公开(公告)号：US20240248463A1

公开(公告)日：2024-07-25

申请号：US18560535

申请日：2022-05-11

Applicant: JABIL INC.

Inventor： Anwar A. Mohammed ,  Harpuneet Singh ,  Nicholas Randall Tokotch ,  Gary Rojo ,  Bonnie Lowell

IPC: G05B19/418 ,  H05K3/12

CPC classification number: G05B19/41875 ,  H05K3/1233 ,  G05B2219/32194 ,  G05B2219/37217

Abstract: An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machine for placing circuit components on the solder paste, an AOI sub-system for inspecting the PCB after the circuit components are placed on the PCB, and a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB. An AI/ML analysis engine is responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven and provides downstream feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven for self-correction purposes.

公开(公告)号：US12042930B2

公开(公告)日：2024-07-23

申请号：US18117716

申请日：2023-03-06

Applicant: JABIL INC.

Inventor： Jeroen Bosboom ,  Babak Naderi ,  Richard Munro ,  Tatiana Pankova Major

IPC: H01L21/687 ,  B25J11/00 ,  B25J15/00 ,  B25J19/02

CPC classification number: B25J15/0014 ,  B25J11/0095 ,  H01L21/68707 ,  B25J19/025 ,  Y10S414/141

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

公开(公告)号：US20240188209A1

公开(公告)日：2024-06-06

申请号：US18553631

申请日：2022-03-14

Applicant: JABIL INC.

Inventor： Ian Jeffery Timmins ,  Babak Zarrin Rafie ,  John Finnell

IPC: H05K1/02 ,  H01P3/08 ,  H05K3/46

CPC classification number: H05K1/0237 ,  H01P3/08 ,  H05K3/46

Abstract: A printed circuit board (PCB), such as an antenna backplane, including a first conductor and a second conductor forming a differential pair, a first junction and a second junction connected to the first conductor and the second conductor, respectively, and a first impedance matching stub and a second impedance matching stub connected to the first conductor and the second conductor, respectively. The differential pair has a first impedance, the first junction and the second junction have a second impedance, and the first impedance matching stub and the second impedance matching stub match the second impedance to the first impedance. The PCB may have a connector that has differential pins joined to the first and second junctions, and the first impedance matching stub and the second impedance matching stub match an impedance of the junctions, pins, and a connector to the first impedance.

公开(公告)号：US12004300B2

公开(公告)日：2024-06-04

申请号：US17423822

申请日：2020-01-17

Applicant: JABIL INC.

Inventor： Mark Tudman ,  Rayce Loftin ,  Vincy Li ,  Sundar Sethuraman

IPC: H05K13/00 ,  B25J9/00 ,  B25J9/16 ,  B25J13/08 ,  H05K13/04

CPC classification number: H05K13/0015 ,  B25J9/0096 ,  B25J9/1697 ,  B25J13/08 ,  H05K13/0069 ,  H05K13/0404

Abstract: An apparatus, system and method for placing components on a circuit board by a pick and place machine. The apparatus, system and method may include a rotational table suitable to receive and hold the circuit board for the pick and place machine; at least one sensor capable of sensing an off-center fiducial on the circuit board after association with the rotational table; and at least one processor connective with at least one computing memory having therein non-transitory computing code. The steps performed by execution of the code may include receiving sensor data from the sensor indicative of at least a physical location the off-center fiducial; dividing the board into radial sections based on the sensor data; accessing at least one placement program for placement of at least first components by the pick and place machine; monitoring for a change to a second at least one of the radial sections based on rotation of the rotational table according to the sensor data; and accessing at least one second placement program for placement of second components upon a change to the physical location.

公开(公告)号：US12002116B2

公开(公告)日：2024-06-04

申请号：US16790473

申请日：2020-02-13

Applicant: JABIL INC.

Inventor： Erin Dunlop ,  Jennifer Foster ,  Jeff Miller ,  Simon Yannopoulos ,  Andrew Joyner ,  Jennifer Frey

IPC: G06Q50/04 ,  G06F16/26 ,  G06Q10/0631 ,  G06Q10/0875

CPC classification number: G06Q50/04 ,  G06F16/26 ,  G06Q10/06315 ,  G06Q10/0875

Abstract: An apparatus, system and method for an excess and obsoletion application and engine resident in a supply chain management system. Included are at least one rule set; at least one database of distinct customers, wherein the at least one database has relationally accessible in accordance with ones of the distinct customer entries in the at least one database at least the manufactured product for the distinct customer correspondent; a full parts and materials list correspondent to the manufacturing of the manufactured product; definitions from the contract for each of the manufactured products and each of the distinct customer regarding when ones of the parts and the materials become excess or obsolete; and a graphical user interface (GUI) suitable to provide access to details of at least the manufactured product, the full parts and materials list, and the definitions, such that a claim for excess or obsoletion may be made through the GUI.

公开(公告)号：US11975485B2

公开(公告)日：2024-05-07

申请号：US17391662

申请日：2021-08-02

Applicant: JABIL INC.

Inventor： Scott Klimczak ,  Luke Rodgers ,  Darin Burgess

IPC: B29C64/209 ,  B29C64/321 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/118

CPC classification number: B29C64/209 ,  B29C64/321 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/118

Abstract: The disclosure is of and includes at least an apparatus, system and method for a print head for additive manufacturing. The apparatus, system and method may include at least two proximate hobs suitable to receive and extrude therebetween a print material filament for the additive manufacturing; a motor capable of imparting a rotation to at least one of the two hobs, wherein the extrusion results from the rotation; a dynamic force adjustment capable of exerting force on one of the two hobs to urge the force-receiving hob toward the other of the two hobs; and a controller communicatively connected with the dynamic force adjustment and capable of controlling the force exertion thereof.

公开(公告)号：US20240098895A1

公开(公告)日：2024-03-21

申请号：US18355167

申请日：2023-07-19

Applicant: Jabil Inc.

Inventor： Lun Hao Tung ,  Lai Ming Lim ,  Zambri Samsudin

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/0283 ,  H05K1/181 ,  H05K2201/09236 ,  H05K2201/0939

Abstract: A bond pad connector to be disposed on a stretchable substrate and adapted to secure an electronic component thereon. The bond pad connector includes two spaced apart bond pads that are adapted to be disposed on the stretchable substrate to face each other. Each of the two bond pads is adapted to be connected to a respective conductive trace and includes: a stress relieve component that is adapted to be connected to the conductive trace, the stress relieve component being formed with a central hole; and an extension component extending from the stress relieve component and opposite to the conductive trace. The electronic component is secured onto the bond pad connector by attaching the electronic component to, for each of the bond pads, at least a part of the extension component.

公开(公告)号：US11868124B2

公开(公告)日：2024-01-09

申请号：US17311635

申请日：2019-12-06

Applicant: JABIL INC.

Inventor： Nicholas Dippel ,  Thomas Gardner

IPC: B01J2/16 ,  G05B23/02 ,  G06T19/00 ,  G06F8/65 ,  G05B19/042 ,  B29C64/307 ,  B29C64/364 ,  B29C64/153 ,  B29C64/245 ,  B29C64/295 ,  B29C64/205 ,  B29C64/25 ,  H04L9/40 ,  H04W4/38 ,  B33Y30/00

CPC classification number: G05B23/0283 ,  B01J2/16 ,  B29C64/153 ,  B29C64/205 ,  B29C64/245 ,  B29C64/25 ,  B29C64/295 ,  B29C64/307 ,  B29C64/364 ,  G05B19/0425 ,  G06F8/65 ,  G06T19/006 ,  H04L63/107 ,  H04W4/38 ,  B29K2823/06 ,  B29K2995/0094 ,  B33Y30/00

Abstract: The embodiments are and include at least an apparatus, system and method for forming print material particles for additive manufacturing (AM) printing. The apparatus, system and method include at least a melt chamber comprising a polymer melt; a vertical extruder that fluidically receives the polymer melt; an atomizer that atomizes the polymer melt from the vertical extruder and that distributes the atomized polymer melt; a fall chamber comprising a plurality of zones into which the atomized polymer melt is distributed; and a collector to receive the print material particles formed of the atomized polymer melt after falling through the plurality of zones.

公开(公告)号：US11865779B2

公开(公告)日：2024-01-09

申请号：US17393883

申请日：2021-08-04

Applicant: JABIL INC.

Inventor： Erik Gjovik ,  William J. MacNeish, III

IPC: B29C64/209 ,  B33Y30/00 ,  B33Y50/00 ,  B29C64/386 ,  B29C64/118 ,  B29C64/295 ,  B33Y50/02

CPC classification number: B29C64/209 ,  B29C64/118 ,  B29C64/295 ,  B29C64/386 ,  B33Y30/00 ,  B33Y50/00 ,  B33Y50/02

Abstract: An apparatus, system and method for providing a nozzle having refined print control and enhanced printing speed by providing, on the inside or outside or on an interstitial substrate layer, of any metallic or non-metallic nozzle of a non-conductive surface suitable to support sensors relevant to the FFF process. Heat, force, flow, strain, stress, extrusion force, and like sensors may be provided on the inside or the outside of any nozzle, or on an interstitial substrate layer on the inside or outside of any nozzle. The sensors may be provided about the center access through the nozzle, longitudinally along the center access of the nozzle, or at any of various points along the nozzle, wherein the placement or shape of such sensors may vary in accordance with the type of sensing to be performed by the subject sensor.

公开(公告)号：US20240008189A1

公开(公告)日：2024-01-04

申请号：US18468984

申请日：2023-09-18

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/34 ,  H01L23/00 ,  H05K3/36 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H05K1/11 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00

CPC classification number: H05K3/3494 ,  H01L24/80 ,  H05K3/361 ,  H05K3/363 ,  B23K20/025 ,  B23K20/233 ,  H01L21/84 ,  H05K1/117 ,  B23K20/007 ,  B23K20/24 ,  B23K35/0222 ,  B23K35/3013 ,  H05K1/111 ,  H05K3/321 ,  H05K3/4015 ,  H05K13/0015 ,  B23K2101/42

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.