公开(公告)号：US20150201492A1

公开(公告)日：2015-07-16

申请号：US14335710

申请日：2014-07-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Yang-Wan Kim ,  Won-Kyu Kwak

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0277 ,  H05K1/0283 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/09027 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: Provided is a display apparatus. The display apparatus includes a display panel including a substrate including a display region in which a display unit is located, a non-display region that extends outward from the display region and in which a plurality of pads are located, and a sealing portion that covers the display unit. The display apparatus also includes a circuit board including a flexible film and a plurality of terminals on the flexible film that are electrically coupled to the plurality of pads. The plurality of pads are spaced from each other along a first direction of the display panel and pad central points of the plurality of pads are located at at least two different locations along the first direction.

Abstract translation: 提供了一种显示装置。 显示装置包括：显示面板，包括：显示单元所在的显示区域的基板;从显示区域向外延伸并且多个焊盘位于的非显示区域;以及覆盖 显示单元。 显示装置还包括电路板，其包括柔性膜和柔性膜上的多个端子，其电耦合到多个焊盘。 多个焊盘沿着显示面板的第一方向彼此间隔开，并且多个焊盘的焊盘中心点位于沿着第一方向的至少两个不同位置。

公开(公告)号：US09024427B2

公开(公告)日：2015-05-05

申请号：US14178244

申请日：2014-02-11

Applicant: Huan Wang ,  Aipeng Shu ,  Shu An Yao

Inventor： Huan Wang ,  Aipeng Shu ,  Shu An Yao

IPC: H01L23/02 ,  H01L23/04 ,  H01L23/34 ,  H01L23/48 ,  H01L25/065 ,  H01L23/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L25/0652 ,  H01L24/80 ,  H01L25/50 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/041 ,  H05K2201/09027 ,  Y02P70/611 ,  H01L2924/00

Abstract: A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes twisted around the columnar part. Semiconductor integrated circuits (IC dies) are attached on one or both of the supporting surfaces of the stairs. The columnar part, the stairs and the IC dies can be encapsulated with a mold compound.

Abstract translation: 三维包装包括具有包括侧壁的柱状部分的基板和沿着柱状部分的侧壁以沿着柱状部分扭转的多个螺旋形的形式布置的台阶或台阶。 半导体集成电路（IC管芯）安装在楼梯的一个或两个支撑面上。 柱状部分，楼梯和IC模具可以用模具化合物包封。

公开(公告)号：US20150070878A1

公开(公告)日：2015-03-12

申请号：US14485406

申请日：2014-09-12

Applicant: 1 ENERGY SOLUTIONS, INC.

Inventor： Jing Jing Yu

IPC: H05B37/02 ,  F21V23/06 ,  F21V23/00 ,  F21V33/00 ,  F21V23/02 ,  F21S4/00 ,  A47G33/06

CPC classification number: F21V23/004 ,  A47G33/06 ,  F21S4/10 ,  F21V23/006 ,  F21V23/02 ,  F21V23/06 ,  F21W2121/04 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05B33/0806 ,  H05K1/18 ,  H05K2201/09027 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: Disclosed are various embodiments of an artificial tree that is lit by LEDs. Individual trunk modules are provided on trunk sections that provide individual control of LED strings disposed on branches on each of the trunk sections. Remote control devices and smart devices connected to the Internet can control the trunk modules. Spring-loaded flat connectors between the trunk sections, and also between the branches in the trunks, provide a solid electrical connection, which has a low susceptibility to failure. Plastic injection molded branches having injected molded sockets are provided for connecting LEDs that can be plugged directly into sockets on the trunk sections. The LEDs can be driven with an AC or DC electrical power supply.

Abstract translation: 公开了由LED照亮的人造树的各种实施例。 在主干部分上提供单独的中继线模块，其提供设置在每个干线部分上的分支上的LED串的单独控制。 连接到互联网的遥控设备和智能设备可以控制中继模块。 主干部分之间以及中继线之间的分支之间的弹簧式扁平连接器提供了一种牢固的电连接，其具有低的故障敏感性。 提供具有注射模制插座的塑料注塑分支，用于连接可直接插入到主干部分上的插座中的LED。 LED可以用AC或DC电源驱动。

公开(公告)号：US20150049441A1

公开(公告)日：2015-02-19

申请号：US14451757

申请日：2014-08-05

Applicant: Suming Hu ,  Neil McLellan ,  Andrew K.W. Leung ,  Jianguo Li

Inventor： Suming Hu ,  Neil McLellan ,  Andrew K.W. Leung ,  Jianguo Li

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/10 ,  H01L23/00

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/0052 ,  H05K3/3442 ,  H05K2201/09027 ,  H05K2201/09154 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/0228 ,  H05K2203/0746 ,  H05K2203/107 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes.

Abstract translation: 提供了一种制造方法，其包括从多个电路板的衬底中分离电路板，其中电路板被成形为具有四个拐角中空部。 角隅可以是各种形状。

公开(公告)号：US20150027759A1

公开(公告)日：2015-01-29

申请号：US14387145

申请日：2013-03-08

Applicant: Sony Corporation

Inventor： Kazuya Hayashibe ,  Hiroshi Tazawa ,  Shunichi Kajiya

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/02 ,  H05K1/03

CPC classification number: H05K1/02 ,  G06F3/041 ,  G09F9/00 ,  H05B33/14 ,  H05K1/0306 ,  H05K3/0014 ,  H05K3/02 ,  H05K3/06 ,  H05K3/389 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/09027 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/0537 ,  H05K2203/10

Abstract: A conductive element includes: a substrate having a first wavy surface, a second wavy surface, and a third wavy surface; a first layer provided on the first wavy surface; and a second layer formed on the second wavy surface. The first and second layers form a conductive pattern portion. The first, second, and third wavy surfaces satisfy the following relationship: 0≦(Am1/λm1)

Abstract translation: 导电元件包括​​：具有第一波状表面，第二波浪表面和第三波浪表面的基板; 设置在第一波浪面上的第一层; 以及形成在第二波浪表面上的第二层。 第一和第二层形成导电图案部分。 第一，第二和第三波形表面满足以下关系：0＆nlE;（Am1 /λm1）<（Am2 /λm2）<（Am3 /λm3）＆nlE; 1.8（其中Am1是第一波形表面的振动的平均宽度 Am2是第二波形表面的平均振动幅度，Am3是第三波形表面的平均振动幅度，λm1是第一波状表面的平均波长，λm2是第二波状表面的平均波长， λm3是第三波形表面的平均波长）

公开(公告)号：US20150016067A1

公开(公告)日：2015-01-15

申请号：US14325752

申请日：2014-07-08

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chang Sup SONG ,  Jong Pil Park

IPC: H05K9/00 ,  H05K3/36 ,  H05K3/30 ,  H05K7/06

CPC classification number: H05K1/144 ,  H01L2224/16227 ,  H01L2924/15153 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/0723 ,  H05K2201/09027 ,  H05K2201/09618 ,  H05K2201/2018 ,  Y10T29/49126

Abstract: A high frequency (HF) module and a manufacturing method thereof. The HF module has a single airtight box-like structure formed by a first PCB, a second PCB, and a third PCB. On a lower surface of the third PCB facing the first PCB, a second electronic component is mounted at a position corresponding to a first electronic component relatively low in height, among first electronic components mounted on the first PCB. Upper and lower ends of a plurality of vias formed within the second PCB are connected to a copper layer existing within a body of the third PCB and a copper layer existing within a body of the first PCB to constitute a single electromagnetic wave shielding unit overall.

Abstract translation: 高频（HF）模块及其制造方法。 HF模块具有由第一PCB，第二PCB和第三PCB形成的单个气密的盒状结构。 在面向第一PCB的第三PCB的下表面上，在安装在第一PCB上的第一电子部件中，第二电子部件被安装在对应于相对低的高度的第一电子部件的位置处。 形成在第二PCB内的多个通孔的上端和下端连接到存在于第三PCB的主体内的铜层和存在于第一PCB的主体内的铜层，以总体构成单个电磁波屏蔽单元。

公开(公告)号：US20140332620A1

公开(公告)日：2014-11-13

申请号：US13892358

申请日：2013-05-13

Applicant: WINEHAWK INC.

Inventor： ERNEST EARON

IPC: B64C39/02 ,  B64C1/00 ,  B64D47/08

CPC classification number: B64C39/024 ,  B64C2201/021 ,  B64C2201/042 ,  B64C2201/127 ,  B64D47/08 ,  B64D2221/00 ,  H05K1/0268 ,  H05K1/14 ,  H05K2201/047 ,  H05K2201/09027 ,  Y10T29/49622

Abstract: An unmanned aerial vehicle, comprising: a fuselage having a first side board and a second side board spaced apart and connected by at least one transverse board; the first side board, the second side board, and the at least one transverse board being printed circuit boards; at least one of the first side board, the second side board, and the at least one transverse board having formed and mounted thereon conductive traces and at least one component, respectively, for controlling and monitoring the unmanned aerial vehicle; first and second wings mounted to the fuselage; and, a tail mounted to the fuselage.

Abstract translation: 一种无人驾驶飞行器，包括：机身，其具有间隔开并通过至少一个横向板连接的第一侧板和第二侧板; 第一侧板，第二侧板和至少一个横向板是印刷电路板; 第一侧板，第二侧板和至少一个横板中的至少一个分别形成并安装有导电迹线和至少一个部件，用于控制和监视无人驾驶飞行器; 第一和第二翼安装在机身上; 和尾部安装在机身上。

公开(公告)号：US20140240992A1

公开(公告)日：2014-08-28

申请号：US13778488

申请日：2013-02-27

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Tamás VÁSÁRHELYI ,  József FÜLÖP ,  Timea SESZTÁK ,  Zsolt BAGOLY ,  Jácint GERGELY

IPC: F21V23/00

CPC classification number: F21K9/90 ,  F21V23/004 ,  H01R12/515 ,  H05K1/00 ,  H05K1/117 ,  H05K2201/09027 ,  H05K2201/09163 ,  H05K2201/1059 ,  Y10T29/49117 ,  Y10T29/49155

Abstract: A lamp includes a collar with internal and outer surfaces, where two or more connection pins extend from the internal surface of the collar. At least two connection pins have a head portion distal from the collar internal surface. The head portions include a slot. The lamp includes a light source with at least two external lead-in wires. The lead-in wires are located within respective slots and are mechanically coupled to respective surfaces of the slots in a press-fit manner which may be free of wrapping, winding, twisting, or soldering. A PCB disposed inside the lamp has two opposing surfaces and a rim between the two opposing surfaces. There are conductive surfaces disposed on at least one of the rim and one of the opposing surfaces at positions corresponding to connection pin slots. The PCB is located between connection pins with the conductive surfaces in electrical communication with the lead-in wires.

Abstract translation: 灯包括具有内表面和外表面的套环，其中两个或多个连接销从套环的内表面延伸。 至少两个连接销具有远离套环内表面的头部。 头部包括槽。 该灯包括具有至少两个外部引入线的光源。 引入线位于相应的槽内，并且以压配合的方式机械地联接到槽的相应表面，压配合方式可以没有包裹，缠绕，扭转或焊接。 布置在灯内的PCB具有两个相对的表面和两个相对表面之间的边缘。 在对应于连接销槽的位置处，设置在轮辋和相对表面中的至少一个上的导电表面。 PCB位于连接引脚之间，导电表面与引入线电连通。

公开(公告)号：US20140233189A1

公开(公告)日：2014-08-21

申请号：US13868575

申请日：2013-04-23

Applicant: KING SHING INDUSTRIAL CO., LTD

Inventor： Chun-Chin SHIN

IPC: H05K1/02

CPC classification number: H05K1/02 ,  G06F1/20 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/202 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/10583

Abstract: A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.

Abstract translation: 电路板组件包括用作导电介质的金属板，封装有金属板的封装，并且在封装中设置有限定在孔中的孔，以允许将金属板延伸出用于电连接的封装以及牢固地安装在其上的电子部件 封装并电连接到金属板以形成闭环。

公开(公告)号：US20140204788A1

公开(公告)日：2014-07-24

申请号：US14223364

申请日：2014-03-24

Applicant: SENTINEL CONNECTOR SYSTEMS, INC.

Inventor： Brett D. ROBINSON

IPC: H04L1/24 ,  H04B17/00

CPC classification number: H04L1/24 ,  G01R1/0416 ,  H01R13/6469 ,  H01R13/6474 ,  H01R24/64 ,  H04B17/00 ,  H05K1/025 ,  H05K1/0268 ,  H05K1/0366 ,  H05K2201/09027 ,  H05K2201/10189

Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate, a plurality of end traces having a height and a width with each end trace extending from an end of a respective pin trace towards the edge of the substrate, a plurality of branch traces having a height and a width and each extending from a side of a respective pin trace, a plurality of traces extending from the end of a respective end trace, branch trace or pin trace to the edge of the substrate, where each end trace is adjacent to a respective branch trace, each end trace is adjacent to a respective branch trace on one side and a pin trace on the opposite side, and each pin trace is adjacent to another pin trace on one side.

Abstract translation: 一种测试单元，包括基板，位于基板中的多个通孔，具有高度和宽度的多个引脚迹线，并且各自从相应的通孔延伸到基板的边缘，多个端部迹线具有高度和 每个端部迹线的宽度从相应的引脚迹线的端部延伸到衬底的边缘;多个分支迹线，具有高度和宽度，并且各自从相应的引脚迹线的一侧延伸，多个迹线延伸 从相应末端迹线的末端，分支迹线或引脚迹线到基板的边缘，其中每个端部迹线与相应的分支迹线相邻，每个端部迹线与一侧上相应的分支迹线相邻，并且引脚迹线 在另一侧，每个引脚迹线与一侧的另一个引脚迹线相邻。