公开(公告)号：US09676615B2

公开(公告)日：2017-06-13

申请号：US14764811

申请日：2015-04-23

Applicant: MICROLINK SENSTECH SHANGHAI LTD.

Inventor： Jianmin Miao

IPC: B81C1/00 ,  B81B3/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C2201/0132 ,  B81C2203/038 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003

Abstract: This invention relates to the field of silicon microphone technology, more specifically, to a method for fabricating a MEMS microphone using multi-cavity SOT wafer by Si—Si fusion bonding technology, which comprises a multi-cavity silicon backplate and a monocrystalline silicon diaphragm, both are separated with a layer of silicon dioxide to form the capacitor of the MEMS microphone. The monocrystalline silicon diaphragm has advantages such as low residual stress and good uniformity, which increase the yield and sensitivity of MEMS silicon microphone; the diaphragm comprises tiny release-assistant holes, spring structures with anchors and bumps which can quickly release the residual stress and reduce the probability of stiction between the backplate and the silicon diaphragm. This structure will further improve yield and reliability of MEMS microphone. Therefore, this invention provides simple and reliable process for fabricating MEMS microphones with high sensitivity, good uniformity, excellent reliability and high yield.

公开(公告)号：US20170158493A1

公开(公告)日：2017-06-08

申请号：US15440962

申请日：2017-02-23

Applicant: Infineon Technologies AG

Inventor： Thomas Grille ,  Ursula Hedenig ,  Michael Roesner ,  Gudrun Stranzl ,  Martin Zgaga

IPC: B81B7/00 ,  B81C1/00 ,  B01D67/00

CPC classification number: B81B7/0061 ,  B01D67/0034 ,  B81B2201/0257 ,  B81B2201/10 ,  B81C1/00904 ,  B81C2201/0132 ,  Y10T428/24273

Abstract: A hole plate and a MEMS microphone arrangement are disclosed. In an embodiment a hole plate includes a substrate with a first main surface, a second main surface, and a lateral surface and a perforation structure formed within the substrate, the perforation structure having a plurality of through-holes through the substrate, wherein the through-holes and the lateral surface are a result of a simultaneous dry etching step.

公开(公告)号：US20170153158A1

公开(公告)日：2017-06-01

申请号：US15355686

申请日：2016-11-18

Applicant: MEI-YEN LEE

Inventor： CHEN-CHIH FAN

IPC: G01L9/00 ,  B81C1/00

CPC classification number: G01L9/0073 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00238 ,  B81C2203/0792 ,  G01L9/008

Abstract: A micro feedback-chamber sensor comprises: a semiconductor base having a sensing circuit; a bonding structure layer disposed on the semiconductor base; and a sensing member chip having a low-resistance semiconductor body, a first end portion and a second end portion. The semiconductor body has free-standing Si posts, the first end portion is formed with a sensing member structure, the second end portion is connected to the semiconductor base through the bonding structure layer, and a micro feedback-chamber structure is formed between the sensing member structure, the semiconductor base and the semiconductor body. The sensing member structure is electrically connected to the sensing circuit through the free-standing Si posts. The sensing member structure and the micro feedback-chamber structure collaboratively react to an externally inputted physical signal to generate a sensing signal outputted to the sensing circuit. A method of manufacturing the micro feedback-chamber sensor is also provided.

公开(公告)号：US09656853B2

公开(公告)日：2017-05-23

申请号：US14940167

申请日：2015-11-13

Applicant: Merry Electronics(Shenzhen) Co., Ltd.

Inventor： Jen-Yi Chen ,  Chao-Sen Chang ,  Chun-Chieh Wang ,  Yung-Shiang Chang

IPC: B81B3/00

CPC classification number: B81B3/0027 ,  B81B2201/0257 ,  B81B2203/04 ,  B81B2207/015 ,  B81C1/00238

Abstract: A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.

公开(公告)号：US09654883B2

公开(公告)日：2017-05-16

申请号：US14476200

申请日：2014-09-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yoshihiko Fuji ,  Hideaki Fukuzawa ,  Shiori Kaji

IPC: G01L1/24 ,  H04R23/00 ,  B81B3/00 ,  G01L1/12 ,  G01L9/00 ,  G01L9/16 ,  H04R3/00 ,  H04R31/00

CPC classification number: A61B5/02141 ,  B81B3/0078 ,  B81B2201/0257 ,  B81B2201/06 ,  G01L1/125 ,  G01L9/0041 ,  G01L9/16 ,  G06F3/0414 ,  H04R3/00 ,  H04R19/04 ,  H04R23/00 ,  H04R23/006 ,  H04R31/006 ,  H04R2201/003 ,  H04R2410/03 ,  H04R2420/07 ,  H04R2499/11

Abstract: According to one embodiment, a strain sensing element provided on a deformable substrate includes: a first magnetic layer; a second magnetic layer; a spacer layer; and a bias layer. Magnetization of the second magnetic layer changes according to deformation of the substrate. The spacer layer is provided between the first magnetic layer and the second magnetic layer. The second magnetic layer is provided between the spacer layer and the bias layer. The bias layer is configured to apply a bias to the second magnetic layer.

公开(公告)号：US09650239B2

公开(公告)日：2017-05-16

申请号：US14934854

申请日：2015-11-06

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00309 ,  B81C2203/0118

Abstract: A method embodiment for forming a micro-electromechanical (MEMS) device includes providing a MEMS wafer, wherein a portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer, and the carrier wafer is etched to expose the first membrane for the microphone device to an ambient environment. A MEMS substrate is patterned and portions of a first sacrificial layer are removed of the MEMS wafer to form a MEMS structure. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure. A second sealed cavity and a cavity exposed to an ambient environment on opposing sides of the second membrane for the pressure sensor device are formed.

公开(公告)号：US20170129773A1

公开(公告)日：2017-05-11

申请号：US15410394

申请日：2017-01-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto CATTANI ,  Alessandro GASPARINI ,  Federico GUANZIROLI ,  Pierangelo CONFALONIERI

IPC: B81B7/00 ,  H04R3/00 ,  H04R3/12

CPC classification number: B81B7/008 ,  B81B3/00 ,  B81B7/04 ,  B81B2201/0257 ,  B81B2207/03 ,  B81B2207/053 ,  H04R3/007 ,  H04R3/12 ,  H04R19/005 ,  H04R2201/003

Abstract: A system for driving a MEMS array having a number of MEMS structures, each defining at least one row terminal and one column terminal, envisages: a number of row driving stages, each for supplying row-biasing signals to the row terminal of each MEMS structure associated to a respective row; a number of column driving stages, each for supplying column-biasing signals to the column terminal of each MEMS structure associated to a respective column; and a control unit, for supplying row-address signals to the row driving stages for generation of the row-biasing signals and for supplying column-address signals to the column driving stages for generation of the column-biasing signals. The control unit further supplies row-deactivation and/or column-deactivation signals to one or more of the row and column driving stages, for causing deactivation of one or more rows and/or columns of the MEMS array.

公开(公告)号：US20170129767A1

公开(公告)日：2017-05-11

申请号：US15411957

申请日：2017-01-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD

Inventor： Tsai-Hao HUNG ,  Shih-Chi KUO ,  Tsung-Hsien LEE ,  Tao-Cheng LIU

IPC: B81B1/00 ,  B81C1/00

CPC classification number: B81B1/004 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/012 ,  B81C1/00087 ,  B81C1/00619 ,  B81C2201/0104 ,  B81C2201/0108 ,  B81C2201/0132 ,  B81C2203/0118

Abstract: The present disclosure provides a substrate structure for a micro electro mechanical system (MEMS) device. The substrate structure includes a cap and a micro electro mechanical system (MEMS) substrate. The cap has a cavity, and the MEMS substrate is disposed on the cap. The MEMS substrate has a plurality of through holes exposing the cavity, and an aspect ratio of the through hole is greater than 30.

公开(公告)号：US09648434B1

公开(公告)日：2017-05-09

申请号：US14885928

申请日：2015-10-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： Andrew P. Miehl ,  Patrick S. Claeys ,  Karl F. Mueller

IPC: H04R9/08 ,  H04R31/00 ,  B81B7/00

CPC classification number: H04R31/006 ,  B81B7/0061 ,  B81B2201/0257 ,  H04R1/342 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003 ,  H04R2201/401 ,  H04R2499/11

Abstract: A microphone porting structure, comprises a substrate (312) having a bearing surface and a porting through-hole (344) formed therethough for aligning with a microphone port of a bottom ported microphone (334). The bearing surface provides an area against which to seal and the through-hole provides for acoustic path alignment for the audio ports of paired bottom ported microphones mounted to a printed circuit board.

公开(公告)号：US09637374B2

公开(公告)日：2017-05-02

申请号：US15290361

申请日：2016-10-11

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Colin Robert Jenkins ,  Tsjerk Hans Hoekstra ,  Euan James Boyd

IPC: H01L21/00 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H04R23/00 ,  H01L41/09

CPC classification number: H04R19/005 ,  B81B3/0021 ,  B81B3/0075 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  H01L41/09 ,  H01L41/0926 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/222 ,  H04R23/006 ,  H04R2201/003 ,  Y10T29/49005 ,  H01L2924/00014

Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.