公开(公告)号：US20050255312A1

公开(公告)日：2005-11-17

申请号：US11122138

申请日：2005-05-04

Applicant: Masahito Fujihara ,  Masahiro Kouno ,  Kazuya Edamura

Inventor： Masahito Fujihara ,  Masahiro Kouno ,  Kazuya Edamura

IPC: H05K1/09 ,  B32B9/00 ,  B32B15/00 ,  H01B5/14 ,  H01Q1/00 ,  H05K3/10 ,  H05K3/12

CPC classification number: H05K3/1283 ,  B82Y30/00 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1208 ,  H05K2201/0116 ,  H05K2201/0376 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T428/25 ,  Y10T428/30

Abstract: The present invention provides a conductive material having superior bending property and superior bending resistant property and a method for manufacturing the same. This object is achieved by a conductive material comprising a substrate and a conductive portion formed within the substrate, wherein a change ratio in the electric resistance values before and after a bending resistant property test, in which the conductive portion is bent by 180 degrees and a load of 1 kg/cm2 is imposed on the bent portion for one hour, is set within a range of ±10%.

Abstract translation: 本发明提供具有优异的弯曲性和优异的抗弯曲性的导电材料及其制造方法。 该目的通过包括基板和形成在基板内的导电部分的导电材料来实现，其中导电部分弯曲180度的抗弯曲性试验之前和之后的电阻值的变化率和 在弯曲部分施加1kg / cm 2的负荷1小时，设定在±10％的范围内。

公开(公告)号：US20040262029A1

公开(公告)日：2004-12-30

申请号：US10612705

申请日：2003-06-30

Inventor： David P. McConville ,  Mark Vininski

IPC: H05K003/02 ,  B23P019/00 ,  H05K007/06

CPC classification number: H05K3/045 ,  H05K3/107 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/0143 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/4916 ,  Y10T29/49201 ,  Y10T29/532

Abstract: A method for forming a conductive circuit on a substantially non-conductive substrate includes indenting a major surface of a substrate with a plurality of features, plating the major surface and the indentations formed with a conductive layer, and removing a portion of the conductive layer leaving at least one of the plurality of the indentations filled with conductive material separated from at least one other of the plurality of the indentations filled with conductive material separated by non-conductive material. An electrical device formed includes a sheet of insulative material having grooves therein. The sheet of insulative material has a first planar surface, and a second planar surface. A conductive material is positioned within the grooves. The conductive material within the grooves forms electrical traces in the electrical device. The conductive material within the grooves fills the groove and includes a surface coplanar with at least one of the first planar surface or the second planar surface. Other electrical devises can be formed using multiple sheets formed with electrical traces.

Abstract translation: 在基本不导电的基板上形成导电电路的方法包括用多个特征来压印基板的主表面，电镀主表面和形成有导电层的凹陷，以及去除导电层的一部分离开 多个凹陷中的至少一个填充有由多个凹陷中的至少另一个填充有由非导电材料分隔的导电材料的导电材料。 形成的电气装置包括其中具有凹槽的绝缘材料片。 绝缘材料片具有第一平坦表面和第二平坦表面。 导电材料位于槽内。 槽内的导电材料在电气装置中形成电迹线。 凹槽内的导电材料填充凹槽并且包括与第一平面表面或第二平面表面中的至少一个共面的表面。 可以使用形成有电迹线的多个片材来形成其他电气设计。

公开(公告)号：US06703565B1

公开(公告)日：2004-03-09

申请号：US09686220

申请日：2000-10-11

Applicant: Masahide Tsukamoto ,  Masanaru Hasegawa ,  Hideo Hatanaka

Inventor： Masahide Tsukamoto ,  Masanaru Hasegawa ,  Hideo Hatanaka

IPC: H05K102

CPC classification number: H05K3/462 ,  H05K3/205 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0376 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/1461 ,  Y10S156/923 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1168

Abstract: A printed wiring board includes at least one insulator sheet having through holes filled with conductive material and a conductive wiring pattern. The wiring pattern is embedded in the insulator sheet so that an upper surface of the wiring pattern and surrounding portions of the insulator sheet form a flat surface. The insulator sheet may be made from a glass-epoxy prepreg or of a polyester or polyimide sheet coated with an adhesive or glue. The wiring pattern can be transferred to the insulator sheet from a surface of a releasable supporting sheet.

Abstract translation: 印刷电路板包括至少一个具有填充有导电材料的通孔和导电布线图案的绝缘片。 布线图案嵌入在绝缘片中，使得布线图案的上表面和绝缘片的周围部分形成平坦表面。 绝缘片可由玻璃环氧树脂预浸料或涂有粘合剂或胶水的聚酯或聚酰亚胺片制成。 布线图案可以从可释放的支撑片的表面转移到绝缘片。

公开(公告)号：US20030180448A1

公开(公告)日：2003-09-25

申请号：US10105812

申请日：2002-03-21

Applicant: T.L.M. ADVANCED LASER TECHNOLOGY LTD.

Inventor： Edward Brook-Levinson ,  Michael Kogan ,  Paikin Vacheslav

IPC: B05D005/12

CPC classification number: H05K3/107 ,  H05K3/0032 ,  H05K3/105 ,  H05K3/185 ,  H05K2201/0347 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/107 ,  H05K2203/125

Abstract: The present invention provides a method for the production of a patterned structure for printed circuit boards (PCBs), or intermediate layer for multilayer PCBs, comprising: (i) providing an electrically insulating substrate; (ii) applying electromagnetic radiation to the substrate to selectively create in said substrate vias and/or grooves and thereby produce a patterned substrate wherein the vias and/or the grooves correspond to the desired pattern of plated vias and/or conductive tracks; (iii) applying a solution of one or more soluble metal salts, on one or both sides of the patterned substrate obtained in step (ii) so as to form, upon drying, a metal salt-based layer on the surface of the substrate and the inner surfaces of the vias and/or the grooves; (iv) selectively irradiate said vias and/or grooves with a laser beam; (v) removing the metal salt-based layer from the non-irradiated surfaces of one or both sides of the substrate, while leaving said layer on the inner surfaces of the laser-irradiated vias and/or grooves; and (vi) depositing a conductive material on said vias and/or grooves inner surfaces so as to obtain an electrically insulating substrate comprising a desired pattern of plated, conductive vias and/or conductive tracks.

Abstract translation: 本发明提供一种用于生产用于印刷电路板（PCB）或多层PCB的中间层的图案化结构的方法，包括：（i）提供电绝缘基板; （ii）向所述衬底施加电磁辐射以在所述衬底通孔和/或沟槽中选择性地产生，从而产生图案化衬底，其中所述通孔和/或所述凹槽对应于所需的电镀通孔和/或导电轨迹图案; （iii）在步骤（ii）中获得的图案化衬底的一侧或两侧上施加一种或多种可溶性金属盐的溶液，以在干燥后形成在衬底表面上的金属盐基层，以及 通孔和/或沟槽的内表面; （iv）用激光束选择性地照射所述通孔和/或凹槽; （v）从衬底的一侧或两侧的未照射表面上除去金属盐基层，同时将所述层留在激光照射过的通孔和/或沟槽的内表面上; 和（vi）在所述通孔和/或沟槽内表面上沉积导电材料，以便获得包含所需图案的电镀导电通路和/或导电轨迹的电绝缘衬底。

公开(公告)号：US20030113669A1

公开(公告)日：2003-06-19

申请号：US10033755

申请日：2001-12-19

Inventor： Jao-Chin Cheng ,  Chia-Pin Lin ,  Ting-Liang Fang ,  Chang-Yun Hung

IPC: G03C005/00

CPC classification number: H05K1/167 ,  H05K1/095 ,  H05K1/162 ,  H05K3/064 ,  H05K3/423 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/0376 ,  H05K2201/09672 ,  H05K2201/09881 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K2203/1453

Abstract: A method of fabricating a passive device on a printed circuit board. A first substrate and a second substrate are provided. Each of the first and the second substrates has an insulation core layer and a conductive layer on the insulation core layer. A dielectric layer is coated on the first substrate to cover a surface of the conductive layer thereon as an internal dielectric layer. The second substrate is laminated onto the internal dielectric layer, so that the conductive layers of the first and the second substrates are adjacent to the internal dielectric layer.

Abstract translation: 一种在印刷电路板上制造无源器件的方法。 提供第一基板和第二基板。 第一和第二基板中的每一个在绝缘芯层上具有绝缘芯层和导电层。 电介质层被涂覆在第一衬底上以覆盖其上的导电层的表面作为内部电介质层。 将第二衬底层压到内部电介质层上，使得第一和第二衬底的导电层与内部电介质层相邻。

公开(公告)号：US6074893A

公开(公告)日：2000-06-13

申请号：US863279

申请日：1997-05-27

Applicant: Yoshikazu Nakata ,  Syozo Otomo ,  Kazunari Tanaka ,  Koichi Uno

Inventor： Yoshikazu Nakata ,  Syozo Otomo ,  Kazunari Tanaka ,  Koichi Uno

IPC: H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/20 ,  H01L21/44 ,  H01L21/50

CPC classification number: H01L21/4867 ,  H05K3/1258 ,  H05K3/207 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0376 ,  H05K2203/0156 ,  H05K2203/0568 ,  Y10T29/4921 ,  Y10T29/49211

Abstract: A process for forming fine thick-film conductor patterns on a ceramic substrate which comprises the steps of forming grooves in a positive-working photoresist layer on the substrate by the photolithographic technology, filling the grooves with a conductive paste by squeezing with a squeegee, removing the photoresist layer by a wet process, and firing the remaining conductive paste pattern is improved. By the improvements, the conductive paste is squeezed into the grooves by the screen printing technique using a mask, and/or the solvent in the conducive paste consists essentially of one or more hydrocarbons, and/or the squeegee is made of a material having a flexural modulus in a range of 30-200 kgf/mm.sup.2. The formation of the grooves may be accomplished by laser beam machining; in this case a negative-working photoresist or any other soluble resin may be used to form the grooves therein. Also provided are a process for forming a fine thick-film conductor pattern by means of transfer of a conductive paste pattern formed on a support film to a green sheet, as well as a process for forming bumps on a ceramic circuit substrate.

Abstract translation: 一种用于在陶瓷基片上形成精细厚膜导体图案的方法，包括以下步骤：通过光刻技术在基片上的正性光致抗蚀剂层中形成凹槽，用刮板挤压导电浆料填充凹槽， 通过湿法处理光致抗蚀剂层，并且烧制剩余的导电浆料图案。 通过改进，通过使用掩模的丝网印刷技术将导电浆料挤压入凹槽中，和/或导电浆料中的溶剂基本上由一种或多种烃组成，和/或刮板由具有 弯曲模量在30-200kgf / mm2的范围内。 凹槽的形成可以通过激光束加工来实现; 在这种情况下，可以使用负性光致抗蚀剂或任何其它可溶性树脂在其中形成凹槽。 还提供了通过将形成在支撑膜上的导电浆料图案转印到生片上而形成精细厚膜导体图案的工艺，以及在陶瓷电路基板上形成凸块的工艺。

公开(公告)号：US5867898A

公开(公告)日：1999-02-09

申请号：US811077

申请日：1997-03-03

Applicant: John Matthew Lauffer ,  David John Russell ,  James Jens Hansen

Inventor： John Matthew Lauffer ,  David John Russell ,  James Jens Hansen

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K1/0206 ,  H05K1/113 ,  H05K3/44 ,  H05K3/4652 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K1/056 ,  H05K1/116 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2201/09554 ,  H05K2203/043 ,  H05K3/0023 ,  H05K3/3484 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.

Abstract translation: 金属载体具有厚度小于0.004英寸的电介质材料，并且在表面上形成至少2500伏的电压绝缘特性。 甜甜圈配置的区域至少限定一个通孔或开口，用于选择性地去除介电材料。 回流焊料用于形成电气互连，通孔提供足以符合安全要求的散热。

公开(公告)号：US5829124A

公开(公告)日：1998-11-03

申请号：US580678

申请日：1995-12-29

Applicant: John Steven Kresge ,  David Noel Light

Inventor： John Steven Kresge ,  David Noel Light

IPC: H05K3/34 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4015 ,  H05K1/113 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/1025 ,  H05K2203/0278 ,  H05K2203/1394 ,  H05K3/0094 ,  H05K3/4007 ,  H05K3/4614 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A method for attaching pads to a high density printed circuit board (PCB) having a plurality of through-holes opening on the top surface. The method includes forming a plurality of pads on a carrier sheet so that each of said pads have a copper layer proximate to said carrier sheet and a joining metal layer formed on top of said copper layer, positioning the plurality of pads on the carrier sheet so that they are aligned with the through-hole pattern on the top surface of the PCB, laminating the pads to the through-holes on the top surface using the joining metal, and separating the carrier sheet from the plurality of pads that are joined to the through-holes so that the copper layer is exposed. The pads may comprise a variety of shapes such as disk-shaped, elongated, or rectangular, and can cover one or multiple through-holes. An electrical component may be soldered to the pad. The method advantageously prevents wicking of the solderball volume into the through-hole, thereby increasing yield and part reliability. In one embodiment, the pad and through-hole may be compressed so that the top surface of the pad is even (flush) with the top surface of the external dielectric surface.

Abstract translation: 一种用于将焊盘附接到具有在顶表面上开口的多个通孔的高密度印刷电路板（PCB）的方法。 该方法包括在载体片上形成多个焊盘，使得每个焊盘具有靠近所述载体片的铜层和形成在所述铜层顶部的接合金属层，将多个焊盘定位在载体片上 它们与PCB的顶表面上的通孔图案对准，使用接合金属将焊盘层压到顶表面上的通孔，并将载体片从与多个焊盘接合的多个焊盘分离 通孔使铜层露出。 垫可以包括各种形状，例如盘形，细长或矩形，并且可以覆盖一个或多个通孔。 电气部件可以焊接到焊盘。 该方法有利地防止了焊球体积进入通孔，从而提高了产量和部件的可靠性。 在一个实施例中，垫和通孔可以被压缩，使得垫的顶表面与外部电介质表面的顶表面均匀（齐平）。

公开(公告)号：US5592365A

公开(公告)日：1997-01-07

申请号：US360018

申请日：1994-12-20

Applicant: Takayuki Sugimoto ,  Yasunobu Tagusa ,  Hisao Kawaguchi

Inventor： Takayuki Sugimoto ,  Yasunobu Tagusa ,  Hisao Kawaguchi

IPC: G02F1/13 ,  H01R4/04 ,  H05K1/02 ,  H05K1/11 ,  H05K3/24 ,  H05K3/32 ,  H05K3/36 ,  H01R23/68 ,  H01R23/72 ,  H05K1/14

CPC classification number: H05K3/361 ,  H05K3/323 ,  G02F1/13452 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2924/01079 ,  H01R12/57 ,  H01R4/04 ,  H05K1/0269 ,  H05K1/117 ,  H05K2201/0376 ,  H05K2201/09781 ,  H05K2201/099 ,  H05K2201/09918 ,  H05K2201/10136 ,  H05K3/244 ,  H05K3/321

Abstract: There is provided a display panel assembly structure capable of achieving a highly reliable connection even when fine-pitch electrode terminals are employed. A second electrode terminal is embedded in a flexible printed circuit board, and protrudes slightly from the flexible printed circuit board within a range of 0 to 2.times.10.sup.-3 mm. By embedding the second electrode terminal in the flexible printed circuit board, an apparent thickness of the second electrode terminal is reduced while keeping the rigidity of the second electrode terminal to thereby improve etching accuracy of a top surface thereof. With the reduction of the protrusion amount of the second electrode terminal, a ratio of a thickness of an anisotropic conductive film to a diameter of a conductive particle can be made to be approximately "1". With the above-mentioned arrangement, the flow of the conductive particles is suppressed to prevent the possible reduction in amount of the conductive particles between a first electrode terminal and the second electrode terminal and further prevent the conductive particles from flowing into a space portion between adjoining first and second electrode terminals. A highly reliable connection between the panel having the fine-pitch electrode terminals and a circuit board can be achieved.

Abstract translation: 提供了即使在使用细间距电极端子时也能够实现高可靠性连接的显示面板组装结构。 第二电极端子嵌入柔性印刷电路板中，并且在0至2×10-3mm的范围内从柔性印刷电路板略微突出。 通过将第二电极端子嵌入柔性印刷电路板中，在保持第二电极端子的刚性的同时降低第二电极端子的表观厚度，从而提高其顶表面的蚀刻精度。 随着第二电极端子的突出量的减小，各向异性导电膜的厚度与导电粒子的直径的比可以大致为“1”。 通过上述结构，可以抑制导电粒子的流动，防止导电粒子在第一电极端子与第二电极端子之间的量的减少，进一步防止导电性粒子流入相邻的空间部 第一和第二电极端子。 可以实现具有细间距电极端子的面板与电路板之间的高度可靠的连接。

公开(公告)号：US5544773A

公开(公告)日：1996-08-13

申请号：US252928

申请日：1994-06-02

Applicant: Youichi Haruta ,  Tomio Kambayashi ,  Hitoshi Kato ,  Hiromu Taguchi

Inventor： Youichi Haruta ,  Tomio Kambayashi ,  Hitoshi Kato ,  Hiromu Taguchi

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  C23F1/00

CPC classification number: H05K3/4655 ,  H05K3/002 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2203/0793 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/4652 ,  H05K3/4676

Abstract: Provided is a method for making a multilayer printed circuit board having blind holes which comprises heat laminating a copper foil and an inner layer panel previously provided with circuit patterns on one or both sides thereof by processing a copper-clad laminate, a resin layer soluble in an aqueous alkali solution and having a flowability upon heating being present between said copper foil and said inner layer panel, forming via holes in the surface copper foil by etching and then dissolving the resin layer under said via holes with an aqueous alkali solution and removing the resin layer, thereby to form blind holes in which the copper foil on the inner layer panel is exposed. Further provided is a copper foil used for making multilayer printed circuit boards, which is provided with a resin layer soluble in an aqueous alkali solution and having flowability upon heating on its roughened surface.

Abstract translation: 提供一种制造具有盲孔的多层印刷电路板的方法，该方法包括通过加工覆铜层压板将铜箔和预先在其一侧或两侧预先设置有电路图案的内层面板热层压，可溶于 在所述铜箔和所述内层板之间存在加热流动性的碱性水溶液，通过蚀刻在所述表面铜箔中形成通孔，然后用碱水溶液将所述树脂层溶解在所述通孔下方，并除去 从而形成露出内层面板上的铜箔的盲孔。 还提供了一种用于制造多层印刷电路板的铜箔，其具有可溶于碱性水溶液的树脂层，并且在其粗糙化表面上加热时具有流动性。