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公开(公告)号：US20180233841A1
公开(公告)日：2018-08-16
申请号：US15751018
申请日：2015-09-23
Applicant: Intel Corporation
Inventor： Kit Chew Chee , Ahmad Jalaluddin Yusof , Tin Poay Chuah
CPC classification number: H01R12/774 , H01R12/79 , H01R13/6275 , H01R2107/00 , H05K1/117 , H05K1/118 , H05K3/4697 , H05K2201/09127 , H05K2201/09163 , H05K2201/09481 , H05K2201/1034
Abstract: In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.
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92.发明申请公开(公告)号：US20180220526A1
公开(公告)日：2018-08-02
申请号：US15747820
申请日：2016-08-09
Applicant: Schweizer Electronic AG
Inventor： Thomas GOTTWALD , Christian RÖSSEL , Christian DOLD , Dirk GENNERMANN
CPC classification number: H05K1/0243 , H01Q9/0407 , H05K1/185 , H05K3/4617 , H05K3/462 , H05K3/4694 , H05K3/4697 , H05K2201/015 , H05K2201/09072 , H05K2201/09127 , H05K2201/10098 , H05K2201/10378 , H05K2201/10977 , H05K2203/063
Abstract: A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.
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公开(公告)号：US10004143B2
公开(公告)日：2018-06-19
申请号：US15252286
申请日：2016-08-31
Applicant: IBIDEN CO., LTD.
Inventor： Teruyuki Ishihara , Haiying Mei , Hiroyuki Ban
IPC: H05K1/03 , H05K1/18 , H01L23/538 , H01L21/48 , H01L21/683 , H05K3/46 , H01L23/13 , H01L23/498 , H05K3/00 , H05K3/20 , H01L23/31 , H01L25/10
CPC classification number: H05K1/183 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/13 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L25/105 , H01L2221/68345 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/1023 , H01L2225/1058 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/1533 , H05K3/0097 , H05K3/205 , H05K3/4682 , H05K3/4697 , H05K2201/09127 , H01L2924/00014
Abstract: A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface and that the first surface and the third surface are opposing each other. The second circuit substrate has a mounting area on the third surface and includes pads positioned to mount an electronic component in the mounting area and a connection wire structure connected to the pads, and the first circuit substrate includes through-hole conductors extending from the first surface to the second surface and connected to the pads through the connection wire structure and has an opening portion formed through the first circuit substrate such that the opening portion is exposing the pads formed in the mounting area.
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公开(公告)号：US20170330845A1
公开(公告)日：2017-11-16
申请号：US15663396
申请日：2017-07-28
Applicant: STORA ENSO OYJ
Inventor： Juha MAIJALA
IPC: H01L23/66 , H05K1/02 , B65D25/00 , H01L23/498 , H01L23/58 , H01L23/64 , A61J1/03 , H05K3/30 , H01L23/00 , H05K3/00 , H05K1/16 , H05K1/11
CPC classification number: H01L23/66 , A61J1/035 , A61J2200/30 , A61J2205/60 , B65D25/00 , B65D2203/10 , H01L23/4985 , H01L23/564 , H01L23/585 , H01L23/642 , H01L23/645 , H01L2924/0002 , H05K1/0216 , H05K1/0239 , H05K1/0275 , H05K1/028 , H05K1/0292 , H05K1/111 , H05K1/165 , H05K3/0052 , H05K3/301 , H05K3/303 , H05K3/305 , H05K2201/053 , H05K2201/056 , H05K2201/09045 , H05K2201/0909 , H05K2201/09127 , H05K2201/09254 , H05K2201/09263 , H05K2201/09954 , H05K2201/0999 , H05K2201/2036 , H05K2203/0195 , H05K2203/0228 , H01L2924/00
Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.
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95.发明授权公开(公告)号：US09820381B2
公开(公告)日：2017-11-14
申请号：US14654387
申请日：2013-12-20
Inventor： Vic Wang , Ethan Zhou , Laura Bai , Mikael Tuominen , Al Chen
CPC classification number: H05K1/111 , H05K1/183 , H05K3/0032 , H05K3/46 , H05K3/4697 , H05K2201/09127 , H05K2201/09227 , H05K2201/09781 , H05K2201/10734 , H05K2203/107
Abstract: In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, wherein the laser-stop device has at least one passage for passing-through the fan-out lines, the semi-finished product further comprises at least one cap layer applied to the conductive layer, the at least one cap layer having an opening in registration with each passage. The inventive method for producing a printed circuit board with at least one recessed component, is characterized by the steps of providing at least one conductive layer, structuring said conductive layer to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, leaving at least one passage in the laser-stop device for passing-through the fan-out lines, and applying a cap layer to said conductive layer, the cap layer having an opening in registration with each passage.
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Patent Agency Ranking
公开(公告)号：US09820375B2
公开(公告)日：2017-11-14
申请号：US15407273
申请日：2017-01-17
Applicant: GE Embedded Electronics Oy
Inventor： Antti Iihola , Tuomas Waris
CPC classification number: H05K1/028 , H01L21/568 , H01L24/18 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/18 , H01L2224/2919 , H01L2224/32245 , H01L2224/83005 , H01L2224/83192 , H01L2224/92144 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/181 , H05K1/115 , H05K1/182 , H05K1/188 , H05K1/189 , H05K3/4691 , H05K2201/0187 , H05K2201/0355 , H05K2201/09127 , H05K2203/308 , H01L2924/0665 , H01L2924/00
Abstract: Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.
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公开(公告)号：US09816691B2
公开(公告)日：2017-11-14
申请号：US15228924
申请日：2016-08-04
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
IPC: H01L25/075 , H01L33/64 , H05K1/02 , H05K1/03 , H05K1/14 , H05K1/18 , H05K3/00 , F21V19/00 , H01L33/08 , H01L33/48 , F21K9/90 , F21V5/00 , F21V5/04 , F21V23/00 , F21V29/70 , F21V9/16 , F21V21/14 , H01L33/58 , H05K3/46 , F21Y101/00 , F21Y105/10 , F21Y115/10
CPC classification number: F21V19/003 , F21K9/90 , F21V5/007 , F21V5/04 , F21V9/30 , F21V21/14 , F21V23/005 , F21V29/70 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/48 , H01L33/58 , H01L33/647 , H01L2924/0002 , H05K1/0204 , H05K1/0278 , H05K1/0283 , H05K1/0306 , H05K1/144 , H05K1/189 , H05K3/0061 , H05K3/0097 , H05K3/4626 , H05K3/4688 , H05K2201/042 , H05K2201/0909 , H05K2201/09127 , H05K2201/09263 , H05K2201/10106 , H05K2201/10121 , H05K2203/0143 , H05K2203/171 , H01L2924/00
Abstract: A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.
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公开(公告)号：US09773743B2
公开(公告)日：2017-09-26
申请号：US14430173
申请日：2013-09-23
Applicant: STORA ENSO OYJ
Inventor： Juha Maijala
IPC: H01L23/66 , A61J1/03 , B65D25/00 , H05K3/30 , H01L23/498 , H01L23/00 , H01L23/58 , H01L23/64 , H05K1/02 , H05K1/11 , H05K1/16 , H05K3/00
CPC classification number: H01L23/66 , A61J1/035 , A61J2200/30 , A61J2205/60 , B65D25/00 , B65D2203/10 , H01L23/4985 , H01L23/564 , H01L23/585 , H01L23/642 , H01L23/645 , H01L2924/0002 , H05K1/0216 , H05K1/0239 , H05K1/0275 , H05K1/028 , H05K1/0292 , H05K1/111 , H05K1/165 , H05K3/0052 , H05K3/301 , H05K3/303 , H05K3/305 , H05K2201/053 , H05K2201/056 , H05K2201/09045 , H05K2201/0909 , H05K2201/09127 , H05K2201/09254 , H05K2201/09263 , H05K2201/09954 , H05K2201/0999 , H05K2201/2036 , H05K2203/0195 , H05K2203/0228 , H01L2924/00
Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.
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公开(公告)号：US09769955B2
公开(公告)日：2017-09-19
申请号：US14395644
申请日：2013-04-26
Applicant: DAIKIN INDUSTRIES, LTD.
Inventor： Junichi Teraki , Akihiko Oguri
IPC: F25D23/12 , H05K7/20 , F24F1/24 , F25B31/00 , H01L23/473 , H05K1/02 , F25B13/00 , H05K3/22 , H05K3/30 , H05K3/34
CPC classification number: H05K7/2029 , F24F1/24 , F25B13/00 , F25B31/006 , F25B2313/0254 , F25B2700/21153 , H01L23/473 , H01L2924/0002 , H05K1/02 , H05K1/0203 , H05K1/0271 , H05K3/22 , H05K3/306 , H05K3/3468 , H05K7/20936 , H05K2201/09063 , H05K2201/09127 , H05K2201/10409 , H05K2203/044 , H01L2924/00
Abstract: A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.
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公开(公告)号：US09763337B2
公开(公告)日：2017-09-12
申请号：US14652416
申请日：2013-12-20
Inventor： Stefan Jäger , Markus Leitgeb , Thomas Judge
CPC classification number: H05K3/387 , H05K1/0298 , H05K1/034 , H05K1/0346 , H05K1/09 , H05K1/111 , H05K1/117 , H05K3/244 , H05K3/4611 , H05K3/4632 , H05K2201/015 , H05K2201/0154 , H05K2201/09127 , H05K2201/0919 , H05K2201/09845 , H05K2203/0228 , H05K2203/068
Abstract: A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the semi-finished product and being fully covered by at least one group of an insulating layer and a conductive layer. The inventive Method for producing a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector, where an outer conductive layer is surface treated, is characterized by the steps of providing a hard gold-plated edge connector on a group of an insulating layer and a conductive layer, covering the conductive layer and the hard gold-plated edge connector with at least one group of an insulating layer and a conductive layer, surface-treating an outer conductive layer to form connector pads for wire bonding of electronic components, cutting the insulating layers and the conductive layers down to the conductive layer forming the hard gold-plated edge connector, removing the insulating layers and conductive layers from the hard gold-plated edge connector. The inventive printed circuit board comprised of a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the printed circuit board, and the inner conductive layer forming the hard gold-plated edge connector protruding from the plurality of insulating layers and conductive layers.
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