公开(公告)号：US11961785B2

公开(公告)日：2024-04-16

申请号：US18215854

申请日：2023-06-29

Applicant: Vitesco Technologies GmbH

Inventor： Jens Reiter ,  Rico Hartmann ,  Christian Lammel

IPC: H01L23/40 ,  H01L25/11 ,  H05K1/18

CPC classification number: H01L23/4006 ,  H05K1/18 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L25/115 ,  H05K2201/09063 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10757

Abstract: A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

公开(公告)号：US20230354525A1

公开(公告)日：2023-11-02

申请号：US17624355

申请日：2021-05-06

Applicant: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.

Inventor： Weigang YAO ,  Chunhua ZHOU

IPC: H05K1/18 ,  H01L23/498 ,  H01L23/31 ,  H01L23/367 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32 ,  H01L21/48

CPC classification number: H05K1/183 ,  H01L21/4853 ,  H01L23/3107 ,  H01L23/3672 ,  H01L23/49811 ,  H01L23/49844 ,  H05K1/021 ,  H05K1/111 ,  H05K1/184 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10621

Abstract: The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.

公开(公告)号：US20230230905A1

公开(公告)日：2023-07-20

申请号：US17577879

申请日：2022-01-18

Applicant: Infineon Technologies Austria AG

Inventor： Peter Luniewski ,  Ivan Nikitin ,  Bernd Schmoelzer

IPC: H01L23/495 ,  H01L23/055 ,  H01L23/31 ,  H01R12/58 ,  H01R12/70

CPC classification number: H01L23/49568 ,  H01L23/055 ,  H01L23/3114 ,  H01R12/585 ,  H01R12/7064 ,  H05K2201/1059

Abstract: A stacked module arrangement includes: a first molded electronic module; a second molded electronic module; and an interface by which the first molded electronic module and the second molded electronic module are physically and electrically connected to one another in a stacked configuration. The first molded electronic module is a power electronic module having a maximum breakdown voltage of at least 40 V and a maximum DC current of at least 10 A.

公开(公告)号：US09661751B2

公开(公告)日：2017-05-23

申请号：US15005345

申请日：2016-01-25

Applicant: Infineon Technologies AG

Inventor： Reinhold Bayerer

IPC: H05K1/14 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/142 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/144 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/04 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/1059 ,  H01L2924/00

Abstract: A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board (PCB) arranged outside the semiconductor module, and a control unit arranged outside the semiconductor module and having a second PCB. The control unit is configured to control the controllable power semiconductor component. The controllable power semiconductor component has a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and also a control terminal for controlling the load path. The first PCB has a conductor track connected in series with the load path. The first and second PCBs are spaced apart from one another and electrically connected to one another by a pin.

公开(公告)号：US20170142857A1

公开(公告)日：2017-05-18

申请号：US15420853

申请日：2017-01-31

Applicant: Enphase Energy, Inc.

Inventor： Ryan Linderman

IPC: H05K7/14 ,  H02M7/44 ,  H05K1/18 ,  H01R13/642 ,  H05K1/11 ,  H02M7/00 ,  H05K5/00

CPC classification number: H05K7/1432 ,  H01R13/642 ,  H02M7/003 ,  H02M7/44 ,  H05K1/116 ,  H05K1/181 ,  H05K5/0065 ,  H05K2201/10272 ,  H05K2201/10356 ,  H05K2201/1059

Abstract: A system and apparatus for power conversion without a connection to ground. In one embodiment, the apparatus comprises an inverter having an enclosure formed from an insulating material, wherein the inverter receives a DC input and generates, from the DC input and without any ground connection, a first AC line voltage carrying output and a second AC line voltage carrying output.

公开(公告)号：US20160364019A1

公开(公告)日：2016-12-15

申请号：US14736274

申请日：2015-06-11

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-hsun Cheng

IPC: G06F3/0354

CPC classification number: G06F3/0362 ,  H05K3/301 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2203/167 ,  H05K2203/176

Abstract: A handheld operation device includes a casing, a circuit board, a socket, an encoder and a roller. The circuit board is disposed in the casing. The socket is disposed on the circuit board. The encoder is detachably disposed in the socket. The roller is rotatably connected to the encoder and exposed out of the casing. Since the encoder is detachably disposed in the socket, a user can detach the encoder from the socket directly without using any tools.

Abstract translation: 手持操作装置包括壳体，电路板，插座，编码器和滚子。 电路板设置在壳体中。 插座设在电路板上。 编码器可拆卸地设置在插座中。 滚轮可旋转地连接到编码器，并露出外壳。 由于编码器可拆卸地设置在插座中，因此用户可以直接从编码器脱离编码器而不使用任何工具。

公开(公告)号：US20160338191A1

公开(公告)日：2016-11-17

申请号：US15096680

申请日：2016-04-12

Applicant: FUJITSU LIMITED

Inventor： Megumi TANAKA ,  Daisuke USUI

IPC: H05K1/02 ,  H05K3/00 ,  H01R12/71 ,  H05K1/11

CPC classification number: H05K1/0251 ,  H01R12/585 ,  H01R12/7082 ,  H01R12/737 ,  H05K1/115 ,  H05K1/142 ,  H05K3/0047 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/0207 ,  H05K2203/1476

Abstract: A circuit board includes: a first surface and a second surface opposite to the first surface; a through hole extending between the first surface and the second surface; a conductor covering an inner wall surface of the through hole, a first end and a second end of the conductor being terminated inside the through hole; and a wire connected to the conductor, wherein a sum of a length from a contact portion where the conductor contacts a connector pin inserted in the through hole to the first end of the conductor, and a length from a wire connecting portion where the conductor is connected to the wire to the second end of the conductor is 0.5 mm or less.

Abstract translation: 电路板包括：与第一表面相对的第一表面和第二表面; 在所述第一表面和所述第二表面之间延伸的通孔; 覆盖所述通孔的内壁表面的导体，所述导体的第一端和第二端终止于所述通孔内; 以及连接到所述导体的导线，其中，所述导体与所述导体与所述导体中插入到所述通孔中的连接器针与所述导体的第一端接触的接触部的长度和从所述导体的导线连接部的长度 连接到导体的导线的第二端是0.5mm以下。

公开(公告)号：US20160113128A1

公开(公告)日：2016-04-21

申请号：US14515152

申请日：2014-10-15

Applicant: Continental Automotive Systems, Inc.

Inventor： Jennifer L. Matoy

IPC: H05K5/00

CPC classification number: H05K5/0069 ,  H01R12/55 ,  H01R12/58 ,  H05K3/325 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1034 ,  H05K2201/10446 ,  H05K2201/1059

Abstract: A printed circuit board assembly includes a printed circuit board (PCB) having an end. The end includes surfaces defining a plurality of electrically conductive notches therein. A plurality of electrically conductive pins is provided with each pin being received in an associated notch in a press-fitted manner so as to make electrical connection with the PCB.

Abstract translation: 印刷电路板组件包括具有端部的印刷电路板（PCB）。 端部包括在其中限定多个导电凹口的表面。 多个导电销设置有每个销以压配合方式容纳在相关联的切口中，以便与PCB电连接。

公开(公告)号：US09215809B2

公开(公告)日：2015-12-15

申请号：US14094714

申请日：2013-12-02

Applicant: SMARTRAC TECHNOLOGY GmbH

Inventor： Carsten Nieland ,  Frank Kriebel

IPC: H01L23/48 ,  H05K1/18 ,  H01L21/768 ,  H01L23/498 ,  H05K3/30 ,  H01L23/00

CPC classification number: H05K1/18 ,  G06K19/077 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13599 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81206 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/8149 ,  H01L2224/81898 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00014 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10674 ,  H05K2201/10954 ,  H05K2203/0278 ,  H05K2203/041 ,  Y10T29/49018 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05552 ,  H01L2924/014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2224/03

Abstract: Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

Abstract translation: 接触焊盘和基板之间的接触凸块可以包括可与基板的材料配合的凹部和凸起。 接触凸块和接触垫之间的不规则配合表面可以增强接触件的接合强度，例如抗剪切力和张力，特别是对于柔性系统如智能卡。

公开(公告)号：US09131632B2

公开(公告)日：2015-09-08

申请号：US13514347

申请日：2010-12-03

Applicant: Roland Moedinger

Inventor： Roland Moedinger

IPC: H01R12/00 ,  H05K3/30 ,  H01R12/58 ,  H01R12/72 ,  H01R13/6587 ,  H05K1/02

CPC classification number: H05K3/308 ,  H01R12/585 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/0245 ,  H05K1/0251 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2203/0242 ,  Y10T29/49126

Abstract: A multipole relief plug-in Connector includes contact elements, the contacting sections of which are arranged in height-offset contact area surfaces, and a multilayer circuit board includes several height-offset contact area surfaces accordingly. In combination, the multipole relief plug-in connector contacts the multilayer circuit board and the multilayer circuit board populates the multipole relief plug-in connector. The contact elements of the relief plug-in connector are designed in the contacting section as press-in contacts for pressing into press-in contact receiving portions of the multilayer circuit board. Contact element receiving portions of the multilayer circuit board are arranged in the contact area surfaces of the multilayer circuit board, the contact element receiving portions being designed as press-in contact receiving portions. A production method produces the multilayer circuit board.

Abstract translation: 多极释放插入式连接器包括接触元件，其接触部分布置在高度偏移的接触区域表面中，并且多层电路板相应地包括多个高度偏移的接触面积表面。 组合在一起，多极释放插入式连接器接触多层电路板，并且多层电路板填充多极释放插入式连接器。 泄压插入式连接器的接触元件设计在接触部分中，作为用于压入多层电路板的压入接触部分的压入触头。 多层电路板的接触元件接收部分布置在多层电路板的接触区域表面中，接触元件接收部分被设计成压入接触部分。 生产方法生产多层电路板。