiring line to be impressed of four cathode wiring lines 43 is selected according to luminance of the image signals.

公开(公告)号：JP2000020005A

公开(公告)日：2000-01-21

申请号：JP18491398

申请日：1998-06-30

Applicant: TOSHIBA CORP

Inventor： MORI MIKI ,  OKUMURA HARUHIKO

IPC: G02F1/133 ,  G09G3/20 ,  H01J29/04 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To provide a function element array constituted to prevent deterioration in image quality by wiring delay and to make it possible to obtain high- grade image quality with respect to a large-sized function element array. SOLUTION: This function element array has the structure obtd. by forming first wiring 1 for driving first function element groups and second wiring 2 for driving second function element groups existing on the extension of the first function element groups on a substrate in parallel as multilayered wiring or in the same layers, executing drive signal supply to the first wiring 1 and the second wiring 2 from one side and dividedly driving the first function element groups and the second function element groups.

公开(公告)号：JPH11161207A

公开(公告)日：1999-06-18

申请号：JP32930497

申请日：1997-11-28

Applicant: TOSHIBA CORP

Inventor： MORI MIKI ,  KIZAKI YUKIO ,  TAIRA KAZUKI ,  ITO TAKESHI ,  HASEGAWA TSUTOMU ,  HARA YUJIRO

IPC: G09F9/40

Abstract: PROBLEM TO BE SOLVED: To provide a large-sized function element array constructed stickingly and connected electrically by electrically connecting wires on the main surfaces of a first and a second substrates through a through-hole and reverses surface wiring on each substrate. SOLUTION: Four sheets of substrate 7a-7d with a plularity of transistors 1, pixel electrodes 2, gate wires 3 and signal wires 4 formed on their main surfaces are connected in their side surfaces. The gate wires 3 formed on the main surfaces of the substrate 7a and the adjacent substrate 7d, for example, are electrically connected via through-holes 5 on the substrates 7a, 7d and reverse surface wiring 6 on the reverse surfaces thereof. Similarly, the signal wiring 4 formed on the main surfaces of the substrates 7a, 7b are electrically connected via the through-holes 5 on the substrates 7a, 7b and the rear surface wiring 6 on the rear surfaces thereof.

公开(公告)号：JPH1172771A

公开(公告)日：1999-03-16

申请号：JP23428397

申请日：1997-08-29

Applicant: TOSHIBA CORP

Inventor： ITO TAKESHI ,  TAIRA KAZUKI ,  HASEGAWA TSUTOMU ,  KIZAKI YUKIO ,  HARA YUJIRO ,  MORI MIKI

IPC: G02F1/1333 ,  G02F1/1339 ,  G09F9/40

Abstract: PROBLEM TO BE SOLVED: To decrease a nondisplay region by forming a first groove each in the side face of a first substrate and in the side face of a third substrate adjacent to the side face of the first substrate so that spreading of a sealing material is controlled by the grooves as recesses or the banks as projections in the joining region of adjacent faces. SOLUTION: A third groove 31 to hold a liquid crystal is formed in the joining region on the surface of an insulating substrate 30. A sealing material to seal the liquid crystal is applied in a part 32 shown as hatched in the figure, and two insulating substrates are adhered under pressure. The volume V of the grooves of the substrates is calculated by V=a×b×c×2, and the volume of the sealing material applied in the hatched part is almost equal to V. After adhering the substrates, the sealing width is controlled not to intrude into the display face from the display region side 33 of the groove. Then the sealing region is irradiated with UV rays through a mask so that only the sealing region is hardened with UV rays to complete sealing. Thus, spreading of the sealing material into the display region can be controlled by the space structure of the substrate surface, the area where the sealing material is deposited can be decreased to the min. and the seaming width can be decreased.

公开(公告)号：JPH1152350A

公开(公告)日：1999-02-26

申请号：JP20676797

申请日：1997-07-31

Applicant: TOSHIBA CORP

Inventor： TAIRA KAZUKI ,  HASEGAWA TSUTOMU ,  HARA YUJIRO ,  KIZAKI YUKIO ,  ITO TAKESHI ,  MORI MIKI

IPC: G02F1/1335 ,  G02F1/1333 ,  G02F1/136 ,  G02F1/1368 ,  G09G3/36

Abstract: PROBLEM TO BE SOLVED: To provide a liquid crystal display device having high productivity, a large display screen and high display quality. SOLUTION: A liquid crystal layer is held between a first substrate 10a which has picture element regions arranged in a matrix form over the joined plural array substrates 11a, 12a and pixel electrodes 22 R, G, B which are disposed in a plurality in parallel within these picture element regions and a second substrate which is disposed with counter electrodes. The picture element regions consist of the first picture element regions arrayed by each one row from both sides of the joining line of the plural array substrates and the second picture element regions arrayed alternately with the first picture element regions within the array substrates 11a, 12a and the element includes black matrices 32 disposed so as to shield the light to the regions between the adjacent first picture element regions.

公开(公告)号：JPH10294337A

公开(公告)日：1998-11-04

申请号：JP10321397

申请日：1997-04-21

Applicant: TOSHIBA CORP

Inventor： YAMADA HIROSHI ,  TOGASAKI TAKASHI ,  TATEYAMA KAZUKI ,  MIYAGI TAKESHI ,  MORI MIKI

IPC: H01L21/60 ,  H05K3/34 ,  H01L21/321

Abstract: PROBLEM TO BE SOLVED: To relieve the strain due to stress of bumps due to the difference between the thermal expansion coefficients of a semiconductor chip and a circuit wiring board by a method wherein high-melting point solder alloy layers, which are firm to the strain due to stress, are selectively arranged only on the side of the board and the compositions of the alloy layers are changed in a stepwise manner to the side of the chip. SOLUTION: Bump electrodes 3 are respectively constituted of a first solder alloy layer 4 having a first melting point, a third solder alloy layer 5 having a third melting point, which is lower than the first melting point and is higher than a second melting point, and a second solder alloy layer 6 having the second melting point, which are arranged in order from the side of a circuit wiring board 2. Accordingly, as the solder composition alloy layers, which are firm to the strain due to stress, are arranged on the side part, in which the strain due to stress is generated most greatly, of the board 2, the strain due to stress of bumps is relaxed. Moreover, as the melting temperature of the layer 5 is within the ranges of the melting temperatures of the layers 4 and 6, a semiconductor chip 1 can be reliably bonded to the board 2 without needing a flux by heating simultaneously the chip 1 and the board 2 within the ranges of these temperatures to pressure-weld the alloy layers to each other.

公开(公告)号：JPH10221708A

公开(公告)日：1998-08-21

申请号：JP2500297

申请日：1997-02-07

Applicant: TOSHIBA CORP

Inventor： KAWADA YASUSHI ,  YAMAGUCHI HAJIME ,  YAMAGUCHI TAKASHI ,  MORI MIKI ,  YAMADA HIROSHI ,  HARUHARA KAZUYUKI ,  TANAKA MASAO ,  SUGAWARA ATSUSHI ,  SHIMIZU SEISABURO ,  NAITO KATSUYUKI ,  ENOMOTO SHINTARO ,  IWANAGA HIRONORI ,  OKAJIMA MASASUE

IPC: G02F1/1333 ,  G02F1/1347 ,  G02F1/136 ,  G02F1/1368 ,  G09F9/00 ,  G09F9/35 ,  G09F9/46

Abstract: PROBLEM TO BE SOLVED: To provide a simply manufacturable reflection type liquid crystal display element with high reliability. SOLUTION: This element is the reflection type liquid crystal display element provided with a first substrate formed with a transparent electrode, a middle layer substrate 23 arranged separated from and opposite to the first substrate and whose surface/back surface are electrically conducted through a blind hole, a first liquid crystal layer 33 held between the middle layer substrate 23 and the first substrate and on which external light is made incident, a second substrate arranged separated from and opposite to the middle layer substrate 23 and having a reflection electrode and a second liquid crystal layer 34 held between the middle layer substrate 23 and the second substrate. The sectional area of the blind hole provided on the middle layer substrate 23 is changed in the thickness direction of this middle layer substrate 23.

公开(公告)号：JPH10154315A

公开(公告)日：1998-06-09

申请号：JP26736397

申请日：1997-09-30

Applicant: TOSHIBA CORP

Inventor： YODA HIROAKI ,  HORI AKIO ,  OSAWA YUICHI ,  MORI MIKI ,  YOSHIKAWA MASAHISA ,  SAHASHI MASASHI

IPC: G11B5/31 ,  G11B5/39 ,  G11B21/21

Abstract: PROBLEM TO BE SOLVED: To enhance the heat radiation characteristic near an electromagnetic conversion part in order to suppress the occurrence of the thermal asperity of a thin-film magnetic head and the deterioration in the characteristics of the electromagnetic conversion part with an increase in temp. and to suppress the wear near the electromagnetic conversion part in order to suppress the deterioration of recording and reproducing resolution and the wear of the lubricating layer on a recording medium side. SOLUTION: This thin-film magnetic head has the electromagnetic conversion part 22 which is positioned in approximately the central part in a track width direction by being held by a first ceramic substrate 25 and a second ceramic substrate 26 from the film thickness direction thereof. The electromagnetic conversion part 22 is held by the first and second ceramic substrates 25, 26 from, for example, approximately the track width direction. The electromagnetic conversion part 22 has a yoke type reproducing section having at least a pair of magnetic cores intervened with a magnetic gap on the side of the surface facing the medium and a magneto-resistive element to which signal magnetic fluxes are lead from the magnetic recording medium via a pair of these magnetic cores.