公开(公告)号：US12133338B2

公开(公告)日：2024-10-29

申请号：US17913212

申请日：2021-03-24

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yoshiaki Sakaniwa ,  Toyo Ohashi

IPC: H05K1/02 ,  H01L21/48 ,  H05K1/03 ,  H05K3/10 ,  H05K3/20 ,  H05K3/44 ,  H05K3/00

CPC classification number: H05K3/44 ,  H01L21/4846 ,  H05K1/03 ,  H05K3/0061 ,  H05K3/20 ,  H05K2201/0154 ,  H05K2201/0162

Abstract: An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.

公开(公告)号：US12120828B2

公开(公告)日：2024-10-15

申请号：US17835873

申请日：2022-06-08

Applicant: AAC Technologies (Nanjing) Co., Ltd.

Inventor： Rui Pan ,  Hongyuan Wang ,  Yilan Zhang ,  Hezhi Wang

IPC: H05K3/00 ,  H05K1/03 ,  H05K3/02

CPC classification number: H05K3/0044 ,  H05K1/0313 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/1545

Abstract: A reel mechanism and a winding device for a flexible copper clad laminate includes a rotating roller, a winding belt wound on the rotating roller for winding the flexible copper clad laminate, first and second limit structures arranged one side of the winding belt away from the rotating roller. A space between the first limit structures and the second limit structures accommodates the flexible copper clad laminate. When the winding belt is wound with multiple layers outside the rotating roller, adjacent layers of the winding belt are spaced apart by the first and second limit structures. Since a protruding height of the first limit structures is equal to a protruding height of the second limit structures, and intervals between adjacent layers of a composite coil formed by the winding belt and the flexible copper clad laminate are equal, which avoids adhesion and copper foil surface oxidation.

公开(公告)号：US12101879B2

公开(公告)日：2024-09-24

申请号：US18217958

申请日：2023-07-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K1/11 ,  H05K3/24

CPC classification number: H05K1/09 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/28 ,  H05K3/3452 ,  H05K1/111 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20240292526A1

公开(公告)日：2024-08-29

申请号：US18337423

申请日：2023-06-19

Applicant: AAC Microtech (Changzhou) Co., Ltd.

Inventor： Zhigao Lu

IPC: H05K1/02

CPC classification number: H05K1/0277 ,  H05K1/0296 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/0376

Abstract: The present disclosure discloses a circuit board including a substrate layer, a line layer fixed to the substrate layer and two protective layers wrapped on both sides of the substrate layer to cover the line layer, wherein, the line layer is embedded in the substrate layer and the surface of the line layer is flush with the surface of the substrate layer. The surface of the flexible circuit board is neat and can be easily bonded to other components, and during processing, because the surface of the line layer and the substrate layer are flush, when the protective layer is laminated to the substrate layer, there is no gap between the protective layer and the substrate layer, and the protective layer and the line layer, so there are no cavity bubbles between the line layer and the protective layer, and it has a high thermal reliability level.

公开(公告)号：US20240287347A1

公开(公告)日：2024-08-29

申请号：US18567082

申请日：2022-06-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yune KUMAZAWA ,  Shunsuke KATAGIRI ,  Takuya SUZUKI

IPC: C09D151/00 ,  C08F267/10 ,  C08K5/00 ,  H05K1/03

CPC classification number: C09D151/003 ,  C08F267/10 ,  C08K5/0025 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0179

Abstract: An object of the present invention is to provide a resin composition which does not inhibit photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention contains: a compound (A) represented by the following formula (1); and a compound (B) containing one or more carboxy groups, other than the compound (A) represented by the following formula (1):






wherein each R1 independently represents a group represented by the following formula (2) or a hydrogen atom; and each R2 independently represents a hydrogen atom, or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one R1 is a group represented by the following formula (2):










wherein -* represents a bonding hand.

公开(公告)号：US20240270907A1

公开(公告)日：2024-08-15

申请号：US18626296

申请日：2024-04-03

Applicant: Arisawa MFG. Co., Ltd.

Inventor： Yoshinori Sato ,  Hiroyuki Matsuyama ,  Yoshihiko Konno

IPC: C08G73/10 ,  H05K1/03

CPC classification number: C08G73/10 ,  H05K1/0346 ,  H05K2201/0154

Abstract: A polyimide resin precursor is obtained by allowing a diamine and an acid anhydride to react with each other. The diamine includes p-phenylenediamine, a bis(aminophenoxy)benzene, and 2-(4-aminophenyl)benzoxazol-5-amine. The acid anhydride includes a biphenyl tetracarboxylic dianhydride. The content of the p-phenylenediamine is 30 to 75% by mol, the content of the bis(aminophenoxy)benzene is 10 to 30% by mol, and the content of the 2-(4-aminophenyl)benzoxazol-5-amine is 10 to 50% by mol, with respect to the total of the diamine. The content of the biphenyl tetracarboxylic dianhydride is 78% by mol or more with respect to the total of the acid anhydride.

公开(公告)号：US12016390B2

公开(公告)日：2024-06-25

申请号：US18316517

申请日：2023-05-12

Applicant: KT&G CORPORATION

Inventor： Tae Hun Kim ,  Hun Il Lim ,  Jong Sun Park

IPC: A24F40/46 ,  A24B15/167 ,  A24D1/20 ,  A24D3/17 ,  A24F15/01 ,  A24F40/40 ,  A24F40/42 ,  A24F40/44 ,  A24F40/485 ,  A24F40/50 ,  A24F40/57 ,  A24F40/60 ,  A24F40/65 ,  A24F40/90 ,  A24F40/95 ,  F21V3/00 ,  F21V5/00 ,  G02B19/00 ,  H05B3/54 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  A24F40/10 ,  A24F40/20 ,  A24F40/30 ,  A24F40/51 ,  F21Y115/10

CPC classification number: A24F40/46 ,  A24B15/167 ,  A24D1/20 ,  A24D3/17 ,  A24F15/01 ,  A24F40/40 ,  A24F40/42 ,  A24F40/44 ,  A24F40/485 ,  A24F40/50 ,  A24F40/57 ,  A24F40/60 ,  A24F40/65 ,  A24F40/90 ,  A24F40/95 ,  F21V3/00 ,  F21V5/00 ,  G02B19/0009 ,  G02B19/0061 ,  H05B3/54 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/148 ,  H05K1/181 ,  A24F40/10 ,  A24F40/20 ,  A24F40/30 ,  A24F40/51 ,  F21Y2115/10 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/10219

Abstract: Provided is a heater assembly for aerosol generating devices, the heater assembly including a thermally conductive element that has a cylindrical shape and includes an accommodation space for accommodating a cigarette, a flexible heater that surrounds at least a portion of an outer surface of the thermally conductive element, and an adhesion member that surrounds the flexible heater such that the flexible heater closely adheres to the thermally conductive element.

公开(公告)号：US20240199810A1

公开(公告)日：2024-06-20

申请号：US18551213

申请日：2022-03-01

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yuuki SATO ,  Atsushi SAKAI

IPC: C08G73/10 ,  C08J5/18 ,  H05K1/03 ,  H05K1/02

CPC classification number: C08G73/1028 ,  C08G73/10 ,  C08J5/18 ,  H05K1/0346 ,  C08J2379/08 ,  H05K1/0237 ,  H05K2201/0154

Abstract: A method for producing a polyimide resin powder, which involves reacting a tetracarboxylic acid component containing a tetracarboxylic dianhydride and a diamine component containing an aliphatic diamine in the presence of a solvent containing an alkylene glycol solvent of formula (1). In formula (1), Ra1 represents a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms, Ra2 represents a linear alkylene group having from 2 to 6 carbon atoms, and n represents an integer of 1 to 3. The reacting produces a solution containing a polyimide resin precursor. This solution is then heated at an average heating rate of 0.5 to 8° C./min in a temperature range of 70 to 130° C. to imidize the polyimide resin precursor to produce the polyimide resin powder in the solution with a solid content concentration of 15 to 25% by mass.

公开(公告)号：US20240096774A1

公开(公告)日：2024-03-21

申请号：US18262986

申请日：2021-11-11

Applicant: TOYOBO CO., LTD.

Inventor： Tetsuo OKUYAMA ,  Keisuke MATSUO

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/09563

Abstract: This method for producing a layered body includes: a step A for preparing a first layered body by layering a first resin film and a patterned metal layer; a step B for preparing a second resin film having indentations corresponding to the metal layer pattern; and a step C for mating the metal layer pattern and the indentations in the second resin film and bonding together the first layered body and second resin film.

公开(公告)号：US20240088544A1

公开(公告)日：2024-03-14

申请号：US18447613

申请日：2023-08-10

Applicant: Jabil Inc.

Inventor： Yen San Loh ,  Lai Ming Lim ,  Zambri Samsudin

IPC: H01Q1/27 ,  H01Q1/38 ,  H05K1/02

CPC classification number: H01Q1/273 ,  H01Q1/38 ,  H05K1/028 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154

Abstract: A flexible composite substrate for a wearable antenna includes a fabric sheet and a single-layer dielectric film immersed into the fabric sheet. The single-layer dielectric film includes a dielectric resin matrix and a low dielectric loss material which is mixed with the dielectric resin matrix and which serves as a wireless functional dielectric interface material.