中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

1427 records (took 0.024 seconds)

    INTEGRATED CIRCUIT WITH A PRESSURE SENSOR
    92.
    发明申请
    INTEGRATED CIRCUIT WITH A PRESSURE SENSOR 审中-公开
    集成电路与压力传感器

    公开(公告)号：US20160377497A1

    公开(公告)日：2016-12-29

    申请号：US15258988

    申请日：2016-09-07

    Applicant: ams International AG

    Inventor： Axel NACKAERTS ,  Willem Frederik Adrianus BESLING ,  Klaus REIMANN

    IPC: G01L9/00 ,  B81B7/00 ,  B81C1/00

    CPC classification number: G01L9/0073 ,  B81B7/008 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/015 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01L9/0042 ,  H01L21/28 ,  H01L29/84

    Abstract: Disclosed is an integrated circuit, comprising a semiconductor substrate carrying a plurality of circuit elements; and a pressure sensor including a cavity on said semiconductor substrate, said cavity comprising a pair of electrodes laterally separated from each other; and a flexible membrane over and spatially separated from said electrodes such that said membrane interferes with a fringe field between said electrodes, said membrane comprising at least one aperture. A method of manufacturing such an IC is also disclosed.

    Abstract translation: 公开了一种集成电路，包括承载多个电路元件的半导体衬底; 以及包括在所述半导体衬底上的空腔的压力传感器，所述空腔包括彼此横向分离的一对电极; 以及在所述电极之间和空间上分离的柔性膜，使得所述膜干扰所述电极之间的边缘场，所述膜包括至少一个孔。 还公开了制造这种IC的方法。

    MEMS Devices and Methods for Forming Same
    93.
    发明申请
    MEMS Devices and Methods for Forming Same 审中-公开
    MEMS器件及其形成方法

    公开(公告)号：US20160368762A1

    公开(公告)日：2016-12-22

    申请号：US15160884

    申请日：2016-05-20

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Chun-Wen Cheng ,  Jung-Huei Peng ,  Shang-Ying Tsai ,  Hung-Chia Tsai ,  Yi-Chuan Teng

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0006 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81B2207/098 ,  B81C1/0023 ,  B81C2203/0154 ,  B81C2203/0714 ,  H01L21/78 ,  H01L23/053 ,  H01L23/31 ,  H01L2924/16152 ,  H01L2924/16235

    Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

    Abstract translation: 一个实施例是包括具有第一压力的第一腔的第一MEMS模具和第二压力下具有第二空腔的第二MEMS模具，第二压力不同于第一压力的MEMS装置和围绕第一MEMS的模制材料 模具和第二MEMS模具，所述模制材料具有在第一和第二MEMS模具上的第一表面。 该装置还包括模制材料中的第一组电连接器，第一组电连接器中的每一个将第一和第二MEMS模具中的至少一个耦合到模制材料的第一表面，以及将第二组电连接器 连接器在模制材料的第一表面上，每个第二组电连接器被耦合到第一组电连接器中的至少一个。

    ELECTRO-MECHANICAL MINIATURIZED DEVICE FOR PRESSURE MEASUREMENTS
    97.
    发明申请
    ELECTRO-MECHANICAL MINIATURIZED DEVICE FOR PRESSURE MEASUREMENTS 审中-公开
    用于压力测量的电子机械微型装置

    公开(公告)号：US20160341622A1

    公开(公告)日：2016-11-24

    申请号：US15114621

    申请日：2015-01-29

    Applicant: NANOTECH ANALYSIS S.R.L.S.

    Inventor： Gianpiero MENSA

    IPC: G01L27/00 ,  B81B3/00 ,  G01L9/00

    CPC classification number: G01L27/002 ,  B81B3/0021 ,  B81B2201/0264 ,  C07F9/65586 ,  G01L9/0008 ,  G01L15/00 ,  G01L27/007

    Abstract: An electro-mechanical miniaturized device 1 for pressure measurements is described, the device comprising at least one first electro-mechanical miniaturized pressure sensor member 11, configured to detect a respective first pressure value P1 and to generate a first electrical signal S1 representative of the first pressure value P1, and further comprising at least one second electro-mechanical miniaturized pressure sensor member 12, configured to detect a respective second pressure value P2 and to generate a second electrical signal S2 representative of said second pressure value P2. The second sensor member 12 is arranged within a casing 13 suitable to seal it. The device 1 further comprises electronic processing means 10, operatively connected to the first 11 and the second 12 sensor members, and configured to determine a measured pressure value P based on said first S1 and second S2 electrical signals; and finally comprises interface means 15, operatively connected to the electronic processing means 10 and configured to provide in output said measured pressure value P. The first 11 and second 12 sensor members, the electronic processing means 10 and the interface means 15 are comprised in a single integrated device.

    Abstract translation: 描述了用于压力测量的机电小型化装置1，该装置包括至少一个第一机电小型化压力传感器构件11，其构造成检测相应的第一压力值P1，并产生代表第一压力值P1的第一电信号S1 压力值P1，并且还包括至少一个第二机电小型化压力传感器构件12，其构造成检测相应的第二压力值P2并产生代表所述第二压力值P2的第二电信号S2。 第二传感器构件12布置在适于密封它的壳体13内。 设备1还包括电子处理装置10，其可操作地连接到第一11和第二12个传感器构件，并且被配置为基于所述第一S1和第二S2电信号来确定测量的压力值P; 并且最后包括接口装置15，其可操作地连接到电子处理装置10并且被配置为在输出中提供所测量的压力值P.第一和第二传感器构件，电子处理装置10和接口装置15包括在 单一集成设备。

    Stress relief MEMS structure and package
    98.
    发明授权
    Stress relief MEMS structure and package 有权
    应力消除MEMS结构和封装

    公开(公告)号：US09499393B2

    公开(公告)日：2016-11-22

    申请号：US14616017

    申请日：2015-02-06

    Applicant: MKS Instruments, Inc.

    Inventor： Lei Gu ,  Stephen F. Bart

    IPC: H01L27/14 ,  B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0048 ,  B81B2201/0264 ,  B81C1/00325 ,  B81C1/00547 ,  B81C2201/013 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.

    Abstract translation: 公开了可应用于需要气密密封并且可以简单制造的MEMS传感器的应力消除结构和方法。 所述系统包括具有第一表面和第二表面的传感器，所述第二表面远离所述第一表面设置，所述第二表面还远离封装表面设置并位于所述第一表面和所述封装表面之间， 支撑构件，每个支撑构件从第二表面延伸到包装表面，支撑构件设置在第二表面的一部分上并且可操作地连接到第二表面。 支撑构件被配置为减少由包传感器相互作用产生的应力。

    Capacitance type sensor and method of manufacturing the same
    99.
    发明授权
    Capacitance type sensor and method of manufacturing the same 有权
    电容式传感器及其制造方法

    公开(公告)号：US09493338B2

    公开(公告)日：2016-11-15

    申请号：US14373547

    申请日：2012-11-14

    Applicant: OMRON Corporation

    Inventor： Yusuke Nakagawa ,  Takashi Kasai ,  Yoshitaka Tatara

    IPC: G01H11/06 ,  B81B3/00 ,  H04R19/00 ,  H04R31/00 ,  B81C1/00 ,  G01L9/12 ,  H04R19/04

    CPC classification number: B81B3/0021 ,  B81B3/0056 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  G01H11/06 ,  G01L9/12 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

    Abstract: A capacitance type sensor has a semiconductor substrate having a vertically opened penetration hole, a movable electrode film arranged above the penetration hole such that a periphery portion opposes to a top surface of the semiconductor substrate with a gap provided, and a fixed electrode film arranged above the movable electrode film with a gap with respect to the movable electrode film. A concave portion having at least a part thereof formed by an inclined surface is provided in the top surface of the semiconductor substrate in a region of the top surface of the semiconductor substrate which overlaps the periphery portion of the movable electrode film.

    Abstract translation: 电容式传感器具有具有垂直开口的通孔的半导体基板，布置在贯通孔的上方的可动电极膜，使得周边部分与设置有间隙的半导体基板的上表面相对，并且设置在上方的固定电极膜 相对于可动电极膜具有间隙的可动电极膜。 在半导体衬底的顶表面与可动电极膜的周边部分重叠的区域中，在半导体衬底的顶表面中设置至少部分由倾斜表面形成的凹部。

    INTEGRATED MEMS SYSTEM
    100.
    发明申请
    INTEGRATED MEMS SYSTEM 审中-公开
    集成MEMS系统

    公开(公告)号：US20160320426A1

    公开(公告)日：2016-11-03

    申请号：US15206935

    申请日：2016-07-11

    Applicant: Motion Engine, Inc.

    Inventor： Robert Mark Boysel ,  Louis Ross

    IPC: G01P15/18 ,  G01P15/125 ,  B81B7/00

    CPC classification number: B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00238 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  H01L2224/16145

    Abstract: The present invention provides a 3D System (“3DS”) MEMS architecture that enables the integration of MEMS devices with IC chips to form a System on Chip (SoC) or System in Package (SiP). The integrated MEMS system comprises at least one MEMS chip, including MEMS transducers, and at least one IC chip, including not only MEMS processing circuitry, but also additional/auxiliary circuitry to process auxiliary signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducers and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct auxiliary signals, such as power, RF, I/Os, to the IC chip, to be processed the additional circuitry.

    Abstract translation: 本发明提供了一种3D系统（“3DS”）MEMS架构，其能够将MEMS器件与IC芯片集成以形成片上系统（SoC）或系统级封装（SiP）。 集成MEMS系统包括至少一个MEMS芯片，包括MEMS换能器，以及至少一个IC芯片，不仅包括MEMS处理电路，还包括用于处理辅助信号的附加/辅助电路。 MEMS芯片可以包括第一和第二绝缘导电路径。 第一路通过传感器和IC芯片之间的MEMS信号进行处理; 并且第二导电路径可以延伸穿过MEMS芯片的整个厚度，以将辅助信号（例如功率，RF，I / O）传送到IC芯片，以便处理附加电路。

Patent Agency Ranking