公开(公告)号：US20080044175A1

公开(公告)日：2008-02-21

申请号：US11839755

申请日：2007-08-16

Applicant: Makoto Ilkawa

Inventor： Makoto Ilkawa

IPC: G03B17/00

CPC classification number: G02B7/08 ,  H05K1/0271 ,  H05K1/028 ,  H05K3/0058 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/09018

Abstract: A lens barrel includes an electronic component provided in the lens barrel so that a position of the electronic component in the lens barrel is adjustable; a flexible printed wiring board connected to the electronic component and installed to extend along a surface of an internal component of the lens barrel in a direction to adjust the position of the electronic component; and a low-repulsion layer interposed between the surface of the internal component and a surface of the flexible printed wiring board which faces the surface of the internal component.

Abstract translation: 透镜镜筒包括设置在透镜镜筒中的电子部件，使得透镜镜筒中的电子部件的位置是可调节的; 柔性印刷布线板，其连接到所述电子部件并且沿着调整所述电子部件的位置的方向沿着所述镜筒的内部部件的表面延伸; 以及插入在内部部件的表面和面向内部部件的表面的柔性印刷线路板的表面之间的低排斥层。

公开(公告)号：US20080041617A1

公开(公告)日：2008-02-21

申请号：US11536691

申请日：2006-09-29

Applicant: Chun-Jung Chen ,  Jian-Chiun Liou ,  Yu-Hung Chuang

Inventor： Chun-Jung Chen ,  Jian-Chiun Liou ,  Yu-Hung Chuang

IPC: H05K1/16

CPC classification number: H05K1/189 ,  H05K2201/09018

Abstract: A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.

Abstract translation: 提供了一种包括柔性电路板和至少一个电子部件的柔性电子组件。 柔性电路板包括至少一个电介质膜层和设置在电介质膜层上的至少一个图案化导电层。 电子部件设置在柔性电路板上并电连接到柔性电路板。 柔性电子组件的柔性角度大于5度。

公开(公告)号：US07262489B2

公开(公告)日：2007-08-28

申请号：US10983934

申请日：2004-11-08

Applicant: Kazuno Shoji

Inventor： Kazuno Shoji

IPC: H01L21/302

CPC classification number: H01L21/302 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2203/1105 ,  H05K2203/1327 ,  H05K2203/302

Abstract: A three-dimensionally formed circuit sheet comprises a resin film and a circuit pattern formed of an electrically conductive paste on the resin film. The electrically conductive paste contains, as a binder, a resin that is three-dimensionally formable. The resin film and the circuit pattern are formed in a three-dimensional shape. A method for manufacturing the three-dimensionally formed circuit sheet is also provided. The method comprises forming a circuit pattern on a resin film using an electrically conductive paste by means of printing, wherein the electrically conductive paste contains a resin that is three-dimensionally formable, and press molding the resin film including the circuit pattern into a three-dimensional shape. Additionally, a three-dimensionally formed circuit component comprising a three-dimensionally formed circuit sheet and a base member and a method for manufacturing the same are disclosed.

Abstract translation: 三维形成的电路板包括树脂膜和由树脂膜上的导电糊形成的电路图案。 作为粘合剂的导电性糊剂含有三维可成形的树脂。 树脂膜和电路图案形成为三维形状。 还提供了一种用于制造三维形成的电路板的方法。 该方法包括使用导电浆料通过印刷在树脂膜上形成电路图案，其中导电浆料含有可立体成型的树脂，并且将包含电路图案的树脂膜压制成三维形状， 尺寸形状。 此外，公开了一种三维形成的电路元件及其制造方法，该电路元件包括三维形成的电路片和基底元件。

公开(公告)号：US06974515B2

公开(公告)日：2005-12-13

申请号：US10352709

申请日：2003-01-27

Applicant: Anja Neubert ,  Holger Hoefer

Inventor： Anja Neubert ,  Holger Hoefer

IPC: G01L1/22 ,  B32B9/00 ,  B32B18/00 ,  C04B35/00 ,  C04B35/622 ,  G01L9/04 ,  H05K1/03 ,  H05K3/00 ,  B32B31/26

CPC classification number: B32B18/00 ,  B32B2315/02 ,  C04B2235/9607 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/582 ,  C04B2237/76 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/09018

Abstract: A ceramic substrate having a defined curvature and a method of its manufacture are described. For this purpose at least two ceramic layers having different defined temperature coefficients of expansion are positioned on top of one another and are permanently bonded together. A curved ceramic substrate may be advantageously utilized in micro-hybrid technology, in multilayer ceramic technology, or in hybrid technology, e.g., as a membrane element of a piezoresistive pressure sensor element.

Abstract translation: 描述了具有限定曲率的陶瓷衬底及其制造方法。 为此，具有不同的限定温度膨胀系数的至少两个陶瓷层位于彼此之上并永久地结合在一起。 弯曲的陶瓷衬底可以有利地用于微混合技术，多层陶瓷技术或混合技术中，例如作为压阻式压力传感器元件的膜元件。

公开(公告)号：US20050128894A1

公开(公告)日：2005-06-16

申请号：US10791601

申请日：2004-03-02

Applicant: Sung-Hong Won ,  Dong-Woohn Kim ,  Chang-Hwan Choi

Inventor： Sung-Hong Won ,  Dong-Woohn Kim ,  Chang-Hwan Choi

IPC: G11B7/08 ,  G11B7/00 ,  G11B7/085 ,  G11B7/09 ,  G11B7/22 ,  H05K1/02 ,  H05K3/34

CPC classification number: G11B7/0932 ,  G11B7/0933 ,  G11B7/0946 ,  G11B7/22 ,  H05K1/0271 ,  H05K3/3447 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2201/10409 ,  H05K2201/10424 ,  H05K2201/10598 ,  H05K2201/10977 ,  H05K2201/2045

Abstract: The present invention relates, in general, to an optical pickup actuator and, more particularly, to an optical pickup actuator, in which a depression (120) is formed in a center portion of a rear surface of a wire holder (100) to be depressed, and the position of a bobbin (20) is adjusted by straining wires (30) while a center portion of a printed circuit board (200), closely attached to the rear surface of the wire holder, is pressurized using a control screw (300) to allow the printed circuit board to be arcuately deformed.

Abstract translation: 本发明一般涉及一种光学拾取器致动器，更具体地，涉及一种光学拾取器致动器，其中在电线保持器（100）的后表面的中心部分形成有凹部（120） 并且通过应变丝（30）调节线轴（20）的位置，同时使用控制螺钉将紧贴在线夹的后表面上的印刷电路板（200）的中心部分加压 300）以允许印刷电路板弧形变形。

公开(公告)号：US20040206968A1

公开(公告)日：2004-10-21

申请号：US10806284

申请日：2004-03-23

Applicant: Moritex Corporation

Inventor： Makoto Toyota ,  Shin Toyoda ,  Hitoshi Yoshida

IPC: H01L021/00 ,  H01L033/00

CPC classification number: H05K1/189 ,  F21K9/00 ,  F21Y2107/10 ,  G01N21/8806 ,  G01N2201/062 ,  H05K3/3447 ,  H05K2201/09018 ,  H05K2201/09263 ,  H05K2201/10106 ,  Y10S385/901

Abstract: An annular oblique light illumination apparatus manufactured by using a flexible wiring substrate in which a plurality of arcuate zonal wiring patterns each in the form of a developed frustconical shape as a light emitting device arranging surface when cut along the pattern are serpiginously formed continuously to a base film of a predetermined shape, by setting and soldering light emitting devices to the arcuate zonal wiring patterns, cutting out the arcuate zonal wiring patterns to form light emitting device arrays and fixing the same to the arranging surface, whereby the wiring substrate can be supported reliably without using any special jig conforming the arcuate shape of the wiring patterns for mounting the light emitting devices, thereby improving the soldering operation efficiency, saving the troubles of exchange and handling of jigs and further, avoiding slackening or distortion of the wiring substrate even in a case of applying soldering by a flow soldering apparatus.

Abstract translation: 通过使用柔性布线基板制造的环形斜光照明装置，其中沿着图案切割时，以展开的截头圆锥形状的多个弧形区带布线图案作为发光装置布置表面被连续地形成为基部 通过将发光装置设置并焊接到弧形区带布线图案，切割出弧形的区域布线图案以形成发光装置阵列并将其固定到布置表面，由此可以可靠地支撑布线基板 不使用符合用于安装发光器件的布线图形的弓形形状的任何特殊的夹具，从而提高焊接操作效率，从而节省夹具的更换和处理的麻烦，并且即使在布线基板中也避免了布线基板的松弛或变形 通过流动焊接装置进行焊接的情况。

公开(公告)号：US20040021212A1

公开(公告)日：2004-02-05

申请号：US10614525

申请日：2003-07-08

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Tsuneo Hamaguchi ,  Kenji Kagata

IPC: H01L023/02

CPC classification number: H05K3/3436 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14609 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K2201/09018 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.

Abstract translation: 半导体器件包括形成在布线基板的一个表面上以具有规定高度的突出电极，厚度小于突出电极的高度的半导体芯片，以及厚度大于半导体的厚度的电子部件 并且安装在布线基板的另一个表面上，使得布线基板在一个表面处翘曲成凹陷。 因此，确保半导体芯片和安装板之间的刚性以及间隔。 此外，具有安装在布线基板的两个表面上的逻辑LSI的半导体器件安装在具有插入其中具有规定高度的突出电极的外壳中的安装板上，其中布线基板翘曲以在具有 投影电极。

公开(公告)号：US06607414B2

公开(公告)日：2003-08-19

申请号：US10055273

申请日：2002-01-23

Applicant: Timothy J. Cornish ,  Harry K. Charles ,  Paul D. Wienhold

Inventor： Timothy J. Cornish ,  Harry K. Charles ,  Paul D. Wienhold

IPC: H01J102

CPC classification number: H01J49/405 ,  G21K1/06 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2203/1327

Abstract: A novel technique utilizing the precision of printed circuit board design and the physical versatility of thin, flexible substrates is disclosed to produce a new type of ion reflector. A precisely defined series of thin conductive strips (traces) are etched onto a flat, flexible circuit board substrate. Preferably, the thin conductive strips are further apart at one end of the substrate and get increasingly closer towards the other end of the substrate. The flexible substrate is then rolled into a tube to form the reflector body, with the conductive strips forming the rings of the ion reflector. The spacing between the traces, and hence the ring spacing, can be readily varied by adjusting the conductor pattern on the substrate sheet during the etching process. By adjusting the spacing between the rings, the characteristics of the field created by the reflectron can be easily customized to the needs of the user.

Abstract translation: 公开了一种利用印刷电路板设计的精确性和薄的柔性基板的物理通用性的新技术，以产生新型的离子反射器。 将精确定义的一系列薄导电条（迹线）蚀刻到平坦，柔性的电路板基板上。 优选地，薄导电条在衬底的一端处进一步分开，并且越来越靠近衬底的另一端。 然后将柔性基材卷成管以形成反射体，导电条形成离子反射体的环。 通过在蚀刻工艺期间调节衬底片上的导体图案，可以容易地改变迹线之间的间隔以及因此的环间隔。 通过调整环之间的间距，可以根据用户的需要轻松定制由反射镜产生的场的特性。

公开(公告)号：US06518936B1

公开(公告)日：2003-02-11

申请号：US08464426

申请日：1995-06-05

Applicant: Dennis L. Dull

Inventor： Dennis L. Dull

IPC: H01Q142

CPC classification number: H05K3/0082 ,  C23F1/18 ,  G03F7/00 ,  G03F7/24 ,  H01Q1/425 ,  H01Q15/0013 ,  H05K1/0284 ,  H05K3/0002 ,  H05K3/0032 ,  H05K3/064 ,  H05K3/067 ,  H05K2201/09018 ,  H05K2203/056

Abstract: Multicurved copper films having fine-line elements suitable for radome applications can be improved by cutting the elements with reproducible precision to close tolerance (typically line widths of 3-10±0.25 mil) using an etchant comprising a concentrated saline solution of CuCl2.

Abstract translation: 通过使用包含CuCl 2的浓盐水溶液的蚀刻剂，可以通过以可再现的精度切割元件以紧密公差（通常线宽为3-10±0.25密耳）来改善具有适用于天线罩应用的细线元件的多铜铜膜。

公开(公告)号：US5981036A

公开(公告)日：1999-11-09

申请号：US835049

申请日：1997-03-27

Applicant: Jurgen Schulz-Harder ,  Peter H. Maier

Inventor： Jurgen Schulz-Harder ,  Peter H. Maier

IPC: H01L23/13 ,  H01L23/367 ,  H01L23/373 ,  H05K1/03 ,  H05K3/00 ,  B32B3/00

CPC classification number: H05K3/0061 ,  C04B37/021 ,  C04B37/026 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3735 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/70 ,  C04B2237/706 ,  H01L2224/16 ,  H01L2924/0102 ,  H01L2924/01322 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2201/09018 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/31678

Abstract: An arched metal-ceramic substrate with one ceramic layer and with a metal coating provided on the top and bottom of the ceramic layer which is curved around at least one axis parallel to the plane of the substrate such that it forms a convexly curved surface on the bottom. The thickness of the metal coatings on the top and bottom of the arched ceramic layer is the same.

Abstract translation: 具有一陶瓷层和金属涂层的拱形金属陶瓷基片设置在陶瓷层的顶部和底部上，该陶瓷层围绕平行于基底的平面的至少一个轴线弯曲，使得其在该基底上形成凸曲面 底部。 拱形陶瓷层顶部和底部的金属涂层的厚度相同。