公开(公告)号：US20140102626A1

公开(公告)日：2014-04-17

申请号：US13573969

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K3/36 ,  B23K1/20 ,  B29C65/48

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/141 ,  H05K3/32 ,  H05K3/366 ,  H05K3/40 ,  H05K2201/046 ,  H05K2201/048 ,  H05K2201/052 ,  Y10T29/49126 ,  Y10T156/1002

Abstract: A method for making an electrical circuit comprises the steps of: forming a rigid printed circuit board having a plurality of electrical contacts on at least one surface; forming a multilayer flexible circuit board having a plurality of electrical components on at least one surface, and further having a bifurcated area along one edge; forming electrode pads on the inner surfaces of the bifurcated area of the flexible circuit board that are alignable respectively with the electrical contacts on the rigid circuit board when the bifurcated area is spread apart by about 180°; spreading the bifurcated area apart and aligning the electrode pads respectively with the electrical contacts; and forming an electrical connection between the electrode pads and the electrical contacts.

Abstract translation: 一种制造电路的方法包括以下步骤：在至少一个表面上形成具有多个电触点的刚性印刷电路板; 形成在至少一个表面上具有多个电气部件的多层柔性电路板，并且还沿着一个边缘具有分叉区域; 当分叉区域分开约180°时，在柔性电路板的分叉区域的内表面上分别形成电极焊盘，该电极焊盘分别与刚性电路板上的电触点对准; 将分叉区域分开并将电极焊盘与电触点对准; 以及在电极焊盘和电触点之间形成电连接。

公开(公告)号：US20130200783A1

公开(公告)日：2013-08-08

申请号：US13575036

申请日：2011-01-31

Applicant: Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

Inventor： Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

IPC: H05K1/02 ,  H05B33/10 ,  H05B33/08

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract translation: 在具有载体（40）的柔性箔（20）上提供由电 - 物理传感器（10）组成的组件。 柔性箔（20）具有第一主表面（22），第一主表面（22）设置有至少第一导电轨道（24），第一导电轨道（24）连接到电物理换能器并与所述第一主表面相对，第二主表面（23）面向载体 。 至少第一切口（25a）沿着所述至少第一导电轨道延伸穿过柔性箔片，从而限定柔性箔片的带状部分（27），其承载至少第一导电轨道的一部分。 至少第一导电轨道电连接到载体的电导体（421），并且柔性箔片与其带状部分连接到载体上。

公开(公告)号：US08456000B2

公开(公告)日：2013-06-04

申请号：US12554173

申请日：2009-09-04

Applicant: Joong-Hyun Baek

Inventor： Joong-Hyun Baek

IPC: H01L23/02 ,  H01L23/053 ,  H01L23/12 ,  H01L23/34 ,  H01L23/04 ,  H02B1/00 ,  H05K7/00 ,  H05K1/00 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14

CPC classification number: H01L23/467 ,  H01L23/5385 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/046 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10734 ,  H01L2224/0401

Abstract: A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.

Abstract translation: 提供了三维半导体模块和包括该三维半导体模块的电子系统。 半导体模块包括模块衬底，形成在模块衬底的一部分上的逻辑器件和形成在模块衬底的另一部分上的多个存储器件，其中多个存储器件垂直于逻辑器件设置，以及 其上形成有多个存储器件的模块衬底由支撑件支撑。 电子系统包括半导体模块。

公开(公告)号：US20130058090A1

公开(公告)日：2013-03-07

申请号：US13409064

申请日：2012-02-29

Applicant: Timothy Drew Ferrie ,  Aaron Meyer ,  Bruce Quaal

Inventor： Timothy Drew Ferrie ,  Aaron Meyer ,  Bruce Quaal

IPC: F21V21/00 ,  F21V29/00

CPC classification number: F21V3/04 ,  F21K9/00 ,  F21S4/10 ,  F21S4/20 ,  F21V17/007 ,  F21V21/0808 ,  F21Y2107/70 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/009 ,  G09F13/0409 ,  H05K1/0278 ,  H05K3/0061 ,  H05K2201/046 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2203/1327

Abstract: A lighting system comprising a light box housing, a plurality of lighting units including a housing, a plurality of light emitting elements mounted on a PCB within the housing. The light emitting elements arranged on an angled surface such that the light emitting elements emit light in a sideways direction from the lighting units. The lighting units can also be interconnected in a daisy-chain configuration, such that the lighting units form a row of lighting units. The row of lighting units adapted to be mounted within the light box housing, wherein the light box housing comprises one or more rows of lighting units.

Abstract translation: 一种照明系统，包括灯箱壳体，多个照明单元，包括壳体，安装在所述壳体内的PCB上的多个发光元件。 发光元件布置在倾斜的表面上，使得发光元件沿着来自照明单元的侧向方向发光。 照明单元还可以以菊花链配置互连，使得照明单元形成一排照明单元。 适于安装在灯箱壳体内的一排照明单元，其中灯箱外壳包括一排或多排照明单元。

公开(公告)号：US20110209368A1

公开(公告)日：2011-09-01

申请号：US13010703

申请日：2011-01-20

Applicant: Bruce Quaal ,  Drew Farrie ,  Aaron Meyer

Inventor： Bruce Quaal ,  Drew Farrie ,  Aaron Meyer

IPC: G09F13/04 ,  F21S4/00 ,  G09F13/00 ,  H05K13/04 ,  H05K3/42

CPC classification number: F21S4/28 ,  F21S4/20 ,  F21V15/01 ,  F21V19/001 ,  F21V19/003 ,  F21V21/0808 ,  F21V23/005 ,  F21V29/508 ,  F21V29/71 ,  F21V31/04 ,  F21Y2107/70 ,  F21Y2115/10 ,  G09F13/0404 ,  G09F13/22 ,  G09F2013/222 ,  H05K1/0278 ,  H05K1/05 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/09081 ,  H05K2201/10106 ,  Y10T29/49165 ,  Y10T29/49993

Abstract: The present embodiments provide channel letter lighting devices and/or systems. A lighting system, comprising a plurality of electrically connected lighting units, comprising conductors to provide an electrical signal to each of the units. Each of the lighting units comprise a housing, a printed circuit board (PCB) mounted within the housing and having a plurality of tabs and a plurality light emitting elements on the tabs. The tabs are angled in relation of the remainder of the PCB or housing. The electrical signal applied to the light emitting elements causes them to emit light substantially away from said housing. The lighting system further comprises a sealant within the housing filling cavities around the light emitting elements and the cavity around said PCB and a mounting mechanism for mounting the unit to a structure.

Abstract translation: 本实施例提供了通道字母照明设备和/或系统。 一种照明系统，包括多个电连接的照明单元，包括用于向每个单元提供电信号的导体。 每个照明单元包括壳体，安装在壳体内的印刷电路板（PCB），并且在突片上具有多个突片和多个发光元件。 突片与PCB或外壳的其余部分有关。 施加到发光元件的电信号使得它们基本上远离所述壳体发光。 照明系统还包括在壳体内的密封剂，围绕发光元件和围绕所述PCB的空腔填充空腔以及用于将该单元安装到结构的安装机构。

公开(公告)号：US07919854B2

公开(公告)日：2011-04-05

申请号：US12192496

申请日：2008-08-15

Applicant: Thilo Stolze

Inventor： Thilo Stolze

IPC: H01L23/34

CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/5387 ,  H01L24/48 ,  H01L25/07 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/141 ,  H05K1/148 ,  H05K3/284 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/10484 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.

Abstract translation: 具有两个冷却表面和方法的半导体模块。 一个实施例包括具有第一冷却表面的第一载体和具有第二冷却表面的第二载体。 第一冷却表面布置在第一平面中，第二冷却表面相对于第一平面以不同于0°的角度布置在第二平面中。

公开(公告)号：US20100330338A1

公开(公告)日：2010-12-30

申请号：US12822609

申请日：2010-06-24

Applicant: Mary C. Boyce ,  Simona Socrate ,  Christopher M. Boyce ,  Brian P. Greviskes

Inventor： Mary C. Boyce ,  Simona Socrate ,  Christopher M. Boyce ,  Brian P. Greviskes

IPC: B32B3/00 ,  B29C71/00

CPC classification number: B29C59/02 ,  B29C59/16 ,  B29C2791/009 ,  B29C2793/00 ,  B32B3/266 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/046 ,  H05K2201/09063 ,  Y10T428/24314 ,  Y10T428/24479 ,  H01L2924/00

Abstract: A flexible and stretchable patterned substrate is provided having a strain-permitting material comprising a patterned conformation that allows the flexible patterned substrate to experience local strain or local strain domains lower than the macroscopic strain of the flexible and stretchable patterned substrate.

Abstract translation: 提供了一种柔性和可拉伸的图案化基底，其具有包含图案化构象的应变允许材料，其允许柔性图案化基底经历比柔性和可拉伸图案化基底的宏观应变低的局部应变或局部应变结构域。

公开(公告)号：US20080100732A1

公开(公告)日：2008-05-01

申请号：US11798370

申请日：2007-05-14

Applicant: Masanori Minamio ,  Yutaka Harada ,  Yoshiki Takayama ,  Toshiyuki Fukuda

Inventor： Masanori Minamio ,  Yutaka Harada ,  Yoshiki Takayama ,  Toshiyuki Fukuda

IPC: H04N5/335 ,  G06F19/00

CPC classification number: H04N5/2251 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K1/189 ,  H05K2201/046 ,  H05K2201/10121 ,  H05K2201/10689 ,  H01L2924/00

Abstract: One end of a flexible substrate is connected to a solid-state image sensing device and the other end constitutes an external connection part in which external lead-out electrodes are provided. A plurality of electronic components are mounted on a mounting part of the flexible substrate. The flexible substrate is bent at a first bent part thereof to make an acute angle with the solid-state image sensing device and also bent at a second bent part thereof to make an acute angle with the external connection part. The two acute angles are alternate angles and the solid-state image sensing device has a cross section of the letter Z.

Abstract translation: 柔性基板的一端连接到固态图像感测装置，另一端构成外部引出电极的外部连接部。 多个电子部件安装在柔性基板的安装部上。 柔性基板在其第一弯曲部分处弯曲以与固态图像感测装置成锐角并且在其第二弯曲部分处弯曲以与外部连接部分成锐角。 两个锐角是交替的角度，固态图像感测装置具有字母Z的横截面。

公开(公告)号：US5204806A

公开(公告)日：1993-04-20

申请号：US767366

申请日：1991-09-30

Applicant: Takahide Sasaki ,  Jun Terashima ,  Haruhiko Yamanouchi

Inventor： Takahide Sasaki ,  Jun Terashima ,  Haruhiko Yamanouchi

IPC: G03B17/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/189 ,  G03B17/02 ,  G03B2217/002 ,  H05K1/0393 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/046 ,  H05K2201/10689

Abstract: A flexible printed circuit board of band shape installed within a tubular or hollow polygonal prismatic casing along the circumferential direction of the casing is composed of at least two flat areas formed in the flexible printed circuit board, and circuit elements mounted on the flat areas.

公开(公告)号：US4928206A

公开(公告)日：1990-05-22

申请号：US274571

申请日：1988-11-23

Applicant: Warren W. Porter ,  Donald K. Lauffer

Inventor： Warren W. Porter ,  Donald K. Lauffer

IPC: H05K1/18 ,  H05K3/00 ,  H05K7/20

CPC classification number: H05K7/20372 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/046 ,  H05K2201/064 ,  H05K2201/10689 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/4691

Abstract: A printed circuit board assembly is disclosed which includes a number of rigid printed circuit boards connected by a number of flexible printed circuit panels. Integrated circuits and similar components are mounted on the rigid printed circuit boards. The components are interconnected by printed circuit conductors of the rigid printed circuit boards and the flexible printed circuit panels. The resulting board assembly can provide a manifold increase in the usable component area over a single flat, rigid printed circuit board when it is folded and installed into a standard cylindrical, coolant filled container.

Abstract translation: 公开了一种印刷电路板组件，其包括通过多个柔性印刷电路板连接的多个刚性印刷电路板。 集成电路和类似部件安装在刚性印刷电路板上。 组件通过刚性印刷电路板和柔性印刷电路板的印刷电路导体相互连接。 当其被折叠并安装到标准的圆柱形冷却剂填充的容器中时，所得到的板组件可以在单个扁平刚性印刷电路板上提供可用部件面积的歧管增加。